@antonius123 bro long time no see, welcome back, If SMEE and CETC can able to deliver their EUVL by 2023, then by 2024 SMIC will be able to produced its 3nm chips, who can anyone predict that from a year ago ( 2019 and early 2020) where pessimism is abound after TSMC stop selling chips to Huawei and the sanctioning of the Chinese tech industry that this will happen. The momentum is surging with indigenous 28nm ,14nm and maybe 7nm line in the horizon, I'm optimistic to say by 2025 we maybe a generation behind the leaders (SMIC 3nm VS TSMC 2nm), now I have an inkling that TSMC 2nm maybe delayed due to cost with warning of a possible glut in the market for high spec chips. If all of this become possible then we had achieved parity.All is ready except for the opportunity!SMIC breaks through 3nm chip, only EUV lithography machine
full domestic line, including iDuv. According Havok, will be announced in Sep.
@antonius123 bro long time no see, welcome back, If SMEE and CETC can able to deliver their EUVL by 2023, then by 2024 SMIC will be able to produced its 3nm chips, who can anyone predict that from a year ago ( 2019 and early 2020) where pessimism is abound after TSMC stop selling chips to Huawei and the sanctioning of the Chinese tech industry that this will happen. The momentum is surging with indigenous 28nm ,14nm and maybe 7nm line in the horizon, I'm optimistic to say by 2025 we maybe a generation behind the leaders (SMIC 3nm VS TSMC 2nm), now I have an inkling that TSMC 2nm maybe delayed due to cost with warning of a possible glut in the market for high spec chips. If all of this become possible then we had achieved parity.
Chinese standards will become the new world standards as the West becomes locked out of world markets.As China seeks self-sufficiency in high-end microchip manufacturing, Dr. Bao believes it is vital that China does not diverge from global standards or develop chips that are incompatible with needs outside China. China must recognise that the global microchip industry follows clear technical standards which are intended to foster global collaboration.
China must continue to participate in global networks for innovation and collaboration for microchip development and must commit sufficient capital and technical resources to this activity, according to Dr. Bao. The current independent research and development within China must ensure it is fully aligned with global standards, market, and manufacturing patterns and must not result in the development of separate, incompatible systems.
Taking worldwide market share from Samsung would be nice.High-end SSDs: Chinese YMTC memory competes with industry giants
With the AN4, the Chinese manufacturer Asgard sells a high-end SSD that uses four PCI Express 4.0 lanes and is intended to compete with the fastest models from established manufacturers such as Samsung and Western Digital. The highlight: NAND flash modules from the Chinese manufacturer Yangtze Memory Technologies Co., Ltd. sit on the Asgard AN4. (YMTC).
A , the , shows that this YMTC memory doesn’t have to hide from the competition. One member put the 1 TB version of the Asgard AN4 against two Chinese models with memory from Micron and Kioxia (formerly Toshiba Memory).
TLC-NAND-Flash
All three SSDs use TLC chips that store three bits per cell (triple level cells). In the case of Micron, current modules with 176 storage layers are used, while the M.2 card with Kioxia storage uses the somewhat older BiCS 4 with 96 layers. The Asgard AN4 uses YMTC’s 128-layer memory, in which the manufacturer uses different technology than the competition: Instead of exposing the logic and all layers on a single silicon wafer, YMTC separates the logic and memory layers into two wafers, which are stacked on top of each other become.
The numbers are easy to compare because all three SSDs use the same InnoGrit IG5236 controller. Although Innogrit is headquartered in the USA, it also has roots in China. Only a few SSDs with controllers from the company are available in this country.
High speed
In the comparison test, the Asgard AN4 read with just under 7.5 GByte / s and, as advertised, wrote with up to 5.5 GByte / s. In the case of random access, the SSD achieved between almost 900,000 and 1.2 million IOPS. Sequentially, the model with Micron memory wrote a little faster, but did not achieve the values of the SSD with YMTC components in the case of random access. The Kioxia model was beaten because the maximum payload size (MPS) was halved.
In the comparison benchmark PCMark 10, which tests different scenarios, the Asgard AN4 achieved around 3600 points, which would be a lot even considering Samsung’s fast SSD 980 Pro and Western Digital’s SN850.
The bottom line is that the impression is that the comparatively young manufacturer YMTC can compete with international competitors. However, there remains the problem of production: According to rumors, the yield of functional semiconductor components at YMTC is below expectations. The parent company Tsinghua Unigroup is meanwhile bankrupt, so that restructuring is on the cards.