Chinese semiconductor industry

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gelgoog

Lieutenant General
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From a point of view of just the number of transistors in a chip, if you stack four wafers one on top of the other it has the same effect as halfing the nanometers in litography.
I don`t know about speed and power consumption, but considering the developments in XMC/YMTC and the other company, this is definitely the best way of going around Moore`s law.
I thought that piling wafers one on top of the other was just for DRAM memory, but this news seem to say it is going to be used in a greater variety of applications.

Stacking chips on top of each other might help in the short and medium term but it will be more expensive in the long run.
You will need more machine tools to make larger effective die area and heat dissipation is harder if you stack chips.
You will also need to spend more money on packaging. And get worse power consumption.
 

foofy

Junior Member
Registered Member
Stacking chips on top of each other might help in the short and medium term but it will be more expensive in the long run.
You will need more machine tools to make larger effective die area and heat dissipation is harder if you stack chips.
You will also need to spend more money on packaging. And get worse power consumption.
7nm is more expensive than 14nm.

Also the benefit of stacking is low power consumption.
 

hkbc

Junior Member
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I am constantly bemused by the reaction to China's semi-conductor efforts apropos the US ban, like some how the tech companies in China will all just curl up and die quietly in the corner instead of coming out swinging!

US ban on Chinese Satellite launches didn't stop China making and launching satellites!
US ban on the ISS hasn't stopped China getting access to a space station!

Ban this! ban that! maybe just another instance of 'to a hammer everything is a nail!'

I suppose they are expecting the beggar thy neighbour policies that makes for tent cities in Venice beach will happen in China too!
 

ansy1968

Brigadier
Registered Member
@Strangelove and @AETHER bro a follow up on your previous post with a more detailed report from ASIA TIMES highlighted below.


from onebyone (Pakistan Defense Forum)

Huawei’s HiSilicon moving into advanced 5G chip production
Digitimes report claims Huawei will build its first wafer fabrication facility in Wuhan with production starting in 2022

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According to media sources, Huawei will start manufacturing its own chipsets in 2022 at its HiSilicon Factory in Wuhan. Credit: Courtesy Huawei.



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Currently, Huawei’s Wuhan-based Research Institute has nearly 10,0000 research and development personnel that mainly researching and developing optical communication equipment, HiSilicon chips, and automotive laser radars. Credit: Handout.


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According to an industry insider who spoke to Asia Times, you don’t need to put a 5nm chip into a laptop because processing is moving back to the center with rapid emergence of 5G.

The key is fast communications, which means the Chromebook idea could dominate the market in the future.

“You can set up massive parallel processing arrays with 14-28 nm chips that are as fast as you want, and the laptop is simply a dumb terminal for this central processor,” the insider said.

“The importance of the superfast, narrow gateway chips is exaggerated. China can now or soon will be able to produce all the 14-28nm chips it needs — and that’s 98-99% of the total market.”
China’s 30-year-long semiconductor journey has grown into a major player, accounting for nearly 13% of the global IC design market in 2020.



asiatimes.com

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Digitimes reports that Huawei will build its first wafer fabrication manufacturing company in Wuhan, Hubei Province. According to the report, the company is expected to start production i…
asiatimes.com
asiatimes.com
 
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