Yes, i think a proper EUV will only come out in 2025.I assume it was this article?
Translation of article (paraphrased, obviously):
-----------------------------------------------------------------------------------------------------------------------------------------------------"Domestic deep ultraviolet immersion lithography (DUV) has been assembled and completed, left assembly line.
This lithography machine is 193nm ArF immersion deep UV lithography machine, which can be used for 28nm chip production. Multi-exposure can produce 14nm, 7nm, which can meet most of the chip manufacturing needs.
- Shanghai Microelectronics was responsible for overall integration [of components]
- The ultra-precision grating system comes from Shanghai Institute of Optical Precision Machinery, Chinese Academy of Sciences.
- The lithography objective lens set is from Beijing Guowang Optical
- The light source is from Keyi Hong Yuan
- The immersion system is from Zhejiang Qi'er Mechanical and Electrical
- The double workpiece table is from Huazhuo Precision Technology
The lithography machine is over hundred million [USD?], the prototype is ready to be put into mass-production. prototype is in a commercial state, will not be placed in the corner to eat dust.
Initial yield during the beginning testing stages is lower, about 30%. Time waits for no one, so production companies should be subsidized. Low yield rate can be improved in production. If production is established, improvement is not a problem.
Thus, the main equipment and materials used for 28nm chip production have been localized. Before the end of this year, all-domestic 28nm production lines could be realized, and testing/development of 14nm and 7nm production may be carried out next year.
Development of EUV and DUV technologies are being carried out simultaneously (the scenario of "progression from finishing DUV development to starting EUV development" is not the case as both are being developed simultaneously, not one at a time). The development of EUV lithography machine a military directive, and is expected to be off the assembly line by 2023, the progress is apparently greatly ahead of schedule. By 2025, 80% of the chip localization may be realized."
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It seems everything is on-track according to this article, and confirms the alleged initial testing yield rate of 30% for SMEE's 28nm DUV lithography machine. Some of the timelines for EUV and chip production localization may be a little too optimistic in my view (EUV development may finish by 2025 at the earliest, and 80% chip localisation might only happen by 2030). @WTAN what do you think?
However, the veracity of this information should be confirmed....Chinese private media outlets are not great at citing their sources and sometimes can get their information wrong. I do not know how credible this news is, but I will go ahead and trust it.
If something EUV related comes out in 2023 it will likely be a early model Production prototype similar to the first ASML EUVL NXE3100.
They will then build on this Production prototype and by adding more powerful Light Sources and making gradual improvements.
But of course who knows? The Harbin Inst 150W EUVL Light Source has been available for a number of years.
Forums are good sources of information but have to ensure that the Poster is related to a Research Institute or works for a Semiconductor Equipment Manufacturer.