Pretty sure YMTC and CXMT's needs are covered by AMEC and Naura at this point. They don't have much to worry about.
Chinese semiconductor industry
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The question I posted is which one is currently operational. Ansys listed the 4.
SMIC Beijing got delayed due to not able to procure equipments. SMIC Tianjin just initiated and still in building phase.
Shenzhen one already operational and Lingang shanghai about to start according to digitimes.
Which post previously spelled the oeprational status of the 4?
I have not read any news that the beijing one and tianjin one being operational end of 2023 or beginning of 2024.
I don't think i am wrong though.
For the ability to procure equipment, there isn't much differences in terms of de Americanized vs domestic. however, there is a difference in terms of who the end product can sell to legally.
There is no restrictiona to sell the products to US sanction firm on Dr Americanized line like Huawei.
I doubt if either Japan or Netherlands will criminalize companies selling products to Huawei produced by equipments from their countries
According hvpc，that is not the case. CXMT has to relax their "17nm" design to 18nm in order to keep access to US equipment
From what I know Bro, Beijing, Tianjin and partially Shenzhen will be using domestic equipment, while those from Shanghai (including the SN2 FAB) will exclusively using ASML for their advance processes.
Bona Semiconductor received tens of millions of yuan in Series A financing to accelerate the development of domestic advanced packaging equipment
According to news on January 3, Bona Semiconductor Equipment (Zhejiang) Co., Ltd. (hereinafter referred to as " Bona Semiconductor ") received tens of millions of yuan in Series A financing from Ningbo Zihe and Jiashan Jingkai Tongxin Venture Capital. The funds will be used In terms of production base construction, technical team building and improving the company management system.
Bona Semiconductor (BNSMEC) was established in March 2023. It is a wholly-owned subsidiary of Shanghai Bona Microelectronics Equipment Co., Ltd. It currently develops and produces core production equipment for the three major industries of advanced packaging, display, and semiconductor wafers . It is located in Zhejiang Jiashan County, Jiaxing City, the province has established a R&D, production and assembly base of over 6,000 square meters, which is jointly developed with partners in South China and shares the third manufacturing base.The company is based on three key technology platforms: semiconductor wafer precision equipment assembly technology, advanced packaging process technology, covering laser technology, cleaning, cutting, and measurement integrated complex. It is composed of many people with more than 16 years of experience in semiconductor integrated circuit manufacturing, 2.5D/3D It has successfully developed supporting equipment for advanced processes such as FAN-OUT, 1GBT, HDFO, etc., and has successfully entered the supplier list of many industry leading companies.Liu Liang, founder and CEO of Bona Semiconductor, said that the temporary bonding and debonding process used to use Japanese equipment, but Japanese manufacturers often have unequal treaties, such as needing to use their designated materials, paying for many additional categories, etc. , and the delivery cycle and price are also longer. Compared with domestic equipment, the advantages are immediately obvious.According to reports, Bona Semiconductor has currently launched three types of equipment, including temporary bonding, temporary debonding equipment, and temporary debonding and cleaning all-in-one machines. The company has built a complete proofing test line to provide customers with integrated and complete process section services. . Compared with foreign equipment, the cost of Bona Semiconductor products is about half of the same foreign products. Moreover, more than 85% of the components of these machines are independently developed by the company, making them more independent and controllable, and can also meet the specific needs of downstream customers. At present, Bona Semiconductor's commercialization is progressing rapidly. It has delivered several complete machines to Changdian Technology, a leading domestic advanced packaging company, and related companies, and achieved mass production.
Dylan Patel says that CXMT will have 7 billion dollars of equipment spending in 2024, with 3.8 billion of that going to American tool firms including $1.8 billion goes to AMAT.
He also expect CXMT HBM 3E for AI to ship in mid-2025
Memory is one the most important scaling vectors for achieving civilization redefining AI technologies, and China is investing heavily in leapfrogging the rest of the world with these technologies and has already started implementing LLMs for propaganda / electoral subversion as well as within the PLA.
Much like with how as Gina Raimondo, was in China, CXMT also by candidly announcing their violation U.S. export controls at IEDM in San Francisco. CXMT presented their Gate-All-Around Vertical Transistors manufactured at the 18nm half pitch.
CXMT vertical channel transistors at 18nm pitch, below export control limits
CXMT violated two different portions of the US export controls. US tools can not be shipped to firms that fabricate 18nm half pitch DRAM devices. US tools cannot be shipped to firms that fabricate gate all around transistors. CXMT has done both of these simultaneously in a functional device. With the way the law is written, American tool makers such as Applied Materials, Lam Research, KLA, and Onto can now no longer ship tools to the facility at which CXMT fabricated these devices. While the device above is production for research purposes with mass volume coming later, the regulations do not discount it. CXMT only has 1 fab site currently.
Our wafer fabrication equipment model and supply chain sources point to CXMT having 7 billion dollars of equipment spending for DRAM production next year, with 3.8 billion of that going to American tool firms and Applied Materials as the largest contributor at $1.8 billion of shipments to CXMT in 2024. This spend is higher than Micron for DRAM because of the recent $5B injection into CXMT’s government backed joint venture, Changxin Xinqiao, from federal and local governments.
While CXMT is still a few years behind on process technology for high volume production DRAM, they are . We also expect their HBM 3E for AI to ship in mid-2025.
Enforcement of these rulings , but with the way the regulations are currently written, CXMT has said that all US tool firms are in violation by continuing to ship to CXMT. This is why it is surprising that they admitted to doing so in public. To be clear, it is not shocking that they were able to exceed the limits. We even called out CXMT specifically in our piece on the .
He also expect CXMT HBM 3E for AI to ship in mid-2025
CXMT 3D DRAM Blatant Sanctions Violation
Memory is one the most important scaling vectors for achieving civilization redefining AI technologies, and China is investing heavily in leapfrogging the rest of the world with these technologies and has already started implementing LLMs for propaganda / electoral subversion as well as within the PLA.
Much like with how as Gina Raimondo, was in China, CXMT also by candidly announcing their violation U.S. export controls at IEDM in San Francisco. CXMT presented their Gate-All-Around Vertical Transistors manufactured at the 18nm half pitch.
CXMT vertical channel transistors at 18nm pitch, below export control limits
CXMT violated two different portions of the US export controls. US tools can not be shipped to firms that fabricate 18nm half pitch DRAM devices. US tools cannot be shipped to firms that fabricate gate all around transistors. CXMT has done both of these simultaneously in a functional device. With the way the law is written, American tool makers such as Applied Materials, Lam Research, KLA, and Onto can now no longer ship tools to the facility at which CXMT fabricated these devices. While the device above is production for research purposes with mass volume coming later, the regulations do not discount it. CXMT only has 1 fab site currently.
Our wafer fabrication equipment model and supply chain sources point to CXMT having 7 billion dollars of equipment spending for DRAM production next year, with 3.8 billion of that going to American tool firms and Applied Materials as the largest contributor at $1.8 billion of shipments to CXMT in 2024. This spend is higher than Micron for DRAM because of the recent $5B injection into CXMT’s government backed joint venture, Changxin Xinqiao, from federal and local governments.
While CXMT is still a few years behind on process technology for high volume production DRAM, they are . We also expect their HBM 3E for AI to ship in mid-2025.
Enforcement of these rulings , but with the way the regulations are currently written, CXMT has said that all US tool firms are in violation by continuing to ship to CXMT. This is why it is surprising that they admitted to doing so in public. To be clear, it is not shocking that they were able to exceed the limits. We even called out CXMT specifically in our piece on the .
Mate 60 Pro+ uses CETC satellite baseband processor
Internally the Mate 60 Pro+ is almost identical to the Pro variant, both utilizing HiSilicon’s Kirin 9000S processor with memory supplied by SK Hynix. Almost all the internal components, including the main board and other substrates are shared between these two phones. Also similar are the cameras, but while having the same functional set, the sensors used in both devices differ.
The only major difference between these two phones is the Satellite Board using a different Satellite Baseband Processor, manufactured probably by China Electronics Technology Group Corporation (CETC).
Also noteworthy is the fact, that Huawei managed to source almost all RF components locally in China, mostly from unidentifiable manufacturers, with strict trade restrictions in place.
It is the first time TechInsights has found: Satellite Baseband Processor CETC #MSC06A, LB Front-End Module ? #S111241C, MB/HB Front-End Module ? #S111131C, 5G Front-End Module ? #S111341A.
The Mate 60 Pro+ is the latest top of the line flagship smartphone from Huawei, launched alongside the Mate 60 and Mate 60 Pro. The Pro models are very similar to each other, sharing a lot of internal and external components.
Phones from the Mate 60 line-up are the first 5G enabled mobile devices from Huawei since strict trade restrictions were imposed on the Chinese manufacturer.
Internally the Mate 60 Pro+ is almost identical to the Pro variant, both utilizing HiSilicon’s Kirin 9000S processor with memory supplied by SK Hynix. Almost all the internal components, including the main board and other substrates are shared between these two phones. Also similar are the cameras, but while having the same functional set, the sensors used in both devices differ.
The only major difference between these two phones is the Satellite Board using a different Satellite Baseband Processor, manufactured probably by China Electronics Technology Group Corporation (CETC).
Also noteworthy is the fact, that Huawei managed to source almost all RF components locally in China, mostly from unidentifiable manufacturers, with strict trade restrictions in place.
It is the first time TechInsights has found: Satellite Baseband Processor CETC #MSC06A, LB Front-End Module ? #S111241C, MB/HB Front-End Module ? #S111131C, 5G Front-End Module ? #S111341A.
The Mate 60 Pro+ is the latest top of the line flagship smartphone from Huawei, launched alongside the Mate 60 and Mate 60 Pro. The Pro models are very similar to each other, sharing a lot of internal and external components.
Phones from the Mate 60 line-up are the first 5G enabled mobile devices from Huawei since strict trade restrictions were imposed on the Chinese manufacturer.
It's a bold or maybe even a reckless move by CXMT to buy $3.8 billion of US equipment in 2024. US firms can leave abruptly even during installation and shut off spare parts and service at any moment. Of course they know what they are doing better than us in this forum...but to me this move is hugely risky.
OTH this data point has no official source, it is just what Patel "knows", but that's it. It's up to us to believe it or not, for my part I'm quite doubtful about this.
Tecno Phantom V Flip phone uses Lansus 5G RF chips
The Tecno Phantom V Flip AD11 is the first flip version of smartphone from Tecno. It was released on September 24, 2023. The mobile runs on HIOS 13.5 (Based on Android 13). This model (AD11) was made for all regions.
The Hinge Assembly for the Tecno Phantom V Flip weighs 23.89 grams which is more than the 14.83 grams in the Samsung Galaxy Z Flip5. Some of that weight goes from hinge cover, that could be removed in Samsung’s hinge design and used as a part of the construction in Phantom V Flip. The dimensions of the hinge in Tecno smartphone are 71.15/30.22/4.75 mm in comparison with the Flip5’s hinge, that are 69.64/24.53/4.3 mm.
The main constrictive difference between the Main Displays of Samsung Galaxy Z Flip5 and Tecno Phantom V Flip is Stifening Rib that were used in Samsung’s Flip5 phone. That also affects the weight and thickness of the display. The technology of the Panel is the same AMOLED -Y-OCTA. The display of the Tecno smartphone has one billion colors and in the Flip5 is 16 million on the same resolution of 2640×1080 pixels.
Power Management (MT6360PP, MT6315GP, MT6315RP, MT6315BP) and Power Management and Audio CODEC (MT63359VPP) used in most phones in this price category, was based on Mediatek’s chipset. ICs from Lansus are the most used RF chips in the smartphone (five ICs). The new RF chips of note are: 5G NR n77 RxD Front-End Module (FX6730), Multimode, Multiband Power Amplifier Module (NZ5627N) and Quad-Band GSM/EDGE Front End Module (FX5820C).
The Tecno Phantom V Flip AD11 is the first flip version of smartphone from Tecno. It was released on September 24, 2023. The mobile runs on HIOS 13.5 (Based on Android 13). This model (AD11) was made for all regions.
The Hinge Assembly for the Tecno Phantom V Flip weighs 23.89 grams which is more than the 14.83 grams in the Samsung Galaxy Z Flip5. Some of that weight goes from hinge cover, that could be removed in Samsung’s hinge design and used as a part of the construction in Phantom V Flip. The dimensions of the hinge in Tecno smartphone are 71.15/30.22/4.75 mm in comparison with the Flip5’s hinge, that are 69.64/24.53/4.3 mm.
The main constrictive difference between the Main Displays of Samsung Galaxy Z Flip5 and Tecno Phantom V Flip is Stifening Rib that were used in Samsung’s Flip5 phone. That also affects the weight and thickness of the display. The technology of the Panel is the same AMOLED -Y-OCTA. The display of the Tecno smartphone has one billion colors and in the Flip5 is 16 million on the same resolution of 2640×1080 pixels.
Power Management (MT6360PP, MT6315GP, MT6315RP, MT6315BP) and Power Management and Audio CODEC (MT63359VPP) used in most phones in this price category, was based on Mediatek’s chipset. ICs from Lansus are the most used RF chips in the smartphone (five ICs). The new RF chips of note are: 5G NR n77 RxD Front-End Module (FX6730), Multimode, Multiband Power Amplifier Module (NZ5627N) and Quad-Band GSM/EDGE Front End Module (FX5820C).
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