Chinese semiconductor industry
- Thread starter Hendrik_2000
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hmm, not just Nio, but all the Chinese EV makers are doing so. And they all say 1000 TOPS is no problem.
However, NIO, being what it is, decided to go with a 5nm process that currently cannot be handled by SMIC. So if US govt wants to cut them off (for not buying Nvidia chips and for making AI inference chip that's too powerful), they can easily do so.
Nio bought intelligent suspension system from an American company as well. Don’t think they worry about sanctions at all.
I think you've got the small core and mid-core mixed up.
Take a second look at the screen shot, it lists:
| K9000SL | K9000S | |
| Large core | 2 x 2350MHz. Likely SMT. | 2 x 2620MHz. SMT. |
| Mid core | 4 x 2150MHz. Likely SMT. | 6 x 2150MHz. SMT. |
| Small core | 3 x 1530MHz. No SMT. | 4 x 1530MHz. No SMT. |
| Total | 6 SMT cores + 3 non-SMT = 6-core processor, 9 threads. | 8 SMT cores + 4 non-SMT = 8-core processor, 12 threads. |
Based on my understanding, the main difference with K9000S is that(1) the big core frequency is lower, (2) one mid-core was cut, (3) one small-core was cut.
Did you look at the picture in the X/Twitter post? It has four small cores.
you are wrong. Please look over the post again. The only differences are what @gelgoog pointed out
What I see in the Twitter picture is the K9000SL has three cores with a frequency of 1530MHz
Jinghe Integrated disclosed the patent of photoresist conveying device to prevent photoresist from crystallizing due to slow flow rate.
According to the announcement of the State Intellectual Property Office, Hefei Jinghe Integrated Circuit Co., Ltd. has disclosed a patent called "A photoresist conveying device", the authorization announcement number is CN220215547U, and the application date is June 2023. .
The patent abstract shows that the utility model provides a photoresist conveying device, which includes a first container, a second container, a first pipeline, a second pipeline and a third pipeline; the first container is used to store photoresist; The first pipeline is used to transport gas into the first container, the output port of the first pipeline is connected to the first container, and the output port of the first pipeline is located close to the top of the first container; the input port of the second pipeline Connected to the first container, the output port of the second pipeline is connected to the second container, and the input port of the second pipeline is located close to the bottom of the first container; the input port of the third pipeline is connected to the glue outlet of the second container Connected to output the photoresist transported into the second container, and the glue outlet is provided at the bottom of the second container. The photoresist transport device uses a pneumatic structure to transport the photoresist to prevent the photoresist from crystallizing due to slow flow rate, and uses the second container as a buffer container to avoid the waste of photoresist during the replacement of the photoresist container.
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