Hi there,
Welcome to this thread. As a just hatched member, please be light on the posting and more on the reading side of things. We try to keep our discussions a little higher on this thread to keep quality good.
Thank you
Chinese semiconductor industry
- Thread starter Hendrik_2000
- Start date
- Status
Welcome to this thread. As a just hatched member, please be light on the posting and more on the reading side of things. We try to keep our discussions a little higher on this thread to keep quality good.
Thank you
Xinchi Technology and Mingran Technology have reached a strategic cooperation to jointly promote the research and development and mass production of products in the automotive chassis field.
Xinchi Technology and Mingran Technology signed a strategic cooperation agreement. Based on Xinchi's high-performance, high-reliability automotive chip products, the two parties will continue to promote the research, development, innovation and mass production of products in the automotive chassis, body and power fields. application.
Zhang Qiang (left), chairman of Xinchi Technology, and Fang Yong (right), CEO and general manager of Mingran Technology, signed a strategic cooperation agreement
Previously, Mingran Suspension Controller (CDC) equipped with Xinchi's high-performance MCU has been rolled out in batches and has been officially mass-produced on Chery Tiggo 9, Xingtu Yaoguang and other models. Next, both parties will continue to promote the mass production application of this product on more models.
Mingran CDC is the first application of Xinchi products in active suspension. Xinchi MCU has become the first car-standard control chip used in active suspension in China, taking the lead in realizing high-performance and high-reliability car-standard MCU in this field. Large-scale mass production in the field.
Fang Yong, CEO and General Manager of Mingran Technology, said: "As a leading automotive chip company in China, Xinchi Technology fully meets Mingran's requirements in terms of product performance, reliability and mass production experience to build the industry's first-class chassis, body, and power domains. based on the foundation laid by our previous cooperation, we will promote more comprehensive product research and development and mass production applications on more models."
Zhang Qiang, chairman of Xinchi Technology, said: "Xinchi and Mingran have accumulated valuable cooperation experience in the mass production application of suspension controllers. Both parties adhere to the same development philosophy for creating innovative products with high performance and high reliability. In the future, we will join forces to provide first-class products and solutions for the Chinese automobile industry."
Wuhan Xinxin, subsidiary of YMTC.
Yangtze Memory disclosed the full text of the patent for "DRAM storage device with XTACKING architecture". Domestic 3D stacked HBM high-bandwidth memory may be available in the near future.
具有XTACKING架构的DRAM存储器件
专利类型： 发明授权
申请(专利)号： CN202110734431.0申请日： 2020-02-20
授权公告号： CN113451314B授权公告日： 2023-10-31
多次公布： CN113451314A
申请人： 长江存储科技有限责任公司
地址： 430074 湖北省武汉市东湖新技术开发区未来三路88号
发明人： 刘磊;王迪;周文犀;夏志良
专辑： 工程科技Ⅱ辑
专题： 工业通用技术及设备
主分类号： H10B12/00
分类号： H10B12/00;H01L21/18
国省代码： 42
页数： 32
代理机构： 北京永新同创知识产权代理有限公司代理人： 刘柳;杨锡劢
分案原申请号： 202080000434.5 2020.02.20
from @PopularScience ...
HBM and 3d DRAM are different things.
HBM is taking multiple monolithic DRAM chips and place them on top of each other
3D DRAM is actually increasing the bit density of DRAM chip itself.
You can theoretically package HBM of 3D DRAMs
hvpc pointed out a while back that YMTC is working on 3D DRAM
3D DRAM imo should be more complicated than HBM
really nice article here on Journey 6
to point out why J6 is the best ADAS chips when it comes out
50k+ DMIPS w/ 14 A78 cores, huge Cache, 6 wide IPC, ASIL-D grade (Orin just 200k)
MCU segregated & has 9.8K DMIPS ASIL-D+6.5K DMIPS ASIL-B (4.5x current hi-end MCU)
ISP does 5.3 Gpps (3x competitor), supports 18MP camera & 80% lower latency
SoC design also industry leading TB-class wide band (2x competitor) Full ASIL-D compliant 130ns latency, 40% lower than competitor
but of course, the Huawei fanboys on Chinese social media now claims J6 is just behind Huawei ADAS chips
No, J6 is ahead of MDC610. Huawei will surely come out with its own improvement in the future, but J6 came later, so it's only naturally it is the best AI inference chip for this purpose
to point out why J6 is the best ADAS chips when it comes out
50k+ DMIPS w/ 14 A78 cores, huge Cache, 6 wide IPC, ASIL-D grade (Orin just 200k)
MCU segregated & has 9.8K DMIPS ASIL-D+6.5K DMIPS ASIL-B (4.5x current hi-end MCU)
ISP does 5.3 Gpps (3x competitor), supports 18MP camera & 80% lower latency
SoC design also industry leading TB-class wide band (2x competitor) Full ASIL-D compliant 130ns latency, 40% lower than competitor
but of course, the Huawei fanboys on Chinese social media now claims J6 is just behind Huawei ADAS chips
No, J6 is ahead of MDC610. Huawei will surely come out with its own improvement in the future, but J6 came later, so it's only naturally it is the best AI inference chip for this purpose
Pure Technology(PNC Systems): All 28nm process segments have been verified and there are repeat orders.
Pure Technology (603690.SH) stated on the investor interactive platform on November 27 that the company’s semiconductor wet-process equipment focuses on the front-end process of wafer manufacturing. It has passed verification and has repeated orders in all 28nm process sections. Currently, domestic Our front-line customers are all our customers, including major companies from SMIC, Huahong Huali, and Huawei.
Wuxi DIS completed 520 million Series B financing and increased its investment in high-end mask projects.
Wuxi Disi Microelectronics Co., Ltd. (hereinafter referred to as "Wuxi Disi"), a leading domestic enterprise in the field of semiconductor photomasks, recently completed a Series B equity financing of 520 million yuan, invested by CICC Capital and CITIC Securities. , Hengchuang Investment and other institutions jointly participated. This round of financing will be used for the construction of 28nm production capacity of Wuxi DIS high-end mask project.
It is reported that the Wuxi DIS high-end mask project will start construction at the end of 2022, and the equipment is expected to move in at the end of 2023. The production line will be installed, debugged and connected in the first half of 2024. By then, Wuxi DIS will have 90~28nm mask manufacturing capabilities. The technical process has been improved by leaps and bounds. After all high-end mask projects reach production, the monthly production capacity of photomasks will reach 5,000 pieces and the annual production capacity will be 60,000 pieces.
According to data, Wuxi DIS is the earliest open mask foundry company engaged in photomask manufacturing in China. It has diversified mask manufacturing processes and R&D capabilities. It has been deeply involved in the photomask field for 34 years, and its customers cover 12 mainstream domestic companies. 8-inch and 6-inch lines, it is the preferred partner of many fabs and design companies.
They can only achieve 3Ghz because that is the absolute highest clock speed you can set it to in the BIOS. I'm sure you can push it to go even faster if that limit was removed.
- Status