Chinese semiconductor industry

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curiouscat

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Hiksemi launched a new 2 TB M.2 2230 quietly last week, the DK4000. It uses YMTC’s best available 232 layer TLC and is the first 2230 SSD to max out the PCIE 4 bus. It does it without DRAM too. Super impressive.

In overseas markets it’s branded as the Hiksemi Future Eco 2230. Hiksemi tells me it will launch internationally within two weeks. Should be amazing for laptop owners and Steam Deck owners.
 

luminary

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According to Dylan Patel,the newest Nvidia GPU that is tailored for China,is actually more powerful than H100 in LLM inference.

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View attachment 121173
Also some speculation in the article:
It is possible that Nvidia is simply dramatically lowering clocks in addition to some hardware cut downs. For example Nvidia could have kneecapped the shunt resistors and thus TDP and TFLOPS. A competent soldering technician could re-enable performance.

On the other hand, physical silicon cut downs would be difficult to get around. Reversing underclocking may be much easier. The fact this chip supports 7 MIG points to 7 GPC being active, so we think the chip is mostly underclocked.
Do we have any evidence this could be happening...?
 

antiterror13

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Hiksemi launched a new 2 TB M.2 2230 quietly last week, the DK4000. It uses YMTC’s best available 232 layer TLC and is the first 2230 SSD to max out the PCIE 4 bus. It does it without DRAM too. Super impressive.

In overseas markets it’s branded as the Hiksemi Future Eco 2230. Hiksemi tells me it will launch internationally within two weeks. Should be amazing for laptop owners and Steam Deck owners.

SSD performance with DRAM is much better than without it .. wondering why DK4000 chose without DRAM, I don't think 1-2GB RAM would make a meaningful difference in price
 

curiouscat

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SSD performance with DRAM is much better than without it .. wondering why DK4000 chose without DRAM, I don't think 1-2GB RAM would make a meaningful difference in price
The SSD is targeted at laptops and handhelds and many of those devices only take single sided SSDs. DRAM usually causes the device to be dual sided. DRAM also significantly pushes up power consumption since the SSD now has to transfer the data to DRAM then transfer to NAND instead of to NAND directly.
 

Jamie28

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The SSD is targeted at laptops and handhelds and many of those devices only take single sided SSDs. DRAM usually causes the device to be dual sided. DRAM also significantly pushes up power consumption since the SSD now has to transfer the data to DRAM then transfer to NAND instead of to NAND directly.
It's not that you transfer the data directly to the NAND, the dramless ssds use the system memory as cache.
 

tphuang

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interesting comment here on iRobot market in China. Shows here usage of GigaDevice's GD32F103VxT6 MCU by Xiaomi's iRobot series

also has a version that uses Hangshun's HK32F103VET6 MCU

Good to see Xiaomi use domestic MCUs

Still a market dominated by Western companies. Domestic chipmakers need to increase their share, but we need to see fabs increase manufacturing of advanced MCUs also
 

tphuang

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growth of Omnivision in Chinese phones

豪威主摄已经打入小米、荣耀、华为三家的高端旗舰产品线,小米14系列、荣耀Magic6系列、华为P70系列等
荣耀首发OV50K主摄。

For P70, if Huawei switches SSD to YMTC & CIS to Omnivision, then that 36% value being Korean should drop to like 15%
 

tokenanalyst

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The Ministry of Industry and Information Technology publicly solicits opinions on industry standards such as dry etching equipment testing methods​


According to the website of the Ministry of Industry and Information Technology on November 16, the Ministry of Industry and Information Technology has publicly solicited opinions on 196 industry standards including the "Dry Etching Equipment Test Method for Semiconductor Equipment Integrated Circuit Manufacturing", 1 foreign language version of an industry standard, and 38 recommended national standard plan projects. .

According to the overall arrangement of standardization work, the Ministry of Industry and Information Technology will now apply for 196 industry standards such as "Test Methods for Dry Etching Equipment for Semiconductor Equipment Integrated Circuit Manufacturing", 1 industry standard foreign language version project such as "Snow Lotus Care Sticker" and " Environmental 38 recommended national standard plan projects including "Pollution Prevention and Control Equipment Terminology" will be announced with a deadline of December 16, 2023.

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Among them, regarding the "Test Methods for Dry Etching Equipment for Semiconductor Equipment Integrated Circuit Manufacturing", the main drafting units include the 48th Research Institute of China Electronics Technology Group Corporation , China Electronics Technology Standardization Institute, Hunan Chuwei Semiconductor Technology Co., Ltd., Semiconductor Manufacturing International Corporation, Beijing North Huachuang Microelectronics Equipment Co., Ltd., China Microelectronics Semiconductor Equipment (Shanghai) Co., Ltd., Hefei Jinghe Integrated Circuit Co., Ltd., etc.
 
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