Tianxin Micro(ASEL): Based on technological independence and forward research and development, it provides highly competitive high-end semiconductor epitaxial equipment
Tianxin Micro was established in August 2019. It is a high-end equipment manufacturer and solution provider in the semiconductor field. It is committed to the R&D and manufacturing of key process equipment for the semiconductor front-end and provides highly competitive high-end equipment and solutions for the integrated circuit industry. High quality service.
At the beginning of its establishment, the company focused on epitaxial process equipment, which was difficult to develop and had high monomer value, and established an authoritative and experienced R&D team. It is reported that Tianxin Micro’s core team comes from well-known semiconductor equipment companies in the industry. They have more than 30 years of experience in product development and market launch. They have led the research and development and verification of a variety of front-end process equipment. In addition, more than 50% of the company’s employees have master’s degrees, PhD degree, and applied for more than 100 patents.
Since its establishment, Tianxin Micro has invested hundreds of millions of yuan in R&D. Its products are based on independent research and development and have complete intellectual property rights. The first product is front-end epitaxial equipment in IC manufacturing. It is widely used in power devices, advanced process logic chip foundry, 3D NAND storage products, MEMS and epitaxial wafer production and manufacturing. The performance of the products has reached the international advanced level, and some of them have reached the international advanced level. The core performance exceeds that of similar international products and is recognized by customers.
Among them, Tianxin Micro Epi RP 300 Compass HP is a decompression epitaxial equipment targeting advanced logic foundry and storage, as well as epitaxial process application requirements in power devices. It has advanced infrared heating control technology and heating module design, which can achieve The rapid rise and fall of temperature and precise control of the temperature field enable the system to have excellent process repeatability and equipment stability, thereby achieving good thickness uniformity, resistivity uniformity, zero slip lines and low defect density epitaxial layer growth. It can meet the requirements of process uniformity control, low crystal defects, low doping and strong controllability of particle density.
In August 2022, Tianxin Micro's first advanced process silicon-based epitaxial decompression equipment Epi RP 300 Compass HP was successfully launched and entered the leading domestic wafer foundry. This also marked the company's official transformation from productization to industrial application. In October 2023, Tianxin Micro reached a strategic partnership with Jinghe Integration, the third largest foundry company in China, to further promote cooperation in high-end front-end equipment and processes such as epitaxy.
Independent product innovation is the purpose of Tianxin Micro's development. In the future, the company will maintain a high level of R&D investment, attract global professional talents, accelerate the localization and industrial application of high-end semiconductor equipment, and provide customers with market competitive products and services. Collaborate with the innovative development of China’s semiconductor industry.
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