Chinese semiconductor industry

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tokenanalyst

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Shenzhen Keda Semiconductor proposed diversified optimal cost solutions for testing and sorting.​


Shenkoda Semiconductor is committed to providing customers with leading solutions for semiconductor testing and sorting. Mr. Lin Guangman, General Manager of Shenzhen Keda Semiconductor, delivered a wonderful speech titled "Diversified Optimal Cost Solutions for Automotive Electronics Testing and Sorting Machines" at the 21st China Semiconductor Packaging and Testing Technology and Market Annual Conference. This is the first time Mr. Lin has publicly proposed a diversified testing and sorting solution for automotive electronics to the industry. This solution is expected to reduce equipment investment costs and significantly improve production efficiency.

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tphuang

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european_guy said:
This seems confirmed also here

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If we assume, as is reasonably to do, that such a big sum will be invested into capacity expansion, this means that CXMT sees a clear path for the near future.

IOW, if these 2B$ will be used for capacity expansion, it means CXMT has overcome technical limits due to US export restrictions and inclusion in entity list and they are confident they can expand capacity fully relying on domestic equipment.
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Based on what hvpc said, they did tweak their D1x process to work with US guidelines, so they can technically continue to expand without domestic equipment being available.

Although, I would agree with you that given the risk from that, they are likely only going forward with expansion plans if they are seeing good results from validation of AMEC tools (full coverage now IIRC)
escobar said:
Huawei has set its smartphone production target for next year at 100 million units. The strong sales performance of the recently released flagship smartphone Mate 60 series is said to be the reason behind Huawei's aggressive business plan for the coming year. This year, 40 to 50 million units are expected to be shipped... a 30 to 70 percent increase compared to the previous year.
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While I would like this to happen, it remains to be seen if domestic supply chain can keep up

Obviously K9000S is a major one, but also DRAMs (where are they sourcing this from?), RF modules (enough BAW???) & CMOS (Omnivision struggling with Xiaomi demand). Domestic supply chain will take time to catch up in capacity
 
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gelgoog

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tphuang said:
While I would like this to happen, it remains to be seen if domestic supply chain can keep up
Obviously K9000S is a major one, but also DRAMs (where are they sourcing this from?), RF modules (enough BAW???) & CMOS (Omnivision struggling with Xiaomi demand). Domestic supply chain will take time to catch up in capacity
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My guess is that Huawei is assuming they will be able to continue importing Qualcomm SoCs next year to get to that 100 million smartphones target. Part of it would be the Kirin 9000 (maybe 60 million phones), and part of it would be Qualcomm 4G SoCs (maybe 40 million phones).

As for DRAM I kind of doubt that would be an issue. It is basically an open market, they don't need to buy direct from the manufacturer, and they could also source LPDDR4x chips from CXMT if it came to it. Most of these smartphone SoCs can use either LPDDR4 or LPDDR5 being compatible with both.
 
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NexChip signed partnership with BOE Varitronix with regard to producing auto chips. didn't realize they are designing driver chips for their screens, but looks like that's the case

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Makes sense with Nexchip's 3rd phase and push for auto chip to support Hefei's auto industry
 
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I was looking up info on Lens Tech (瓴芯) since they supply certain analog chips for BYD Seal and found a bunch of domestic options for heat management chips including by Novosense, Silergy & Fortior tech. Look like Silergy is pretty big and just more recently got into auto chips.

I do find it interesting that something simple like smart switch for LED lights, display or camera is complicated enough that it takes a long time for Lens Tech to develop that passes the auto grade certification
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FairAndUnbiased

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tphuang said:
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report here of Xiaomi S3 watch using Unisoc's W117 SoC (on 22nm process) achieving eSIM support

Does HLMC fab Unisoc 22nm chips or is this someone else?
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Interesting. I think that smartwatch might be a good place for more domestic options, as the screens driven have a much lower resolution and don't need extensive, fast graphics rendering.
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I was looking up info on Lens Tech (瓴芯) since they supply certain analog chips for BYD Seal and found a bunch of domestic options for heat management chips including by Novosense, Silergy & Fortior tech. Look like Silergy is pretty big and just more recently got into auto chips.

I do find it interesting that something simple like smart switch for LED lights, display or camera is complicated enough that it takes a long time for Lens Tech to develop that passes the auto grade certification
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Auto chip modules must pass stringent environmental resistance tests such as temperature, humidity, vibration, etc with 0 defects. Yes, 0 ppb defects (compare with Six Sigma standards at ~3 ppm defects). And they have to commit to 30 years of supply.
 
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FairAndUnbiased said:
Interesting. I think that smartwatch might be a good place for more domestic options, as the screens driven have a much lower resolution and don't need extensive, fast graphics rendering.

Auto chip modules must pass stringent environmental resistance tests such as temperature, humidity, vibration, etc with 0 defects. Yes, 0 ppb defects (compare with Six Sigma standards at ~3 ppm defects). And they have to commit to 30 years of supply.
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I was reading about that and just the amount and cost of developing & certifying new auto chip that have high complexity. Huge barrier for new entrants.

Anyways, good news for Chinese supply chain is that xiaomi 14 is doing really well and it uses at least Chinese OLED and CMOS sensors and probably rf products and such. I will have to look through it's entire supply chain at some point.

Probably not as domesticated as Huawei but likely still improving

https://twitter.com/i/web/status/1719416065183150325
 
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tokenanalyst

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tphuang said:
Based on what hvpc said, they did tweak their D1x process to work with US guidelines, so they can technically continue to expand without domestic equipment being available.

Although, I would agree with you that given the risk from that, they are likely only going forward with expansion plans if they are seeing good results from validation of AMEC tools (full coverage now IIRC)
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Ha, yeah ,This "US guidelines" are meaningless, these boneheaded politicians could change them as they wish, no adjustment time or respect for deliveries, no nothing, like they did with the H800, imagine the feeling on ZTE headquarters.

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Chinese companies should threat anything coming from US companies as already banned, just happen that is still available, if CXMT want to expand the should consider using as much domestic tools as possible and find alternatives for US technology just in case.
 
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