Chinese semiconductor industry

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tokenanalyst

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care to explain how you reach this conclusion?
China has been stockpiling tools for years, that orders cannot be fulfilled immediately because the lead-time of making this tools. Now thanks to the geniuses in D.C. there is a big downturn in the semiconductor industry that means that orders from others countries except China has been cancelled so the market shared from China has grown.
I don't follow your logic, could you clarify?
The tools manufacturers have joined Korean memory makers to put pressure to the stooges in the White House to allow then to continue to expand in China, to keep selling more tools there, so they can compensate for the tools that they are not selling elsewhere.
 

tokenanalyst

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Another new type of equipment from Xinyun Intelligence was shipped: On October 28, 2023, the WTS EFEM equipment of the 45th Research Institute of China Electronics Technology Group Corporation was successfully loaded and shipped!​


Xinyun Intelligent is a semiconductor equipment manufacturer with leading core technology and independent controllability. Its core product AMHS system is mainly used in wafer manufacturing and advanced packaging factories. Focusing on intelligent manufacturing in the semiconductor field, its main products cover semiconductor factory AMHS automatic material handling systems, semiconductor wafer handling automation equipment, and localized replacement of core components of automation equipment.

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tokenanalyst

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The Department of Automation and the Department of Electronics collaborate to develop ultra-high-speed optoelectronic computing chips​

Tsinghua News Network, October 30. In 1965, Gordon Moore, one of the founders of Intel, proposed "Moore's Law" that has influenced the chip industry for more than half a century: it predicts that the number of transistors that an integrated circuit can accommodate will increase every two years or so. Double. The field of semiconductors has prospered and developed under Moore's Law for decades, and "chips" have become an important engine for mankind to enter the intelligent era. However, as transistor size approaches physical limits, Moore's Law has slowed down or even faced failure in the past decade. How to build a new generation of computing architecture and establish a "new" order for chips in the artificial intelligence era has become a frontier hot topic of great concern to the international community.

In response to this problem, Academician Dai Qionghai and Assistant Professor Wu Jiamin of the Department of Automation of Tsinghua University, and Associate Professor Fang Lu and Associate Researcher Qiao Fei of the Department of Electronic Engineering jointly tackled the problem and proposed a new computing architecture that "breaks away" from Moore's Law: optoelectronic simulation chips, computing power Reaching more than 3,000 times that of current high-performance commercial chips. The relevant results are titled "All-analog photo-electronic chip for high-speed vision tasks " and were published in the journal Nature in the form of a long article . If the running time of a vehicle is used to compare the information flow calculation time in a chip, then the emergence of this chip is equivalent to shortening the 8-hour running time of the Beijing-Guangzhou High-speed Railway to 8 seconds.

In this small chip, the Tsinghua University research team creatively proposed a computing framework for deep integration of optoelectronics. Starting from the most essential physical principles, it combines optical computing based on electromagnetic wave space propagation and pure analog electronic computing based on Kirchhoff's laws, "breaking away" from the physics that restricts data conversion speed, accuracy and power consumption in traditional chip architectures. The bottleneck is to break through three international problems of large-scale computing unit integration, high-efficiency nonlinearity, and high-speed optical and electrical interfaces on one chip.
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Optoelectronic chip
According to actual measurement performance, the system-level computing power of the optoelectronic fusion chip is thousands of times higher than that of the existing high-performance chip architecture. However, such amazing computing power is only one of the many advantages of this chip.

In the intelligent vision tasks and traffic scene calculations demonstrated by the R&D team, the system-level energy efficiency (number of operations that can be performed per unit energy) of the optoelectronic fusion chip was measured to reach 74.8 Peta-OPS/W, which is more than 4 million peta-OPS/W of existing high-performance chips. times. To put it figuratively, the amount of electricity that originally powered an existing chip to work for one hour can last it more than 500 years.

A key factor currently limiting the limits of chip integration is the heat dissipation problem caused by excessive density. Optoelectronic fusion chips operating at ultra-low power consumption will help greatly improve chip heating problems and bring all-round breakthroughs to future chip designs.

Furthermore, the minimum processing line width of the optical part of the chip is only one hundred nanometers, while the circuit part only uses 180nm CMOS process, which has achieved performance improvements of several orders of magnitude compared to high-performance chips made using the 7nm process. At the same time, the materials used are simple and easy to obtain, and the cost is only a few tenths of the latter.

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european_guy

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Domestic semiconductor equipment substitution accelerates​


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According to the winning bid data of equipment procurement projects of multiple domestic semiconductor manufacturers tracked by Jiwei.com, from January to June this year, the number of successful bid orders for domestic semiconductor equipment manufacturers accounted for more than 50%, a significant increase compared with last year

The global semiconductor equipment market will be US$107.6 billion in 2022, of which mainland China's semiconductor equipment sales account for 26.3% of global sales, reaching US$28.27 billion, surpassing Taiwan (24.9%), South Korea (20%), and North America (9.7%).

the total investment scale of equipment projects in the first half of 2023 is nearly 30 billion yuan, an increase of approximately 30% compared to the same period in 2022
 

measuredingabens

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The Department of Automation and the Department of Electronics collaborate to develop ultra-high-speed optoelectronic computing chips​

Tsinghua News Network, October 30. In 1965, Gordon Moore, one of the founders of Intel, proposed "Moore's Law" that has influenced the chip industry for more than half a century: it predicts that the number of transistors that an integrated circuit can accommodate will increase every two years or so. Double. The field of semiconductors has prospered and developed under Moore's Law for decades, and "chips" have become an important engine for mankind to enter the intelligent era. However, as transistor size approaches physical limits, Moore's Law has slowed down or even faced failure in the past decade. How to build a new generation of computing architecture and establish a "new" order for chips in the artificial intelligence era has become a frontier hot topic of great concern to the international community.

In response to this problem, Academician Dai Qionghai and Assistant Professor Wu Jiamin of the Department of Automation of Tsinghua University, and Associate Professor Fang Lu and Associate Researcher Qiao Fei of the Department of Electronic Engineering jointly tackled the problem and proposed a new computing architecture that "breaks away" from Moore's Law: optoelectronic simulation chips, computing power Reaching more than 3,000 times that of current high-performance commercial chips. The relevant results are titled "All-analog photo-electronic chip for high-speed vision tasks " and were published in the journal Nature in the form of a long article . If the running time of a vehicle is used to compare the information flow calculation time in a chip, then the emergence of this chip is equivalent to shortening the 8-hour running time of the Beijing-Guangzhou High-speed Railway to 8 seconds.

In this small chip, the Tsinghua University research team creatively proposed a computing framework for deep integration of optoelectronics. Starting from the most essential physical principles, it combines optical computing based on electromagnetic wave space propagation and pure analog electronic computing based on Kirchhoff's laws, "breaking away" from the physics that restricts data conversion speed, accuracy and power consumption in traditional chip architectures. The bottleneck is to break through three international problems of large-scale computing unit integration, high-efficiency nonlinearity, and high-speed optical and electrical interfaces on one chip.
View attachment 120800
Optoelectronic chip
According to actual measurement performance, the system-level computing power of the optoelectronic fusion chip is thousands of times higher than that of the existing high-performance chip architecture. However, such amazing computing power is only one of the many advantages of this chip.

In the intelligent vision tasks and traffic scene calculations demonstrated by the R&D team, the system-level energy efficiency (number of operations that can be performed per unit energy) of the optoelectronic fusion chip was measured to reach 74.8 Peta-OPS/W, which is more than 4 million peta-OPS/W of existing high-performance chips. times. To put it figuratively, the amount of electricity that originally powered an existing chip to work for one hour can last it more than 500 years.

A key factor currently limiting the limits of chip integration is the heat dissipation problem caused by excessive density. Optoelectronic fusion chips operating at ultra-low power consumption will help greatly improve chip heating problems and bring all-round breakthroughs to future chip designs.

Furthermore, the minimum processing line width of the optical part of the chip is only one hundred nanometers, while the circuit part only uses 180nm CMOS process, which has achieved performance improvements of several orders of magnitude compared to high-performance chips made using the 7nm process. At the same time, the materials used are simple and easy to obtain, and the cost is only a few tenths of the latter.

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Tsinghua is doing a lot of good work. First the memristor chips and now photonic computing. I do wonder if any companies or research institutes have a potential timeline for the commercialisation of this technology. A lot pf breakthroughs have been made the past few years, but how long it takes getting that technology out of the lab is the question. That reminds me, if I remember correctly there's a photonics chip research/production line in Wuxi that was supposed to start operation this year, right? Any news on that?
 
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tphuang

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How much would that money be per year? According to 天风证券,it’s $10B:

View attachment 120798
btw, I'm not convinced this estimate by IDC is correct. I think domestic share even in 2022 was higher than 15%. This year, it's probably on its way to 50%

That second part is nonsense also, because Huawei's clusters are actually the main stream of its system. I can't necessarily say the same about other domestic AI chip producers
 

tphuang

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Further de risking from Chinese OEMs in CMOS

Looks like omnivision is coming out with better products than Sony soon. It has already gotten more orders than it can handle from xiaomi and will get more soon from Huawei.

As people have said, Chinese supply chain is turning into quite the monster
 

tokenanalyst

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Semiconductor photoresist monomer and resin supplier Microchip New Materials completed over 100 million yuan in Series C financing​

Microchip New Materials Technology Co., Ltd. (hereinafter referred to as "Microchip New Materials") recently completed a Series C financing of over 100 million yuan. This round of financing was led by CDH Baifu and included Yida Capital, Cornerstone Capital, Guangdong Capital, and Yingying Capital. Ainidi Capital and Kaitou Hanrun Capital jointly participated in the investment. Taihe Capital served as the exclusive financial advisor for this round of financing.
Microchip New Materials was established in 2018. The company has established a complete production and quality control system for photoresist monomers and photoresist resins. The mature and stable production line can provide hundreds of tons of high-quality monomer supply (Grade 3 and above). ), the various polymerization methods that have been mastered can cover the demand for photolithography resins in different molecular weight distribution areas (PDI is between 1.0-2.1), and the scarce photolithography resin production lines have the ability to supply photolithography resins in batches.​
 
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