Chinese semiconductor industry

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tokenanalyst

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The four major domestic EDA players have taken advantage of the localization boom and have increased training opportunities to make up for congenital deficiencies.​



In the past, the domestic IC industry relied too much on overseas EDA tools, which caused local EDA industry players to face the dilemma of lack of on-site training and cumulative verification.  Huada Jiutian

In the past, the domestic IC industry relied too much on overseas EDA tools, which caused local EDA industry players to face the dilemma of lack of on-site training and cumulative verification. Huada Jiutian
After the release of the 7nm Kirin processor in Huawei's new phone Mate 60 Pro, there has been discussion that SMIC has entered the advanced manufacturing camp. However, Dan Hutcheson, an expert at TechInsights, a research institute responsible for dismantling Huawei's 7nm mobile phone, even pointed out that in the United States Under the restrictions on the export control of advanced process node EDA tools of Chinese companies, how did Huawei HiSilicon and SMIC obtain EDA software assistance?
Hutcheson assesses that the domestic electronic design automation (EDA) industry should have made significant progress.

This is very different from the past situation in which the domestic IC industry over-relied on overseas EDA tools, which in turn led to a lack of on-site training and accumulated verification for local EDA industry players.
EDA was once a relatively unnoticed part of the entire chip production process. However, judging from the global EDA market of approximately US$13 billion in 2022, the industry supports the semiconductor equipment industry with an annual output value of tens of billions of US dollars, as well as the annual output value of Hundreds of billions of dollars in IC manufacturing.
According to data from China Media Finance Association, China began to invest in domestic self-developed EDA systems in the 1990s. However, after the world's three major EDA giants entered the domestic market, they used their more mature technology and cheaper prices to impact domestic self-developed EDA tools. of investment.
Compared with EDA software from major overseas manufacturers, domestic EDA tools cannot even win the favor of local industry players. This is a challenge caused by their inherent shortcomings.
After 2008, the four major local EDA players, including BGI Jiutian, Bolun Electronics, Guangli Micro, and the rising star Xinhuazhang, tried to cut into the domestic market business gaps that the three global giants already occupied and promoted the development of EDA localization in various fields. .
Basically, domestic local EDA players generally start from a single point in a certain link, and only have strong competitiveness in some processes and links. Chinese media quoted industry insiders as pointing out that the domestic EDA industry is still in the catching-up stage, and breakthroughs in some areas are still unable to achieve full-process coverage. Therefore, the domestic industry is still highly dependent on overseas advanced EDA tools.
 

tokenanalyst

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Total investment is 280 million! Two major quartz projects in the East China Sea are planned to start construction​


Recently, the Lianyungang Municipal Ecological Environment Bureau announced the acceptance of environmental impact assessments for two major quartz- related construction projects, including Jiangsu Donglian Optical Co., Ltd.’s annual output of 5,000 tons of electronic-grade high-purity quartz sand and 2,000 tons of semiconductors. grade quartz material project and the deep processing project of Donghai County Shuoteng Lighting Co., Ltd.'s annual production of 1,000 tons of high-purity quartz tubes and 5,000 high-purity quartz tubes.

Jiangsu Donglian Optical Co., Ltd. Annual production of 5,000 tons of electronic-grade high-purity quartz sand and 2,000 tons of semiconductor-grade quartz material projects Jiangsu Donglian Optical Co., Ltd. plans to invest 200 million yuan in the project to purchase about 62 units (sets) of hammer crushers , roller machines, roasting machines, magnetic separators, flotation machines and other equipment to build an annual output of 5,000 tons of electronic-grade high-purity quartz. Sand and 2000t semiconductor quartz material project. After the project is completed, it will have an annual output of 5000t electronic grade high-purity quartz sand and 2000t semiconductor quartz material.

ghai County Shuoteng Lighting Co., Ltd. Annual production of 1,000 tons of high-purity quartz tubes and 5,000 high-purity quartz tube deep processing projects The Donghai County Zoeteng Lighting Co., Ltd. project plans to invest 80 million yuan to lease the existing factory building and auxiliary facilities of Lianyungang Langston Quartz Glass Co., Ltd. about 9470m 2 , renovate the factory building and build new sewage treatment, gas storage tanks and other facilities, and purchase a furnace. , 76 sets of pipe expansion beds, cutting machines and other equipment, and a new deep-processing project with an annual output of 1,000 tons of high-purity quartz tubes and 5,000 high-purity quartz tubes. After the completion of the project, the deep-processing capacity of 1,000 tons of high-purity quartz tubes and 5,000 high-purity quartz tubes will be formed Ability.

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tokenanalyst

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Changdian Technology’s high-reliability automotive SiC power device packaging solutions​


Changdian Technology has accumulated decades of technical experience in the field of power device packaging and has a comprehensive range of power product packaging shapes, covering the packaging and testing of popular products such as IGBT, SiC, and GaN. Among them, in the field of automotive high-density power supply packaging and testing, Changdian Technology relies on differentiated power module technology to achieve industry-leading power supply/main drive solutions. For high-power-density silicon carbide (SiC) power modules, the innovative packaging technology adopted by Changdian Technology can significantly reduce parasitic effects and thermal resistance, and uses advanced interconnection technology to provide strong packaging reliability, reduce power loss, and help customers improve Product application performance.
The acceleration of vehicle electrification and the rising popularity of the new energy vehicle market have opened a window for growth in the automotive power semiconductor market. A large number of power devices are used in the motor control system, DC-DC conversion, electric air conditioning drive, OBC, and battery management of new energy vehicles. According to statistics from organizations such as Strategy Analytics, the value of power devices in pure electric vehicles is about five times that of traditional fuel vehicles, which will bring significant growth to the power device market. Silicon carbide power devices have smaller on-resistance, higher withstand voltage, faster switching speed, and also have the ability to operate at high temperatures, which is conducive to improving the power density of the inverter and improving the working efficiency and efficiency of the vehicle under actual operating conditions. The battery life is long and the market application prospects are broad.
In order to ensure that silicon carbide (SiC) power modules can give full play to the above advantages under actual working conditions, Changdian Technology uses low stray inductance packaging technology, innovative material interconnection packaging technology and advanced thermal management technology, combined with the actual needs of customers, Provides system integration solutions such as all-silver sintering process, copper wire bonding, and single-sided direct water cooling. In addition, SiC power chips have small size, high withstand voltage and high power density. When applied on the 800V platform of electric vehicles, they can produce higher system advantages and achieve the comprehensive benefits of fast charging and long cruising range. Changdian Technology continues to optimize packaging for this purpose. technology, realized multiple iterations of HPD (Hybrid Package Driver) packaging, and innovatively launched a single-sided direct water cooling solution to meet the application needs of silicon carbide devices such as low parasitic inductance and high switching speed.
With the accelerated application of silicon carbide devices in automotive controllers, charging piles, photovoltaic energy storage and other fields, Changdian Technology combines innovative design and platform development such as packaging materials, internal connections and packaging structures to launch a series of products suitable for different user needs. package shape, for example:​
  • 400V platform A0/A00 vehicles within 70KW: Si Hybrid Package1 solution;​
  • 400V platform A-class cars between 100-200KW: Si/SiC Hybrid Package Driver solution;​
  • 800V platform B-class and luxury cars with 200KW and above: SiC single-sided/double-sided cooling solution.​
The market space for silicon carbide and other automotive power devices is vast, and technology iterations are highly certain, creating good development opportunities for device designers and manufacturers with first-mover advantages. Changdian Technology will continue to focus on developing power device-related packaging solutions, provide customers with a wider range of technology options, and help customers apply more efficient and reliable technologies in new energy vehicle systems.

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tokenanalyst

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Baian Semiconductor's 6-inch MEMS specialty production line goes into production​


According to the official WeChat account of Baian Technology, Shanghai Baian Semiconductor Co., Ltd. recently put into trial operation its 6-inch MEMS optical fiber sensor chip special production line and successfully produced a variety of products such as MEMS optical fiber acceleration sensors and MEMS optical fiber pressure sensors.
It is reported that Baian Semiconductor's production line has a full set of processing capabilities such as bulk silicon machinery, surface micromachines, optical and fiber optic devices, as well as testing methods such as chip packaging and reliability verification. Its independent factory area exceeds 8,100 square meters, and the factory's ultra-clean room area Over 3000 square meters. After the production line is put into operation, in addition to meeting Baian Technology's demand for MEMS optical fiber sensor chips, it will also open up the research and development and production of MEMS optical fiber sensor chips to the outside world in the future, with an annual R&D and production of 10,000-15,000 chip wafers.
Public information shows that Baian Technology was founded in Zhangjiang, Shanghai in 2004. It is a manufacturer of MEMS fiber optic sensors, full spectrum analyzers and industrial software. Baian Semiconductor was jointly invested by Baian Technology and Jiading Comprehensive Bonded Zone Company and was established in February 2022.

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tokenanalyst

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Lianshi Semiconductor’s ultra-clean and high-purity material intelligent manufacturing and R&D center project was signed and settled.​


According to the official website of the Kunshan Municipal People's Government, on September 26, the Lianshi Semiconductor Intelligent Manufacturing and R&D Center Project for ultra-clean and high-purity materials with a total investment of 600 million yuan was settled in Qiandeng.
It is reported that the intelligent manufacturing and R&D center project for ultra-clean and high-purity materials used by Lianshi Semiconductor is mainly engaged in the production and research and development of various ultra-clean and high-purity wet electronic chemicals. The products are used in cleaning, cleaning and other processes of integrated circuit wafer manufacturing and chip packaging. Photolithography, development, etching and other process links. The new factory building of the project shall not be less than 40,000 square meters. After the project reaches full production, Lianshi Chemical is expected to have an annual output value of more than 1.2 billion yuan and an annual tax payment of more than 55 million yuan.
Information shows that Lianshi (Kunshan) Chemical Materials Co., Ltd. is located in Qiandeng Town. It is one of the few electronic chemical material production suppliers in the country with independent purification intellectual property rights. It mainly produces ultra-clean and high-purity wet electronic chemical materials for the semiconductor industry. Electronic grade chemical solvents are provided for the process.

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interestedseal

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I think the main news here is: Bright/dark field: 2Xnm bright/dark field detection equipment has been successfully developed;
This type of optical inspection equipment is together with lithography one of the weakest links in China. Jingce did develop something similar but only for 65nm. Fortunately Korea has a strong company, Nextin, that can substitute KLA till the Chinese equivalents reach world class level.
Right. Bright field defect inspection is the hardest and currently the weakest link. Jingce shipped out its 65nm inspection tool last year and has probably shipped 28nm tool this year.
Dark field is apparently simpler than bright field according to the CEO of this dark field inspection tool startup.
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My guess is HUAWEI is developing its own bright/dark field inspection tools for advanced nodes because all other domestic vendors are quite behind in this area.
 

tphuang

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Recent Q&A with Sai Micros
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投资者:董秘,你好,请问贵公司最主流5G的n79和n78两个频段的滤波器何时能够开发出来,并导入量产?以上两个频段之前说23年6月底成功研发,现在如何了?贵司n79NB和n79FB适用于什么下游终端?

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董秘:
您好,公司已实现高中低多频段BAW滤波器的工艺开发和晶圆制造,并持续向客户及下游终端供货,谢谢关注!
confirms again that Sai micro is mass producing n78 and n79 band 5G BAW filters and that they are making their way to end customer (assuming this to be Huawei)
Remember, several firms have mastered n41 BAW filter, but that's of lower band and can also be done by high end SAW filters. Huawei absolutely need n77 to n79 in order to support all current 5G networks in China

投资者:请问有媒体报道,Omnitron选择Silex代工面向激光雷达的MEMS扫描镜,请问:1,该报道是否属实?2,国内工厂是否也具有相同的代工能力?谢谢尽快回复解惑,不胜感激!!!

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董秘:
您好,1、属实;2、北京FAB3已实现该类产品晶圆的量产。谢谢关注!

投资者:贵司微镜从试产到正式量产速度堪比神速,是产品遥遥领先吗?接下来的北京厂硅光子能否延续神话,尽快产出?三季度是否北京线能如期盈亏平衡?

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董秘:
您好,每一个遥遥领先的背后都是工程师与制造团队经年累月的奋斗与积累。虽然MEMS微镜从试产到量产速度较快,但从项目开始到现在也已经超过500个日日夜夜。随着工艺制造平台的不断成熟、试产与量产晶圆品类的不断增加,能够支持开发与制造进程不断提高效率,敬请期待,谢谢关注!
The MEMS mirror that Sai Micro is fabbing is getting supplied to Omnitron using Beijing Fab 3 lines.

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They also stated the obvious point that NearLink will require BAW filters, which should allow them to sell more of it. I think the demand witll be very high
 
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