I don't think FinFET rules apply anymore, FinFETs are stacked horizontally and Gate Around transistors are stacked vertically AND horizontally.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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Since we are talking about FinFETs I hope this Beautiful Lady join our forum, she will definitely rock SDF 
And I take back my word, there are hidden beauties in the Engineering world.
And I take back my word, there are hidden beauties in the Engineering world.
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Xinhuazhang GalaxEC debuts: from system level to front-end and back-end, realizing digital full-process equivalence verification
The valuable thing about Xinhuazhang's equivalence verification system is that it has actually implemented many practical functional innovations from the perspective of user needs.
Specifically, the first is comprehensive, covering system-level, front-end, and back-end equivalence verification needs in one stop, and has all the core functions of various mainstream equivalence verification tools; the second is fast, with the help of parallelization The algorithm and self-developed solution engine library can achieve nearly a hundred times efficiency improvement in some fields; third, the flexible and rich open interface design allows users to conveniently and flexibly access the underlying database of the tool and customize the verification and debugging process independently.
On September 18, 2023, at the first IDAS Design Automation Industry Summit (Intelligent Design Automation Summit), for thousands of upstream and downstream EDA industry enterprises and related professionals present, the industry's leading system-level verification EDA solution provider Chip Huazhang, grandly launches GalaxEC, the first self-developed digital full-process equivalence verification system. With the release of GalaxEC, Xinhuazhang's independent EDA tools have completed complete coverage of the entire digital verification process, further improved its rich system-level verification product portfolio, and can provide more comprehensive agile verification services for chip design and system-level users.
GalaxEC already has all the core functions of various mainstream equivalence verification tools. The service scenarios run through all stages of digital chip design from system level to front-end and back-end design. It can meet users' full-process equivalence verification needs in one stop, avoiding the need for Multi-tool switching costs help engineers ensure consistency between different levels of design, support ergodic verification, discover deep-level critical design errors, ensure the correctness of the design and achieve formal sign-off.
Facing the next-generation EDA 2.0 goal, GalaxEC uses a new generation of formal solving algorithms and parallel computing technology to create a high-performance solving engine that supports native cloud deployment and provides a rich and complete user open interface to better meet agile verification and design needs.
Probably heat and resistance. I don’t think you can separate transistor design philosophy from node size. The latter is what defines the necessary details of the former.
High precision etch and deposition become more crucial to smaller node advancements as your physical structures get more complex. I think what we’re seeing is that at around 3-5 nm how well you can control the precision of your complex structures and their composition may matter more than how small you can pattern features when it comes to improving transistor performance.
Seeing as etch and deposition become more important with each new transistor type, at which point do you think the bottleneck becomes advancements in etching and deposition rather than lithography?
Patterning will always still be the first order constraint I think. At best as advanced geometries become more prominent etch and deposition capabilities will gain equivalent standing, but unless you can literally deposit and etch nanoscale shapes without any patterning assistance these steps will never supersede the need for advanced lithography capabilities.
I just got my X5 yesterday, very pleased to be transitioning from iPhone over to Huawei.
I was also flying from China to the US, and ran speedtests at 3 locations (for "fairness", cellular at a reasonable central location within the airport"):
- Shanghai Pudong: 650 Mbps down, 87.43 Mbps up (the unlabeled 4.99999G).
- Taipei Taoyuan: 94.3 Mbps down, 43.6 Mbps up (4G).
- San Francisco: 21.1 Mbps down, 7.42 Mbps up (this was actually a couple miles from the airport - but with full 4G bars).
I was also flying from China to the US, and ran speedtests at 3 locations (for "fairness", cellular at a reasonable central location within the airport"):
- Shanghai Pudong: 650 Mbps down, 87.43 Mbps up (the unlabeled 4.99999G).
- Taipei Taoyuan: 94.3 Mbps down, 43.6 Mbps up (4G).
- San Francisco: 21.1 Mbps down, 7.42 Mbps up (this was actually a couple miles from the airport - but with full 4G bars).
Looks like Dylan Patel stuff is getting to US policy makers. Few weeks ago he made the comment that TSMC Arizona fab is effectively a Paperweight because the chips fabbed there would need to be taken to Taiwan for advanced packaging. Lots of western newspapers picked on his quote and have been running that story.
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