Very astute and accurate article. Wish I bought SMIC at that time after reading your article.
Chinese semiconductor industry
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broadsword
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But if you did not buy today, consider yourself wise.
Yes Sir, I had been following and researching trying to connect the dot, since SMIC use ASML equipment for its advance processes and is susceptible for further sanction by the US why not share the IP and get some royalties while waiting for their domestic FAB to come online. We know that they have a prototype SSA800 for verification and there are a lot of news about some Chinese firm buying up second hand DUVi equipment. So the speculation that Huawei is able to FAB its own chip is possible as PXW come to mind. Its a win win for both SMIC and Huawei as both were able synergize their effort and continue to do more R&D.
And also there is a huge market for SMIC 7nm either N+1 or N+2, it can't supply all of them, rather than FAB it to TSMC and risk National Security, its better to spread it around as SMIC can FAB and seek new customer at the expense of TSMC.
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Huh. Any news on AMEC's progress for equipment capable of 200+ layer NAND?
you can see it in youtube. just search 极客湾, seems last night their video analyzing kirin 9000s's performance was asked to deleted by someone, not huawei, they explained that in weibo
Problems Chinese domestic semiconductor software industry currently facing
总体而言，国产工业软件厂商大多竞争力并不强，与海外巨头对战的时候常常处于下风。一位试图开拓高端工业软件市场的创业者吴南中（化名）表示，最近一段时间明显感觉到市场推广难度越来越大。“此前，我们公司已经与国内某晶圆厂达成了初步合作意向，却被临时叫停了后续合作。”
经过多方打听后，吴南中终于搞清楚了这背后的原因。当某海外大厂得知该晶圆厂将采用国产软件时，马上暗示自己也将终止自身与晶圆厂相关硬件设备的合作。“相比于软件，硬件设备更具有不可替代性。所以，该晶圆厂自然不愿得罪他们。”吴南中也很清楚这一点。
这并不是个例。邹文还曾遇到过某海外巨头用软件捆绑软件的方式来挤压竞争对手。譬如某海外大厂可以为半导体行业提供生产效率、工艺质量、制造执行、供应链四大类解决方案，其中即包含了EAP、MES这类半导体制造侧的核心工业软件。“有时，他们为了推广一些新开发的软件，也会用捆绑销售的方式。”邹文表示。
Generally speaking, most domestic industrial software manufacturers are not very competitive, and they are often at a disadvantage when competing with overseas giants. Wu Nanzhong (pseudonym), an entrepreneur who is trying to develop the high-end industrial software market, said that it has become more and more difficult to promote the market recently. "Previously, our company had reached a preliminary cooperation intention with a domestic fab, but the follow-up cooperation was temporarily suspended."
After many inquiries, Wu Nanzhong finally figured out the reason behind this. When a major overseas factory learned that the fab would adopt domestic software, it immediately hinted that it would also terminate its cooperation with the fab's related hardware equipment. "Compared with software, hardware devices are more irreplaceable. Therefore, the fab naturally does not want to offend them." Wu Nanzhong is also very clear about this.
This is not an exception. Zou Wen also encountered an overseas giant that used software bundled software to squeeze competitors. For example, a major overseas factory can provide the semiconductor industry with four major solutions: production efficiency, process quality, manufacturing execution, and supply chain, which include core industrial software on the semiconductor manufacturing side such as EAP and MES. "Sometimes, in order to promote some newly developed software, they also use bundled sales." Zou Wen said.
国内CIM厂商的半导体客户大致分为三大类：封测厂、晶圆厂和国产化设备装备部分。其中封测的跨入门槛相对较低，很多国内的厂商都有做过封测厂MES系统的经验。而在晶圆厂领域，国产CIM厂商想要拿下12吋晶圆厂的订单难度系数极高，目前国内的产品还没有真正支持过大规模运行的系统。
The semiconductor customers of domestic CIM manufacturers are roughly divided into three categories: packaging and testing plants, fabs, and localized equipment and equipment. Among them, the entry threshold for packaging and testing is relatively low, and many domestic manufacturers have experience in doing MES systems in packaging and testing factories. In the field of fabs, it is extremely difficult for domestic CIM manufacturers to win orders for 12-inch fabs. At present, domestic products have not really supported large-scale operation systems.
目前，不少投资人表明，他们只会投资1-2年内出产品的工业软件公司，可能不会等他们研发超过3年以上。更有不少投资人更是借用互联网模式，找几个技术大牛和产业老兵创业，拉着几家价值观相似的投资方快速推进几轮融资，然后投钱、投人力、重营销快速催生一个一个看似不错的业绩。
事实证明，这种投资模式无视工业和技术领域自身的客观规律，极容易扰乱市场秩序。
当下，工业软件市场中便出现一些不良现象。有些公司为了尽快实现上市，而过度追求投资方的品牌，加紧融资节奏，而忽视了技术研发的投入，甚至不能深入场景中了解客户需求。
不少工业软件厂商抱怨，因为这种情况的出现，导致很多客户不敢轻易接受国产软件。“过去1年时间里，我们一直在帮助其他技术不过关的厂商收拾烂摊子，更要花费时间帮助客户重新建立信心。”上海一家工业软件公司创始人抱怨道。
At present, many investors have stated that they will only invest in industrial software companies that produce products within 1-2 years, and may not wait for them to develop products for more than 3 years. Many investors even borrowed the Internet model, found a few technology giants and industry veterans to start a business, pulled a few investors with similar values to quickly promote several rounds of financing, and then invested money, manpower, and re-marketing to quickly create a A seemingly good performance.
Facts have proved that this investment model ignores the objective laws of the industrial and technological fields and easily disrupts the market order.
At present, some unhealthy phenomena appear in the industrial software market. In order to achieve listing as soon as possible, some companies over-pursue the brand of the investor and step up the pace of financing, while ignoring the investment in technology research and development, and even fail to understand customer needs in the scene.
Many industrial software manufacturers complain that because of this situation, many customers dare not accept domestic software easily. "In the past year, we have been helping other manufacturers whose technology is not up to standard to clean up the mess, and we have to spend time helping customers rebuild their confidence." The founder of an industrial software company in Shanghai complained.
总体而言，国产工业软件厂商大多竞争力并不强，与海外巨头对战的时候常常处于下风。一位试图开拓高端工业软件市场的创业者吴南中（化名）表示，最近一段时间明显感觉到市场推广难度越来越大。“此前，我们公司已经与国内某晶圆厂达成了初步合作意向，却被临时叫停了后续合作。”
经过多方打听后，吴南中终于搞清楚了这背后的原因。当某海外大厂得知该晶圆厂将采用国产软件时，马上暗示自己也将终止自身与晶圆厂相关硬件设备的合作。“相比于软件，硬件设备更具有不可替代性。所以，该晶圆厂自然不愿得罪他们。”吴南中也很清楚这一点。
这并不是个例。邹文还曾遇到过某海外巨头用软件捆绑软件的方式来挤压竞争对手。譬如某海外大厂可以为半导体行业提供生产效率、工艺质量、制造执行、供应链四大类解决方案，其中即包含了EAP、MES这类半导体制造侧的核心工业软件。“有时，他们为了推广一些新开发的软件，也会用捆绑销售的方式。”邹文表示。
Generally speaking, most domestic industrial software manufacturers are not very competitive, and they are often at a disadvantage when competing with overseas giants. Wu Nanzhong (pseudonym), an entrepreneur who is trying to develop the high-end industrial software market, said that it has become more and more difficult to promote the market recently. "Previously, our company had reached a preliminary cooperation intention with a domestic fab, but the follow-up cooperation was temporarily suspended."
After many inquiries, Wu Nanzhong finally figured out the reason behind this. When a major overseas factory learned that the fab would adopt domestic software, it immediately hinted that it would also terminate its cooperation with the fab's related hardware equipment. "Compared with software, hardware devices are more irreplaceable. Therefore, the fab naturally does not want to offend them." Wu Nanzhong is also very clear about this.
This is not an exception. Zou Wen also encountered an overseas giant that used software bundled software to squeeze competitors. For example, a major overseas factory can provide the semiconductor industry with four major solutions: production efficiency, process quality, manufacturing execution, and supply chain, which include core industrial software on the semiconductor manufacturing side such as EAP and MES. "Sometimes, in order to promote some newly developed software, they also use bundled sales." Zou Wen said.
国内CIM厂商的半导体客户大致分为三大类：封测厂、晶圆厂和国产化设备装备部分。其中封测的跨入门槛相对较低，很多国内的厂商都有做过封测厂MES系统的经验。而在晶圆厂领域，国产CIM厂商想要拿下12吋晶圆厂的订单难度系数极高，目前国内的产品还没有真正支持过大规模运行的系统。
The semiconductor customers of domestic CIM manufacturers are roughly divided into three categories: packaging and testing plants, fabs, and localized equipment and equipment. Among them, the entry threshold for packaging and testing is relatively low, and many domestic manufacturers have experience in doing MES systems in packaging and testing factories. In the field of fabs, it is extremely difficult for domestic CIM manufacturers to win orders for 12-inch fabs. At present, domestic products have not really supported large-scale operation systems.
目前，不少投资人表明，他们只会投资1-2年内出产品的工业软件公司，可能不会等他们研发超过3年以上。更有不少投资人更是借用互联网模式，找几个技术大牛和产业老兵创业，拉着几家价值观相似的投资方快速推进几轮融资，然后投钱、投人力、重营销快速催生一个一个看似不错的业绩。
事实证明，这种投资模式无视工业和技术领域自身的客观规律，极容易扰乱市场秩序。
当下，工业软件市场中便出现一些不良现象。有些公司为了尽快实现上市，而过度追求投资方的品牌，加紧融资节奏，而忽视了技术研发的投入，甚至不能深入场景中了解客户需求。
不少工业软件厂商抱怨，因为这种情况的出现，导致很多客户不敢轻易接受国产软件。“过去1年时间里，我们一直在帮助其他技术不过关的厂商收拾烂摊子，更要花费时间帮助客户重新建立信心。”上海一家工业软件公司创始人抱怨道。
At present, many investors have stated that they will only invest in industrial software companies that produce products within 1-2 years, and may not wait for them to develop products for more than 3 years. Many investors even borrowed the Internet model, found a few technology giants and industry veterans to start a business, pulled a few investors with similar values to quickly promote several rounds of financing, and then invested money, manpower, and re-marketing to quickly create a A seemingly good performance.
Facts have proved that this investment model ignores the objective laws of the industrial and technological fields and easily disrupts the market order.
At present, some unhealthy phenomena appear in the industrial software market. In order to achieve listing as soon as possible, some companies over-pursue the brand of the investor and step up the pace of financing, while ignoring the investment in technology research and development, and even fail to understand customer needs in the scene.
Many industrial software manufacturers complain that because of this situation, many customers dare not accept domestic software easily. "In the past year, we have been helping other manufacturers whose technology is not up to standard to clean up the mess, and we have to spend time helping customers rebuild their confidence." The founder of an industrial software company in Shanghai complained.
Big Fund 3.0 is here...
China is set to launch a new state-backed investment fund that aims to raise about $40 billion for its semiconductor sector, two people familiar with the matter said, as the country ramps up efforts to catch up with the U.S. and other rivals.
It is likely to be the biggest of three funds launched by the China Integrated Circuit Industry Investment Fund, also known as the Big Fund.
Its target of 300 billion yuan ($41 billion) outdoes similar funds in 2014 and 2019, which according to government reports, raised 138.7 billion yuan and 200 billion yuan respectively.
路透引述消息人士指，中国将推出国家集成电路产业投资基金第3期，即国家大基金，计划融资3000亿元人民币，以提振半导体行业。
根据当局报告，前两期基金分别集资约1387亿及2000亿元，意味第3期集资规模或超过首两期，财政部计划出资600亿元。
When the resources, talent and market incentives are there, the only real obstacle is time.
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