Chinese semiconductor industry
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Fro China's RISC-V conference. Discussions on how RISC-V HPC chips are taking off so quickly. Especially with 64-core SG2402
Sophgo (算能科技) and their SG2042 CPU at 2GHz and 64-core is the star here
they made 100 SG2042 development board and gave 87 to open source community and groups. Found many improvement among this testing process
in the future, it seems to me that for HPC, AI chip is far more important, so performance expectations for CPU may not be top of the line for data centers, but power consumption still will be.
In this sophgo design. you can but 8 severs together for a 1024 core RISC-V server @ 2GHz
SG2044 will come out in 2024 with 64-bit support, Vector 1.0 support & 8x DDR control
Looks like a lot of good days ahead for 算能科技
Sophgo (算能科技) and their SG2042 CPU at 2GHz and 64-core is the star here
they made 100 SG2042 development board and gave 87 to open source community and groups. Found many improvement among this testing process
in the future, it seems to me that for HPC, AI chip is far more important, so performance expectations for CPU may not be top of the line for data centers, but power consumption still will be.
In this sophgo design. you can but 8 severs together for a 1024 core RISC-V server @ 2GHz
SG2044 will come out in 2024 with 64-bit support, Vector 1.0 support & 8x DDR control
Looks like a lot of good days ahead for 算能科技
Two Liaoning-based semiconductor equipment companies disclosed a significant increase in R&D investment in semi-annual reports
On the evening of August 28, two listed semiconductor equipment companies from Liaoning Province-Tuojing Technology (688072) and Xinyuan Micro (688037) both disclosed their semi-annual reports for 2023. The operating income and net profit of the two companies both achieved increase.
According to Xinyuanwei's semi-annual report, during the reporting period, the company achieved operating income of 696 million yuan, a year-on-year increase of 37.95%; realized net profit of 136 million yuan, a year-on-year increase of 95.48%; basic earnings per share were 0.99 yuan.
As the only manufacturer in China that can provide mass-produced front-end coating and developing machines, Xinyuan Micro has completed the 28nm and above process nodes in the front-end wafer processing link after long-term technology accumulation, verification and mass production application on the client side. The full coverage, and sustainable iteration to a higher level of technology. Xinyuanwei's operating income in the first half of this year increased by 37.95% year-on-year, mainly due to the continuous enhancement of the company's product competitiveness and continuous growth in revenue scale.
Xinyuanwei invested 76.9775 million yuan in R&D in the first half of the year, an increase of 80.33% year-on-year, and R&D investment accounted for 11.07% of operating income, mainly because the company continued to increase R&D investment, employee salaries and R&D materials increased. In the first half of this year, the number of Xinyuanwei's R&D personnel was 306, compared with 253 in the same period last year; the total salary of R&D personnel in the first half of this year was 42.7119 million yuan, compared with 31.2662 million yuan in the same period last year.
According to the semi-annual report, Xinyuan Micro's current research projects include the research and development and industrialization of front-end glue coating and development equipment and core units, the development of high-end packaging glue coating and development equipment, the development of single-chip wet process equipment, and the research and development of core component technologies. The total investment scale is 467 million yuan. The investment amount in this period is 76.9775 million yuan, and the accumulated investment amount is 317 million yuan.
In the first half of this year, Tuojing Technology achieved operating income of 1.004 billion yuan, a year-on-year increase of 91.83%; realized net profit of 125 million yuan, a year-on-year increase of 15.22%; deducted non-net profit of 65.1825 million yuan, a year-on-year increase of 32.65%; basic earnings per share 0.98 yuan.
In the first half of this year, Tuojing Technology's operating income nearly doubled, mainly benefiting from the increased demand brought about by the continuous expansion of domestic fabs. More customer approval. The company's new products and new processes have been successively verified and introduced by downstream users, and the sales revenue has increased significantly.
In the first half of this year, Tuojing Technology's PECVD equipment achieved sales revenue of 908 million yuan, an increase of 94.35% over the same period last year; HDPCVD equipment and hybrid bonding equipment used in the field of wafer-level 3D integration successfully passed the client industrialization verification, realizing The first industrial application of ALD equipment and SACVD equipment has been continuously accepted by customers, and both have achieved sales revenue.
It is worth noting that in the first half of this year, Tuojing Technology’s operating income increased by 91.83% year-on-year, but the growth rate of net profit and non-net profit was significantly lower than that of operating income. In this regard, Tuojing Technology stated that the net profit and deduction of non-net profit were lower than the growth rate of operating income. The main reason was that the share-based payment expense of 126 million yuan was confirmed in the current period. Non-net profit increased by 283.68% year-on-year.
Tuojing Technology has always been deeply involved in the field of high-end semiconductor special equipment, and focuses on the research and development and industrialization of thin film deposition equipment, constantly develops new products, expands the field of process application, and always maintains high-intensity research and development investment. According to the semi-annual report of Tuojing Technology, the company's R&D investment in the first half of this year was 210 million yuan, a year-on-year increase of 78.77%, mainly due to the increase in the salary of R&D personnel and share-based payment expenses.
In the first half of this year, in the research projects of Tuojing Technology, "PECVD series products and process development and industrialization projects", "PE-ALD series products and process development and industrialization", "Thermal-ALD series products and process development and industrialization projects" ", "Deep trench filling thin film technology series product development and industrialization" is expected to increase the total investment scale compared with 2022, mainly due to the company's continuous optimization and upgrading around customer needs and the increase in research and development costs required to expand process applications.
Wanye Enterprise : Two new 12-inch wafer customers were added to the 1H23 ion implanter.
The company's 1H23 revenue was 389 million yuan, YoY+134%, corresponding to 2Q23 single-quarter revenue of 265 million yuan, YoY+286%, QoQ+114%; In 1H23, the net profit attributable to the parent was 119 million yuan, YoY+318%, corresponding to the net profit attributable to the parent in the single quarter of 2Q23 was 38 million yuan, YoY+3,296%, QoQ-53%. The company's revenue growth was mainly caused by the increase in housing delivery revenue. Basically in line with our and market expectations.Since 2023, Kaishitong has produced and delivered a variety of high-end ion implanter series products, added two 12-inch chip wafer manufacturing plant customers, and added orders exceeding 160 million yuan, covering logic, storage, power, etc. Multiple fields of application. Kaishitong has opened Shanghai Pudong Jinqiao( 12.860 , 0.53 , 4.30% ) R&D and manufacturing base in May 2023, which has enhanced the R&D and industrialization capabilities of ion implanter series products, and improved its own R&D strength, customer service level, Comprehensive competitiveness such as production capacity guarantee. In 1H23, the company's research and development expenses were 538.1 billion yuan, a year-on-year increase of 109.20%, mainly due to the increase in R&D investment of Kaishitong.
Jiaxin Semiconductor has been operating in good condition, and has continued to develop and manufacture various types of integrated circuit front-end equipment, including etching machines (silicon nitride plasma etching machines, metal plasma etching machines, side wall plasma etching machines, etc.) machine), film deposition equipment (HDP-CVD, boron-phosphorus-doped silicon dioxide film SACVD, silicon dioxide PECVD, titanium/titanium nitride MOCVD, aluminum-copper metal sputtering equipment), rapid heat treatment/annealing equipment, tail gas treatment equipment wait. Since 2023, the new orders have exceeded 130 million yuan, and the cumulative order amount has exceeded 470 million yuan since its establishment.
more from RISC-V conference. Another company Kuhan tech 库瀚信息
RISC-V needs to find a place in data center
it has designed a eSPU for cloud computing and edge computing data center. designed for high I/O applications and reducing power consumption
Combines I/O interconnection of PCle switch, smart network card & CPU in single chip. It uses 3 different RISC-V architecture.
network & storage data planes directly connected thru this eSPU chip, greatly reducing TCO and improving energy efficiency
Its eSPU can allow 10 million IOPS + 400 Gbps RDMA network capability with just 100W energy consumption
Looks like they were part of China Mobile's mobile cloud conference back in end of April
Kuhan discussed how its RISC-V chips could improve largest scale computing power infrastructure. They've partnered with China mobile cloud since 2021. Looks like they've completed testing and is being used now
RISC-V needs to find a place in data center
it has designed a eSPU for cloud computing and edge computing data center. designed for high I/O applications and reducing power consumption
Combines I/O interconnection of PCle switch, smart network card & CPU in single chip. It uses 3 different RISC-V architecture.
network & storage data planes directly connected thru this eSPU chip, greatly reducing TCO and improving energy efficiency
Its eSPU can allow 10 million IOPS + 400 Gbps RDMA network capability with just 100W energy consumption
Looks like they were part of China Mobile's mobile cloud conference back in end of April
Kuhan discussed how its RISC-V chips could improve largest scale computing power infrastructure. They've partnered with China mobile cloud since 2021. Looks like they've completed testing and is being used now
Domestic bright field detection equipment has reached a new level, and TZTEK has accelerated its layout
Recently, Suzhou Sihang Semiconductor Technology Co., Ltd. (hereinafter referred to as "Sihang Semiconductor"), a shareholder of TZTEK (stock code: 688003 SH), announced that its first wide The band bright field defect detection equipment TB1000 was officially delivered to the customer.
A new chapter of domestic bright field defect detection equipment In the semiconductor manufacturing process,
the front-end defect detection is one of the key processes, especially the bright field defect detection, which can detect a wider range of defect types. It is the most critical link, which is to improve product yield and reduce production costs., Promote the guarantee of process iteration. At the same time, bright field defect inspection equipment is also the most technically difficult front-end inspection equipment, which has been monopolized by leading foreign companies for a long time, and Sihang Semiconductor was born to break this situation. All the technical backbones of Sihang Semiconductor come from well-known universities at home and abroad, with more than 80% of masters and masters. They have many years of experience in the semiconductor industry and aim to build a domestic and even a global leading semiconductor testing equipment leading company The introduction of bright field defect detection equipment this time is an important breakthrough achieved by Sihang Semiconductor, and it also represents a more solid step for China in the field of semiconductor optical detection equipment.
The TB1000 realizes the independent controllability of the key core components of precision opto-mechanical electronics.
At the same time, it adopts advanced signal processing algorithms to effectively improve the signal-to-noise ratio and significantly improve the defect detection sensitivity of the equipment in key processes. For TZTEK, the launch of TB1000 has further improved the company's product layout in the semiconductor field TZTEK's multi-channel breakthrough TZTEK is committed to building an excellent visual equipment platform enterprise. In recent years, it has continuously increased its layout in the field of semiconductor equipment, which is an important measure for the company to continue to build a strong strategic product matrix. In 2020, the company started to acquire MueTec, a German company, to provide a variety of high-precision optical measurement and inspection equipment for front-end wafers and masks, including Overlay measurement, CD measurement, and macro defect inspection. TZTEK and MueTec have actively promoted the technical upgrade of their product lines through joint research and development. In 2022, they will successfully launch Overlay products for higher-end technology nodes and have delivered them to customers. At the same time, the market promotion of Mue Tec's existing products has been strengthened, and its high-speed automatic macro defect detection product Argos series has received bulk orders from well-known customers
I am a little confused by this from the prior page:
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So previously, they had Kirin 990A which was designed with 7 nm process. I presume it was fabb'd at TSMC whose stock ran out eventually.
Now, this next generation is likely using 12nm process at TSMC, so they likely got to similar performance as Kirin 990A or maybe a little improved with less advanced process and more advanced design + packaging"
Is Huawei the context of this? If so, how is TSMC getting a license to work on chips for Huawei?
"
So previously, they had Kirin 990A which was designed with 7 nm process. I presume it was fabb'd at TSMC whose stock ran out eventually.
Now, this next generation is likely using 12nm process at TSMC, so they likely got to similar performance as Kirin 990A or maybe a little improved with less advanced process and more advanced design + packaging"
Is Huawei the context of this? If so, how is TSMC getting a license to work on chips for Huawei?
what is so confusing? HW had access to TSMC until 2020, so it could fab on 7nm process. Then, it lost that access, so it has to rely on SMIC and make do with 12/14nm process for many chips
Q&A with Sai Micro for 1st half
I think they will have mo customers than just memsonic
it's BAW filter process & product have met or exceeded customer expectations in yield & capabilities
I think they will have mo customers than just memsonic
nother update here. Initial production (probably now) is at 2k wpm which will grow to 10k wpm in the future with memsonic
MEMS very important in various sensors, in 4G/5G communication, in AR/VR/MR, in auto MEMS, in metaverse
most MEMS chipmakers are IDMS rather than pure foundry like Sai Micro
for new MEMS chips, it takes 6 month to go from test production to mass production. Yield has to be higher for mass production
Doesn’t these 2 contradict each other? If Huawei lost access to TSMC then how is their next generation going to be from TSMC. Unless you are suggesting Huawei has stockpiles of 12nm chips from TSMC.
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