Chinese semiconductor industry

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tonyget

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I am a little confused by this from the prior page:

"
So previously, they had Kirin 990A which was designed with 7 nm process. I presume it was fabb'd at TSMC whose stock ran out eventually.

Now, this next generation is likely using 12nm process at TSMC, so they likely got to similar performance as Kirin 990A or maybe a little improved with less advanced process and more advanced design + packaging"

Is Huawei the context of this? If so, how is TSMC getting a license to work on chips for Huawei?

Fake news. TSMC can not make anything for Huawei as it stands,regardless of node process
 

Schmoe

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what is so confusing? HW had access to TSMC until 2020, so it could fab on 7nm process. Then, it lost that access, so it has to rely on SMIC and make do with 12/14nm process for many chips
"this next generation is likely using 12nm process at TSMC," - the original post said that the new HW chip is being fabbed at TSMC, not SMIC. Did you mean SMIC?
 

tokenanalyst

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An Muquan high-end chip advanced packaging and testing expansion construction project completed and accepted, 400 million yuan C round of financing disclosed​


Recently, Changsha Anmuquan Intelligent Technology Co., Ltd. (hereinafter referred to as "Anmuquan") high-end chip advanced packaging and testing expansion construction project has been completed and accepted , and production equipment has been installed successively.
"Changsha High-tech Zone" news, An Muquan's assistant to the general manager and secretary of the board of directors Li Xiangfeng introduced that in 2022, An Muquan's operating income will be close to 50 million yuan, and the order volume will continue to increase. In the next three years, An Muquan will increase investment by 1 billion yuan to expand the production scale, forming an annual production capacity of 200 million flip-chip packages, 300 million system-level packages, and 120 million chip tests.
In 2019, Changsha Anmuquan Intelligent Technology Co., Ltd. settled in Changsha; on August 12, 2021, Anmuquan's commissioning ceremony was held; on October 10, 2022, Anmuquan's high-end chip advanced packaging and testing expansion construction project started.
"Changsha High-tech Zone" also disclosed the C-round financing of An Muquan . Recently, Xiangjiang State Investment participated in the C-round financing of Anmuquan as the lead investor, and invested a total of 100 million yuan in Anmuquan through three self-managed funds; at the same time, Dongfang Fuhai subscribed for an investment of 30 million yuan . , Zhuhai Huajin, Changjiang Capital and other investment institutions conduct joint investment . The total amount of this round of financing exceeds 400 million yuan.

 

latenlazy

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lol, a little mind blowing to think about

JAC unveiled using Kirin 9610A chip for its Harmony cars which apparently provides 200k DMPIS, 2x Snapdragon 8155 that most EVs are using and about same as Snapdragon 8295.

No idea how much GPU & NPU computation it has, but quite impressive that a 14nm chip performs as well in the most important criteria as a 5nm chip
I mean…so long as you’re not worried about power consumption and thermal limitations you can make 14 nm chips that are as capable as 7 nm chips.
 

tphuang

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I mean…so long as you’re not worried about power consumption and thermal limitations you can make 14 nm chips that are as capable as 7 nm chips.
That's a concept foreign to many people. I keep getting people asking me what chips BYD is using in its cars.

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What is the prediction of people in this forum?

When can China have viable and actually production ready EUV?
prototype or fully production version.

I think for prototype, @latenlazy and I were thinking next year or 2025 at the latest.

more on RISC-V and SG2042, along with next gen SG2044 server coming out
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此外,陆吉年介绍接下来算能科技将会推出新一代的RISC-V服务器处理器——SG2044,虽然依然是基于原来的64核,但是加入了对于Vector 1.0的支持,DDR带宽增大了三倍,PCIe接口也增加 两倍。
With 7 months of work and debugging with prototype, saw significant issues resolved in OS and such. Also resulted in 20.1% improvement in SPECInt2006 scores
在样片出来之后,大家还一起努力了7个月,才打通了基于SOPHON SG2042处理器的RISC-V服务器的生态链。比如,仅仅用了2个月的时间就解决了对于所有服务器操作系统的适配问题,还有SPD、BCM等适配问题,TPU卡跟处理器联合问题等都全部得到了解决。另外,在软件生态方面,也有大量的合作团队在帮助算能科技在做,比如SG2042平台SEPCInt2006性能提升20.1%,就是在软件合作伙伴的帮助下实现的。
This is a work in progress. not finishing overnight

Also, they got a RISC-V cpu cluster with 48 nodes that will be delivered to shandong university in late Sep
据算能科技产品总监陆吉年介绍,算能科技与山东大学智能创新研究院合作的首个基于RISC-V商业集群(48节点)将会在今年9月正式交付。

Looks like Shandong university has already been testing with it to do AI StableDiffusion model
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tokenanalyst

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The double breakthrough in product and business helps Guangliwei to achieve another good performance in revenue​

Hangzhou Guangli Microelectronics Co., Ltd. (securities referred to as "Guangliwei") released the report for the first half of 2023. The report shows that thanks to the long-term software and hardware product layout and solid technology accumulation in the field of yield improvement, the company's revenue reached a new high during the reporting period . In the first half of 2023, the company realized operating income of 127.3753 million yuan, a year-on-year increase of 63.91%; net profit attributable to shareholders of listed companies was approximately 22.8431 million yuan, a year-on-year increase of 3903.60%; non-net profit attributable to shareholders of listed companies was 16.2379 million yuan, a year-on-year Realized turning losses into profits; the comprehensive gross profit rate was 62.32%. This report card is quite eye-catching among the many A-share listed semiconductor companies that have been disclosed.

In the first half of 2023, global economic uncertainty remains high, and the semiconductor industry, which is closely related to the macro economy, is also entering a stage of deep adjustment. As the world's largest semiconductor market, my country is vigorously promoting the construction of local wafer manufacturing capacity in order to increase chip self-sufficiency. The vigorous expansion investment has created major development opportunities for local semiconductor test equipment and manufacturing EDA suppliers. As the only enterprise in China that can provide full-process coverage in the field of yield improvement and wafer-level electrical test equipment, Guangliwei relies on EDA software such as test chip design, semiconductor big data analysis, wafer-level WAT electrical test equipment and finished products The solutions related to rate improvement have continuously made new breakthroughs in product development and market expansion.

While deepening the research and development of the existing yield rate scheme, Guangliwei also expanded to the mass production process monitoring (PCM) scheme, and started to develop the manufacturability (DFM) series EDA software, and the CMP simulation software filled the domestic technical gap. At the same time, accelerate the deployment of semiconductor data analysis and management system (DATAEXP series products), among which, semiconductor general analysis tool DE-G, integrated circuit yield analysis and management system DE-YMS, integrated circuit defect management system DE-DMS, defect automatic The classification system (DE-ADC) and other products have been developed and matured and have entered the stage of market expansion and business implementation


Guangliwei relies on the original yield improvement technology, deepens iterative software and hardware products, and upgrades and launches a new generation of general-purpose high-performance semiconductor parameter test equipment (T4000 series) , which can cover LOGIC, CIS, DRAM, SRAM, FLASH , BCD and other product testing requirements, support the parameter testing of the third-generation compound semiconductor (SiC/GaN), and at the same time, on the basis of the T4000 electrical testing equipment, the reliability testing analysis system (WLR) and other functions have been jointly developed to convert the equipment from WAT test extended to WLR and SPICE and other fields.

The total number of R&D personnel has increased by nearly 80% compared with the previous year. In the first half of 2023, Guangliwei's R&D personnel further maintained rapid growth. With the company's new product and new technology expansion plan and the continuous expansion of the business market, Guangliwei's R&D investment in the first half of this year reached 93.1346 million yuan, an increase of 98.72% year-on-year, and the company's R&D personnel further increased to 327, a year-on-year increase. 84.75%, and the proportion of R&D personnel with a master's degree or above is even closer to 60%.

Guangliwei released DATAEXP-YMS, DATAEXP-DMS and DATAEXP-General, etc. This product realizes the upgrade of the company's big data platform DATAEXP. For example, the DATAEXP-DMS defect data management and analysis system is based on cutting-edge machine learning technology. It has high recognition accuracy of wafer defects and rapid deployment capabilities. It has been installed in many semiconductor factories use, and achieved good practical results.

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tphuang

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SICC and TankeBlue are both looking to build 8-inch substrate capacity

8月,天科合达位于徐州的碳化硅二期扩产项目开工建设,总投资达8.3亿元人民币。该项目投产后,年产能可达16万片碳化硅晶圆。该公司已开发出第五代晶体生长炉,可满足6英寸、8英寸碳化硅制造需求,预计2024年底前可交付小批量8英寸碳化硅基板,2025年第三季度交付量将会稳定。
This month, TankeBlue's Xuzhou plant has its phase 2 expansion with 830m RMB investment. After production starts, this can produce 160k wpy. Will be using 5th gen crystal growth process, which can produce 6 and 8-inch SiC wafer. Will start delivering low rate production of 8-inch Sic wafers in end of 2024 and like to start delivery of mass production in 2025 Q3

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In SICC's half year report, it says
据悉,目前公司导电型碳化硅衬底仍以6英寸为主,尚未实现8英寸衬底产品的大规模供应,但公司在8英寸碳化硅衬底上已经具备量产能力。目前公司8英寸衬底产品正在开展客户验证,已实现了小批量销售,预期销售规模将持续提升。

具体在客户拓展方面,报告期内,天岳先进已经与英飞凌、博世等行业下游电力电子、汽车电子领域的国内外知名企业展开合作
2023年6月,天岳先进CTO高超首次公开了公司已采用液相法制备出了低缺陷的8英寸晶体,通过热场、溶液设计和工艺创新突破了碳化硅单晶高质量生长界面控制和缺陷控制难题,尚属业内首创。

而在目前主流的6英寸导电型产品上,公司已经构建了从设备设计、粉料合成到热场设计等全流程核心关键技术。公司在大尺寸半绝缘碳化硅衬底上也进行了持续的研发投入。
Looks like it has already started getting its 8-inch substrate validated with customers and selling some of that. It has Infineon and Bosch as customers.
天岳先进表示,报告期内,公司已形成山东济南、上海临港、山东济宁碳化硅半导体材料生产基地。

“今年5月上海临港工厂迎来首批产品交付,预计在今年三、四季度将持续提升。”
Has plants in Jinan, Lingang & Jining. Production expected to go up in Q3/4.

Looks like SICC is ahead of TankeBlue
 
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