Huahai Qingke (HAWTSING) CMP equipment meticulously carves out business growth in new fields
Technical support from the National Key Laboratory, leading CMP technology in China: the company cooperates deeply with the National Key Laboratory of Tribology of Tsinghua University to carry out forward-looking research on CMP, and introduces excellent scientific research personnel, with rich reserves of theory, technology and talents. The company has mastered many core technologies such as nano-precision polishing, nano-particle ultra-clean cleaning, nano-film thickness online detection, big data analysis and intelligent control, and has achieved a firm domestic leading position in the field of CMP equipment.
There is still a huge space for import substitution of CMP equipment: In addition to the front-end manufacturing of integrated circuits, CMP equipment is also used in advanced packaging and silicon wafer manufacturing. According to Chinese customs data, in 2022, the import value of CMP equipment in mainland China will still be as high as 621 million US dollars, with the United States and Japan accounting for a large proportion, and the dependence on foreign countries is still serious.
Looking forward to the future, the upgrading of integrated circuit manufacturing processes will drive the number of CMP processes to continue to rise; advanced packaging will increase the demand for thinning and polishing equipment, and the scale of CMP equipment market demand is expected to continue to expand.
The customer resources of domestic fabs are stable, and the layout of thinning machines focuses on advanced packaging: the company's CMP equipment has entered the production lines of well-known customers such as SMIC, Changcun, Huahong, and Changxin; the technical level has broken through to 14nm, 128+ layers (NAND), 1X/1Ynm grade. In May 2023, the all-in-one machine for ultra-precision grinding, thinning, polishing, and cleaning developed by the company for the 3D IC field has been sent to leading integrated circuit companies.
Wafer regeneration and doping, wet method, and measurement equipment are expected to open a new growth curve: the company focuses on the core product CMP polishing equipment, and vigorously develops supporting wet method equipment, film thickness measurement equipment, polishing head consumables, wafer regeneration and other businesses, which are expected to Open up new growth points.