Chinese semiconductor industry

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tokenanalyst

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CETC: New energy vehicle silicon carbide MOSFET shipments break 12 million​

Recently, the shipment of 650V-1200V silicon carbide MOSFETs for new energy vehicles developed by CETC Guoji Nanfang and 55 Research Institute exceeded 12 million pieces, achieving stable supply in large quantities.

According to China Electronics Technology, silicon carbide MOSFET can greatly improve the performance of the whole vehicle. The new generation of new energy vehicle platform based on silicon carbide can increase the charging speed by 5-10 times, increase the cruising range by more than 8%, and reduce the loss by 50%. Guoji South and 55 Institute continue to promote the key core technology research and industrial application of silicon carbide MOSFETs for new energy vehicles, penetrate the mass production platform of the entire industry chain such as silicon carbide substrates, epitaxy, and chips, and take the lead in new energy vehicles, photovoltaics, and smart devices. Large-scale applications in power grids and other fields have accumulatively guaranteed the application needs of more than 1.6 million new energy vehicles.

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gelgoog

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Well, yeah, transistors stopped scaling as they used to. They are so small at this point that current leakage through the thin walls in a transistor became a problem. The only way to get better power performance is to change the transistor design itself.

First thing they did was the change to HKMG materials in planar transistors. Then they had to change geometry with FinFET at 14nm and soon will switch to GAA transistors around 2nm. Instead of getting the power performance benefit every single shrink, you only get it with each transistor architecture change. Each shrink gives you more transistors per area, but it does not mean those transistors use less energy anymore like it used to.

Right now other problems are cropping up. Logic transistors are still shrinking in area. But SRAM i.e. cache memory is not. This means eventually someone will have to come up with a replacement for SRAM which can continue shrinking in area.
 
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tphuang

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CETC: New energy vehicle silicon carbide MOSFET shipments break 12 million​

Recently, the shipment of 650V-1200V silicon carbide MOSFETs for new energy vehicles developed by CETC Guoji Nanfang and 55 Research Institute exceeded 12 million pieces, achieving stable supply in large quantities.

According to China Electronics Technology, silicon carbide MOSFET can greatly improve the performance of the whole vehicle. The new generation of new energy vehicle platform based on silicon carbide can increase the charging speed by 5-10 times, increase the cruising range by more than 8%, and reduce the loss by 50%. Guoji South and 55 Institute continue to promote the key core technology research and industrial application of silicon carbide MOSFETs for new energy vehicles, penetrate the mass production platform of the entire industry chain such as silicon carbide substrates, epitaxy, and chips, and take the lead in new energy vehicles, photovoltaics, and smart devices. Large-scale applications in power grids and other fields have accumulatively guaranteed the application needs of more than 1.6 million new energy vehicles.

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This is great. Looking at few pages back, CETC has the full supply chain for SiC. As in, it is involved with every part of the Sic module production process. 12 million SiC MOSFET is way more than I expect. I wonder who their clients are. Most importantly, by having this commercially competitive process, CETC's production for military gears will also have significantly lower costs.

Looks like it got orders for 1.6 million NEVs. That's a huge orders. Likely from multiple NEV OEMs. Maybe Huawei and some from BYD? We know Li Auto uses Infineon, so can't be them.
 
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D

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Does anybody know the state of China's electron beam lithography research? The tools are necessary for fabricating the superconducting chips used in prototype quantum computers.

SCMP reported that restrictions on quantum tech are looming and given that China now has the capability to produce the kind of extreme freezers needed for QC, E-beam lithography is the only thing the US could do that would have an effect.

It's not super pressing insofar as China already has some number of the tools installed but it will become an issue if a localized version cannot be produced.
 

FairAndUnbiased

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Does anybody know the state of China's electron beam lithography research? The tools are necessary for fabricating the superconducting chips used in prototype quantum computers.

SCMP reported that restrictions on quantum tech are looming and given that China now has the capability to produce the kind of extreme freezers needed for QC, E-beam lithography is the only thing the US could do that would have an effect.

It's not super pressing insofar as China already has some number of the tools installed but it will become an issue if a localized version cannot be produced.
e beam lithography is NOT needed for superconducting chips, in fact their feature sizes are so big that even i-line lithography can fabricate them.

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1-s2.0-S0081194708602507-gr3.jpg


Fig. 3. An electron microscope picture of a superconductor-normal-metal-superconductor junction consisting of a gold normal region (light colored) underlying two niobium “banks” (dark region). The gap distance is about 0.45 micrometers and the junction width is 1.5 micrometers.

the reason they use ebeam lithography is because the volume demand for superconducting chips is so low that its not worth wasting money making a mask for projection lithography and many universities have e-beam lithography for R&D purposes or for mask fabrication.
 
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e beam lithography is NOT needed for superconducting chips, in fact their feature sizes are so big that even i-line lithography can fabricate them.

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1-s2.0-S0081194708602507-gr3.jpg




the reason they use ebeam lithography is because the volume demand for superconducting chips is so low that its not worth wasting money making a mask for projection lithography and many universities have e-beam lithography for R&D purposes or for mask fabrication.
That paper is from 2000. Are you positive that contemporary SC chips have such large features?
 

FairAndUnbiased

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That paper is from 2000. Are you positive that contemporary SC chips have such large features?
SC chips are in the R&D and prototyping phase. there are zero mass produced commercial products. what is the purpose of shrinking the feature size when fundamental physics are being investigated?

the ones I know best are Josephson junctions, a superconductor-metal-superconductor junction. The critical point is the junction. The width of the junction must be carefully controlled - but because its a vertical structure, you can control it through deposition. Metals are deposited using highly controllable PVD. The lateral dimensions don't matter.

Non-Josephson junction superconducting chips seem to be built using even bigger feature sizes in the mm range.

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Like the transistors in a classical computer, superconducting qubits are the building blocks of a quantum computer. While engineers have been able to shrink transistors to nanometer scales, however, superconducting qubits are still measured in millimeters. This is one reason a practical quantum computing device couldn’t be miniaturized to the size of a smartphone, for instance.
 
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