Chinese semiconductor industry

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tphuang

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lol, I found the CITIC securities report summary of data centers since 2021 and whose GPUs they used. Aside from Tencent, Alibaba & Baidu, which most likely will never use Huawei GPUs, almost everyone else used Huawei GPUs. Which would confirm the viewpoint by many that Ascend GPUs are best AI chips in China in production for the past couple of years. I guess with Cambrian winning a couple of times. The part that Huawei won works out to be almost 8 EFLOPS
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2000 Ascend 910 GPU produces 640PFLOPS of FP16 computation need 2+ months, so each is 320 TFLOPS of FP16

Considering that A100 supports 300 TFLOPS, it really backs up the theory that Ascend-910 for the past couple of years was the closest China had to A100.


Again 8x Ascend 910 is 2.56 PFLOPS of FP16 computation. Used in Changsha & Chongqing


For example, if beijing was to expand from 100 to 500 FLOPS, would need 156 AI training servers of 8x Ascend-910 GPU

Also has this company that's core partner of Huawei which build intelligent server machines using Kunepng + Huawei chips to provide 128 core computation (so maybe 2x64 core Kunpeng-920 with 8 Ascend 910). Already migrated over 15000 of such cloud server and manage over 10000 such server. So looks like they've sold a lot of these GPUs and have large contracts to expand enough more. This part is not for smart city but rather just medium large enterprises.

As we all know, the past couple of years have been tough for HW, but can things turn around for at least its Hisilicon division when Ascend deliveries installations ramp up? I think they could.

As an example, it looks like HW has 8 EFLOPS over a couple of years. Let's say it sells 5 EFLOPS of GPUs a year and consumes another 5 EFLOPS for personal use. For reference, I think it was Megvil that said you need 10000 A100 to have a competitive GPT platform. That works out to 3.2 EFLOPS. Given the craze over GPT, I don't think 5 EFLOPS for internal usage + 5 EFLOPS for external sales is that crazy.

Let's see how much 5 EFLOPS would cost. It would work out to be around 15000 Ascend 910 GPUs (since each is about 320 TFLOPS)

if we get a Ascend 920 that does 800 TFLOPS (which is where H100 is at), then that's would require 6000 Ascend 920

How much would that cost? well according to this
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Each A100 retails for about 12k at least and H100 at least 33k.

Let's say HW GPUs are a little cheaper so 12k for Ascend 910 & 30k for Ascend 920. Also in both cases, they come with not just the GPUs, but the HBM memory and whatever else GPGPU needs and all the support.

12000 * 15k = 180 million
30k * 6k = 180 million

In both cases, I think HW can make $180 million from just the GPUs and this is not even counting all the software platform and such associated with setting up the data centers and also the CPUs, server racks and such.

If HW needs 10 EFLOPS between external & internal sales? That would be about 30k Ascend 910 or 12k Ascend 920.

How many GPUs can you fit on a 12-inch wafer? Let's say they stack 2 die of about 600mm2 (similar to Biren). Each die will be around 25x25. on a 150mm diameter, you can fit 5 across. Works out to be about 80 per wafer. If we assume 60% yield at this point (TSMC is at low 60s right now for 3nm based on report) for a very highly complex wafer, then you get about 50 good die per wafer -> 25 Ascend 920. To get 12000, you will need just 500 wafers. That's really not a lot.

Let's say China really hit the accelerators with 40 EFLOPS a year and 3/4 of that demand ends up with Ascend GPUs. Even with that, we are looking at just 1500 wafers a year and just a couple of billion $ in revenue for HW. Maybe I'm overcounting the # of GPU die you can fit per wafer. But even if you can only get 20 good die per wafer, 10 Ascend 920, you are still just looking at most 5000 wafers, which is not all that much.

In another year of two, if SMIC can do 5nm production, even if it's only 3k wpm, that's enough to handle all the most important HPC needs of Chinese data centers. It's the mobile SoC that tend to use up all of TSMC capacity. At some point, SMIC will need to get into that business too.
 

FairAndUnbiased

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Your other post indicates that tin doesn't absorb well at fiber laser wavelengths. Do I have that right? If this is a solvable problem, why haven't current LPP-EUV systems used fiber driving lasers given they're much easier than CO2 lasers?
High power (10 kW+) fiber lasers did not exist until 2009.

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LPP EUV was already at very late stage develop by then. ASML came out with the R&D scale production tool in 2010.

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In 2010, we shipped the first prototype Extreme Ultraviolet (EUV) lithography tool (NXE:3100) to the research facility of an Asian chipmaker, marking the beginning of a new era in lithography.
They're not going to change decades of development work for something that came out 1 year before the production model ships.
 

ZeEa5KPul

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High power (10 kW+) fiber lasers did not exist until 2009.

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LPP EUV was already at very late stage develop by then. ASML came out with the R&D scale production tool in 2010.

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They're not going to change decades of development work for something that came out 1 year before the production model ships.
So fiber lasers are a feasible path to LPP-EUV? Nice. I don't know what's ultimately going to win out, but more options is always a good thing. LOL, maybe Norinco could get in on the action and point this at a tin droplet generator
Silent-Hunter-1.jpg
 

bzhong05

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Production data for ICs, which covers companies with an annual turnover above 20 million yuan (US$2.9 million), showed 3.8 per cent year-on-year growth to 28.1 billion units in April, the first monthly increase since January 2022, according to data released by the National Bureau of Statistics (NBS) on Tuesday.

The increase came after March output recorded a decline of just 3 per cent from a year ago, compared with the 17 per cent year-on-year drop in the first two months, pointing to a recovery in chip production in the world’s largest semiconductor market.

The uptick in output comes at a time when China’s chip imports from South Korea and Taiwan have plunged, reflected in the overall IC import data. In the first four months of the year, China’s total IC imports shrank 21 per cent from a year ago to 146.8 billion units, according to data released last week by the General Administration of Customs.
 

tokenanalyst

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Youlun Vacuum received investment, focusing on the field of semiconductor thin film deposition equipment​


Recently, Suzhou Youlun Vacuum Equipment Technology Co., Ltd. (hereinafter referred to as "Youlun Vacuum") has received investment from Su Venture Capital and Guofa Venture Capital. This round of financing will mainly help new product development, market promotion and team building wait.

According to news from Youlun Vacuum, the company was established in 2016. It is an enterprise focusing on the development and application of semiconductor thin film deposition equipment. Its products mainly include mass production models of evaporation coating machines, vacuum sintering furnaces, large-capacity evaporation coating machines, and small testing machines. , sputtering machine, precision machining business, consumables business, etc., are widely used in power devices, LEDs, optical communications, sensors, semiconductors, filters and other fields, providing solutions for high-end thin film deposition, PVD thin film deposition, and gas automation .

According to the news from Guofa Venture Capital, the application of Youlun vacuum products covers semiconductors, optics, photovoltaics, scientific research and other fields, and has gradually been introduced to many leading customers in many industries such as Silan Micro.

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latenlazy

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that is a huge amount of cooling water and power draw. For 25 kW CO2 laser power, 400 kW is a incredible amount of power to draw into a single tool, and 375 kW of heat is an incredible amount of power dissipated.

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Fiber lasers are also intrinsically easier to modulate than CO2 lasers. A fiber driven LPP-EUV source would be cabbagizing it.
Not just easier to modulate. Seems that it would be much easier to scale power too. Also sounds like if they can do dual wavelength or tunable outputs that might help them optimize the pre pulse and main pulse for tin excitation separately. The multiple fiber laser approach has imo been the most interesting development in China’s EUV push because it would represent a better novel implementation of a technology that’s already on the market. You get to see a more direct comparative example of Chinese engineering compared to foreign engineering design approaches for the same type of device.
 

tokenanalyst

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Sanhuan Group will build an analysis and testing center for advanced materials and components in Suzhou​


According to news from Jiwei.com, on May 16, the groundbreaking ceremony for Suzhou Sanhuan Technology Co., Ltd. and the East China R&D Headquarters of Sanhuan Group was held in Wuzhong District.

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It is reported that Chaozhou Sanhuan (Group) Co., Ltd. was established in 1970 and is one of the production bases of electronic components and new materials in my country. The company takes "material + structure + function" as its development direction, and its products include ceramic ferrules for optical communications, alumina ceramic substrates for chip resistors, semiconductor ceramic packaging bases, etc. Intelligent terminals and many other application fields. In 2022, Suzhou Sanhuan Technology Co., Ltd., a wholly-owned subsidiary of Sanhuan Group, was established.

According to the news released by Wu Zhong, Tri-Ring Group will build the Suzhou Research Institute of Tri-Ring Group in Wuzhong District, Suzhou . R&D and production help solve the core technical problems of national key electronic components and semiconductor key components and materials. Suzhou Sanhuan Research Institute will make full use of a series of industrial chain supporting resources such as semiconductors, advanced materials, and new energy in East China to build a leading domestic advanced material and component analysis and testing center to provide technical support for basic material research and development and manufacturing.​

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