Chinese semiconductor industry

On April 26, the first technology-based company incubated by the Jinan Research Department of the Institute of High Energy Physics, Chinese Academy of Sciences (Jinan Institute of Nuclear Technology), Ruiying Testing Technology (Jinan) Co., Ltd. (hereinafter referred to as "Ruiying Testing") ) The fully automatic IGBT defect X-ray three-dimensional detection equipment independently developed was officially unveiled at the Hunan Province Power Semiconductor Industry Matchmaking Conference and the Eighth International Academic Forum of the Power Semiconductor Industry Alliance. Relying on X-ray computed tomography (CL) technology and advanced defect intelligent detection software algorithm, the equipment provides a new non-destructive testing solution for IGBT module packaging and testing. Dr. Liu Baodong, associate researcher of the Institute of High Energy Physics, Chinese Academy of Sciences and general manager of Ruiying Testing, was invited to give a report at the conference.

The equipment is based on X-ray computer tomography technology, and artificial intelligence (AI) algorithm is introduced into the detection system, which can automatically identify and sort unqualified products, realize the fully automatic online non-destructive testing of IGBT modules, and store real-time data feedback , effectively solves the difficulty of inaccurate X-ray 2D detection caused by double-layer solder superposition and heat dissipation columns, greatly improves the detection efficiency, and ensures the product quality of the IGBT module.

Zhonghua Precision Testing (6510) held the 2023 first quarter operation briefing meeting today (27). During the meeting, Huang Shuike, the general manager, announced that starting from this month, it will officially enter the panel driver IC test market. The newly launched DDI-specific MEMS probe The pin card will be matched with the "one card for two cards" service, providing one-day warranty repairs, allowing panel driver IC manufacturers to change the old habit of purchasing additional cards in order to improve the efficiency of traditional probe card testing.
Zhonghua Jingce pointed out that the panel-integrated driver chip ( DDI ) plays a key role in quickly lighting up the panel and perfectly presenting the latest image status. All of them are actively launching high-speed transmission layout at this time to prepare energy for the next wave of industry growth.
Zhonghua Precision Test explained that traditional probe cards are affected by physical limitations, and are prone to failure and interruption of the test process when measuring high-speed signals, while MEMS probe cards have inherent advantages in high-speed measurement.
Zhonghua Precision Testing emphasizes that the company has the technical capability of All-In-House , and has successfully launched a self-made MEMS probe card. The stability of high-speed and high-frequency chips has been successfully demonstrated by a number of application chips, including mobile phone application processors ( AP ), High Performance Computing ( HPC ), Computer Application Processor ( CPU ), Graphics Processing Unit ( GPU ), Flash Memory Control Chip ( NAND Flash Controller ) and other customized chips.
Zhonghua Precision Measurement is optimistic. The self-produced MEMS probe card launched by DDI this month has the technical level of measuring 4Gbp/s . In the future, it will cooperate with the panel driver IC industry to break through the measurement bottleneck of high-speed transmission and help video displays achieve high-speed transmission of video signals. Low-latency viewing experience.​