Chinese semiconductor industry

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Jingchuang Advanced has completed hundreds of millions of yuan in B+ round financing, focusing on independent innovation of semiconductor precision grinding equipment​


A few days ago, Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. (hereinafter referred to as "Jingchuang Advanced") completed the B+ round of financing. This round of financing was led by Qiming Venture Capital, Shenzhen Venture Capital, Guofa Venture Capital, Changshu Guofa, Jingkai Guofa , Nanjing Xingong Industrial Investment, Soochow Venture Capital and other joint investment. This round of financing will mainly help new technology breakthroughs, new product development, fully automatic product capacity expansion, marketing promotion and brand building, etc.

Founded in 2013, Jingchuang Advanced Technology Co., Ltd. is a high-tech enterprise specializing in R&D, production, sales and service of semiconductor precision cutting, grinding and polishing equipment.

For a long time, semiconductor precision cutting, grinding and polishing equipment have been in a situation where the entire value chain has been monopolized by foreign countries. The core personnel of Jingchuang Advanced Founding Team have been deeply involved in the industry for more than 20 years. They have excellent related technologies and rich experience. It attaches great importance to this direction, and is committed to developing and promoting the independent innovation process in the subdivision of semiconductor precision cutting, grinding and polishing equipment.

Jingchuang Advanced has successfully taken the lead in realizing the independent innovation of the industrialization of the 12-inch fully automatic precision scribing machine, and in the main channel of scribing equipment (providing various scribing equipment from 6-12 inches semi-automatic to fully automatic to meet different needs) In addition to the precision scribing requirements of industrial applications), the product line has expanded to JIG SAW equipment, thinning equipment and other advanced manufacturing processes and other professional semiconductor equipment fields. Jingchuang's advanced team ensures the long-term maintenance and maintenance of the high precision of the whole machine through multiple core technologies such as 3D simulation design technology, precision machining and heat treatment technology of high-precision machines, multi-dimensional motion control linkage optimization technology, geometric error software algorithm compensation technology, etc. reliability.

At the same time, relying on a large number of customer needs and precision slitting process experimental data accumulated in this field for many years, the underlying algorithm and software design of the human-computer interaction interface based on this are also the key to the industrialization of equipment. At present, Jingchuang advanced series products have been applied in batches to the complex and precise cutting of various semiconductor materials or pan-semiconductor materials, and are widely used in semiconductor integrated circuits, GPP/LED gallium nitride and other chips, discrete devices, LED packaging, optical communication devices , SAW devices, MEMS and other chips are in production.

Due to the diversity of semiconductor market demands, the rapid development of technology, and the ultra-high precision characteristics of semiconductor equipment, it is difficult to achieve mass production in a pipeline. Therefore, two problems will be encountered in the process of industrialization: one is how to achieve high precision of the whole machine while ensuring efficient and stable output; the other is how to quickly and efficiently deliver customer customized requirements due to process differences. Gao Yang, vice president of R&D of Jingchuang Advanced, pointed out, "The current plan adopted by Jingchuang Advanced is to improve the versatility of parts, use modular design to achieve efficient interchange, reduce the difficulty of process control, and be more conducive to standardized operations; The strategic cooperation with high-quality suppliers and the modularization scheme in the form of OEM have obvious effects on the quality control of the whole machine, the improvement of installation efficiency and the increase of production capacity."​

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Manufacturing & equipment​


Passion Intelligence drew
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(CNY 100.0M is ~$14.6M) in a Series B round led by SAIF Partners, joined by China Securities Investment and Yinxinggu Capital. Passion IoT makes materials handling solutions for fabs and warehouses, including semiconductor automatic material handling systems (AMHS), wafer cassette storage equipment, solder paste storage and warming cabinets, automated guided vehicles, and sorting robots. It also offers manufacturing execution system (MES) and warehouse management system (WMS) software. Funds will be used for R&D, global expansion, and supply chain improvements. Founded in 2006, it is based in Suzhou, China.

MCT Semiconductor drew CNY 15.0M (~$2.2M) in pre-Series A+ financing from Zhihua Investment Partnership and others. The company has developed a
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used to deposit thick metal layers on a wafer. It can be used for through-silicon via filling in advanced packaging, fan-out structures, MEMS solenoids, and RF devices. MCT says the process is simple with faster deposition speed compared to electroplating and is suitable for manufacturing complex three-dimensional structures. It can use non-toxic alloy materials such as tin, silver, and indium while reducing the amount of material used. MCT plans to expand its solenoid coil business into magnetic sensors, micro-drives, energy harvesting, and power magnetic devices. Currently, the company doesn’t sell its equipment, and instead manufactures products and provides services. Funds will be used for mass production and new product development. Founded in 2018, it is based in Shanghai, China.

Auto SysLife Technology drew
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(CNY 10.0M is ~$1.5M) in pre-Series A funding from Maizun Capital. The company makes
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and programmable logic controllers for a variety of industries, including semiconductor and electronics manufacturing. Founded in 2018, it is based in Wuxi, China.

GP Nano raised tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series A funding led by Shenzhen Guozhong Venture Capital Management. The startup provides additive manufacturing services for integrated circuits and systems. Its high-precision inkjet printing technology and self-developed metal ink materials can print 1-50μm line widths on flexible and curved surfaces. It uses hydrophilic and hydrophobic guides to control the movement of ink. It is initially targeting applications like glass-based fingerprint sensors, flexible sensors, and integrated passive device antennas. Funds will be used to expand production line capacity and for R&D. Founded in 2020, it is based in Foshan, China.

Weiyun Semiconductor drew tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series A financing from Sunic Capital and Nuoyan Capital. The startup makes
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for manufacturing compound semiconductors, MEMS, and power devices. Funds will be used for R&D and procurement of equipment and raw materials. Founded in 2021, it is based in Shanghai, China.

Xihua Technology raised tens of millions of yuan (CNY 10.0M is ~$1.5M) in angel funding from Zhengxuan Investment. The startup provides precision diamond cutting and grinding blades and equipment for wafer slicing. Founded in 2021, it is based in Chengdu, China.

YBrilliant Optoelectronic drew tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series A funding from SIDVC, SND Ventures Group, Tsing-Yuan Capital, and others. The company provides high-power and high-energy femtosecond lasers and customized optoelectronic modules for semiconductor and electronics manufacturing, communications, and medical equipment. Funds will be used to purchase equipment, expand the production line, and hire. Founded in 2021, it is based in Suzhou, China.

Zooming Intelligent Technology drew
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(CNY 10.0M is ~$1.5M) in angel funding from Cowin Capital and Sharelink Capital. The startup makes automatic material handling systems (AMHS) for 12-inch semiconductor fabs. Currently, the company is working on development of stockers and overhead hoist transport (OHT) systems. It is also planning software to connect material control systems with manufacturing execution systems. Funds will be used for R&D, preparation for mass production, and international expansion. Founded in 2020, it is based in Suzhou, China.

 

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Test, measurement & inspection​

Semishare raised
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led by Goldport Capital with participation from Shenzhen High-tech Investment and others. Semishare manufactures high-performance wafer probe stations ranging from manual to highly automated. Its latest is a wafer acceptance test and circuit probing (WAT/CP) machine for 8-inch and 12-inch wafers with automatic loading and unloading of wafers, micron-level full-closed-loop motion control, automatic wafer alignment, automatic vision calibration, high-speed feedback communication, and data processing. The company also provides laser repair systems for display panels. Funds will be used to increase R&D in advanced wafer test platforms and core industrial software as well as for international expansion. Founded in 2010, it is based in Shenzhen, China.

BoPixel drew nearly CNY 50.0M (~$7.2M) in angel financing from Invent Investment and Zhaohui Capital. BoPixel offers
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, including semiconductor front-end inspection, packaging inspection, and consumer electronics. Its products include 3D cameras, deep ultraviolet ultra-high-speed cameras, high-speed 9K TDI line scan cameras, and high-precision DLP systems. A particular application of its 3D camera system is detection of BGA solder ball height, volume, flatness, and spacing. Other fields the company targets include batteries, photovoltaics, and automotive. Funds will be used for product iteration and market development. Founded in 2022, it is based in Beijing, China.

Giantest raised tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series B financing led by Leaguer Capital, joined by Addor Capital, Bangming Investment Management, and Nantong Science and Technology Investment. Giantest provides IC test services, including test solution development, test hardware development, wafer test, chip finished product test, chip reliability verification, failure analysis, and system level testing. Funds will be used for construction of high-end test production lines and laboratories. Founded in 2018, it is based in Nantong, China.

Gongyuan Sanqian Technology received tens of millions of yuan (CNY 10.0M is ~$1.5M) in pre-Series A funding from Atom Ventures, Guolian Financial Investment, and HGTech. The startup provides non-destructive X-ray inspection and defect detection equipment for power semiconductors, circuit boards, consumer electronics, and batteries. Funds will be used for delivery of equipment and hiring. Founded in 2021, it is based in Beijing, China.

Hairuisi Automation Technology received tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series A financing from Shenzhen Venture Capital. The company makes equipment for testing the
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of consumer electronics and automotive electronics. Funds will be used to develop new product lines. Founded in 2008, it is based in Shenzhen, China.

Phxflys Technology drew tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series A financing from Cloud Capital. The startup provides
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for SSDs, UFS, and NAND devices. It can perform high and low temperature, NVMe protocol, PCIe link, power down, and system level test. Funds will be used for R&D. Founded in 2021, it is based in Shanghai, China.

Materials​

Jiangsu Shekoy Semiconductor New Material received a
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from Huatai Securities. The company manufactures precursors, photoresists, and supporting reagents for semiconductor and display panel manufacturing. A subsidiary of Jiangsu Yoke Technology, it was established in 2016 and is based in Wuxi, China.

TYSiC, also known as Tianyu Semiconductor, raised CNY 1,200.0M (~$176.7M) in pre-IPO financing from Guangdong Jiayuan Technology, China-Belgium Direct Equity Investment Fund, Guangdong Science and Technology Venture Capital, China Merchants Capital, and others. TYSiC manufactures
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. It currently offers 4-inch and 6-inch wafers for power devices from 600V up to 3300V and is working on a production line for 8-inch wafers. It also provides epitaxial film foundry services as well as substrate and wafer inspection and wafer cleaning services. Funds will be used to expand production line capacity and for R&D, particularly for large-scale epitaxial growth of silicon carbide. Founded in 2009, it is based in Dongguan, China.

Juci Technology received tens of millions of yuan (CNY 10.0M is ~$1.5M) from BYD and Ferrotec. Juci offers high-purity
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and ceramic products for semiconductor packages and manufacturing equipment. Founded in 2016, it is based in Xiamen, China.

Changhuo Microelectronics received Series A financing from Co-Power PE. The company makes
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for heterojunction photovoltaic cells, displays, and other applications. Founded in 2021, it is based in Shanghai, China.

Fuyang Sineva received strategic investment from display company BOE Technology Group. The company makes KrF and ArF
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, OLED materials, semiconductor wet electronic chemicals, and other specialty materials. Funds will be used for R&D and to expand production. A subsidiary of Sineva Group, it was founded in 2013 and is based in Fuyang, China.

Hongfucheng New Materials (HFC) received an investment from SDIC Venture Capital. The company makes carbon-based
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, EMI shielding materials, and combined thermal and electromagnetic absorption materials for use in consumer electronics, network equipment, and automotive. Founded in 2003, it is based in Shenzhen, China.

TankeBlue Semiconductor closed a pre-IPO financing round from Jingming Hongrui Industrial Fund, Lijin Mingke Industrial Fund, and Qingdao Huizhu Yingcai Industrial Fund. TankeBlue manufactures
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and prepares them for epitaxy. It offers 4H N-type wafers and 4H semi-insulating wafers. The company also sells SiC single crystal growth equipment for 4-inch and 6-inch crystals and provides services for SiC ingot slicing, wafer lapping, CMP, and cleaning, as well as reclaim of epitaxial wafers. Founded in 2006, it is based in Beijing, China.

EDA​

Peifeng Tunan Semiconductor raised new financing from Huawei Hubble and others. The startup develops manufacturing-focused EDA software and services, including optical proximity correction (OPC), process simulation and device modeling TCAD, yield analysis, design for manufacturability (DFM), design technology co-optimization (DTCO), and PDK development. Founded in 2021, it is based in Suzhou, China.

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Xiamen Juci Technology Co., Ltd. is an innovative high-tech enterprise dedicated to the R&D, production and sales of high-quality aluminum nitride powder and ceramic products. The core team is composed of well-known experts in the domestic aluminum nitride industry, former executives of listed companies and industry sales elites, with more than 10% of them having doctoral degrees.
Relying on the research achievements of Beijing University of Science and Technology in the field of aluminum nitride, the company has won many honors, such as the "Second Prize of National Science and Technology Invention", the "First Prize of Scientific and Technological Invention in China's Nonferrous Metal Industry", the "First Prize of National Innovation and Entrepreneurship Competition New Material Industry Finals", and the "National High-tech Enterprise".
The company's main products include high-purity aluminum nitride powder, aluminum nitride granule, aluminum nitride filler and injection molding complex precision aluminum nitride ceramic products, which have been recognized and praised by customers in China and abroad.

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Aluminum Nitride for semiconductor manufacturing equipment parts.

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