Test, measurement & inspection
Semishare raised
led by
Goldport Capital with participation from
Shenzhen High-tech Investment and others. Semishare manufactures high-performance wafer probe stations ranging from manual to highly automated. Its latest is a wafer acceptance test and circuit probing (WAT/CP) machine for 8-inch and 12-inch wafers with automatic loading and unloading of wafers, micron-level full-closed-loop motion control, automatic wafer alignment, automatic vision calibration, high-speed feedback communication, and data processing. The company also provides laser repair systems for display panels. Funds will be used to increase R&D in advanced wafer test platforms and core industrial software as well as for international expansion. Founded in 2010, it is based in Shenzhen, China.
BoPixel drew nearly CNY 50.0M (~$7.2M) in angel financing from
Invent Investment and
Zhaohui Capital. BoPixel offers
, including semiconductor front-end inspection, packaging inspection, and consumer electronics. Its products include 3D cameras, deep ultraviolet ultra-high-speed cameras, high-speed 9K TDI line scan cameras, and high-precision DLP systems. A particular application of its 3D camera system is detection of BGA solder ball height, volume, flatness, and spacing. Other fields the company targets include batteries, photovoltaics, and automotive. Funds will be used for product iteration and market development. Founded in 2022, it is based in Beijing, China.
Giantest raised tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series B financing led by
Leaguer Capital, joined by
Addor Capital,
Bangming Investment Management, and
Nantong Science and Technology Investment. Giantest provides IC test services, including test solution development, test hardware development, wafer test, chip finished product test, chip reliability verification, failure analysis, and system level testing. Funds will be used for construction of high-end test production lines and laboratories. Founded in 2018, it is based in Nantong, China.
Gongyuan Sanqian Technology received tens of millions of yuan (CNY 10.0M is ~$1.5M) in pre-Series A funding from
Atom Ventures,
Guolian Financial Investment, and
HGTech. The startup provides non-destructive X-ray inspection and defect detection equipment for power semiconductors, circuit boards, consumer electronics, and batteries. Funds will be used for delivery of equipment and hiring. Founded in 2021, it is based in Beijing, China.
Hairuisi Automation Technology received tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series A financing from
Shenzhen Venture Capital. The company makes equipment for testing the
of consumer electronics and automotive electronics. Funds will be used to develop new product lines. Founded in 2008, it is based in Shenzhen, China.
Phxflys Technology drew tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series A financing from
Cloud Capital. The startup provides
for SSDs, UFS, and NAND devices. It can perform high and low temperature, NVMe protocol, PCIe link, power down, and system level test. Funds will be used for R&D. Founded in 2021, it is based in Shanghai, China.
Materials
Jiangsu Shekoy Semiconductor New Material received a
from
Huatai Securities. The company manufactures precursors, photoresists, and supporting reagents for semiconductor and display panel manufacturing. A subsidiary of Jiangsu Yoke Technology, it was established in 2016 and is based in Wuxi, China.
TYSiC, also known as
Tianyu Semiconductor, raised CNY 1,200.0M (~$176.7M) in pre-IPO financing from
Guangdong Jiayuan Technology,
China-Belgium Direct Equity Investment Fund,
Guangdong Science and Technology Venture Capital,
China Merchants Capital, and others. TYSiC manufactures
. It currently offers 4-inch and 6-inch wafers for power devices from 600V up to 3300V and is working on a production line for 8-inch wafers. It also provides epitaxial film foundry services as well as substrate and wafer inspection and wafer cleaning services. Funds will be used to expand production line capacity and for R&D, particularly for large-scale epitaxial growth of silicon carbide. Founded in 2009, it is based in Dongguan, China.
Juci Technology received tens of millions of yuan (CNY 10.0M is ~$1.5M) from
BYD and
Ferrotec. Juci offers high-purity
and ceramic products for semiconductor packages and manufacturing equipment. Founded in 2016, it is based in Xiamen, China.
Changhuo Microelectronics received Series A financing from
Co-Power PE. The company makes
for heterojunction photovoltaic cells, displays, and other applications. Founded in 2021, it is based in Shanghai, China.
Fuyang Sineva received strategic investment from display company
BOE Technology Group. The company makes KrF and ArF
, OLED materials, semiconductor wet electronic chemicals, and other specialty materials. Funds will be used for R&D and to expand production. A subsidiary of Sineva Group, it was founded in 2013 and is based in Fuyang, China.
Hongfucheng New Materials (HFC) received an investment from
SDIC Venture Capital. The company makes carbon-based
, EMI shielding materials, and combined thermal and electromagnetic absorption materials for use in consumer electronics, network equipment, and automotive. Founded in 2003, it is based in Shenzhen, China.
TankeBlue Semiconductor closed a pre-IPO financing round from
Jingming Hongrui Industrial Fund,
Lijin Mingke Industrial Fund, and
Qingdao Huizhu Yingcai Industrial Fund. TankeBlue manufactures
and prepares them for epitaxy. It offers 4H N-type wafers and 4H semi-insulating wafers. The company also sells SiC single crystal growth equipment for 4-inch and 6-inch crystals and provides services for SiC ingot slicing, wafer lapping, CMP, and cleaning, as well as reclaim of epitaxial wafers. Founded in 2006, it is based in Beijing, China.
EDA
Peifeng Tunan Semiconductor raised new financing from
Huawei Hubble and others. The startup develops manufacturing-focused EDA software and services, including optical proximity correction (OPC), process simulation and device modeling TCAD, yield analysis, design for manufacturability (DFM), design technology co-optimization (DTCO), and PDK development. Founded in 2021, it is based in Suzhou, China.