Well it doesn't help spending a decade designing those processes around the tools of unreliable companies and then having to redesign them again using domestic tools, developing a local supply chain it will take longer if there is never a positive feedback and a virtuous cycle. This tools are not develop in a vacuum.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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"Under pressure, Samsung reportedly is considering building a memory chip plant at its new US factory currently under construction in Taylor, Texas.
SK Hynix is also considering diversifying its global production facilities away from China. The company has already announced that it will build a chip packaging plant and a research center in the US.
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), the world’s largest foundry player, is building a new chip factory in Arizona.
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The US Commerce Department on Tuesday began receiving applications for semiconductor manufacturing subsidies under the $53 billion Chips Act with conditions that the recipients do not make new, high-tech investments in China or other “countries of concern” for at least a decade.
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Companies receiving more than $150 million in grants are also required to pay the US government a portion of their profits if their facilities are more profitable than projected.
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Under the guidelines, the US government will demand companies receiving subsidies to turn over their account books, a list of their staple products and the names of key clients during the screening process – all of which are often business secrets."
China needs to apply counter sanctions on something like this. This is clear anti-competitive behavior.
so a little more here
The story about domestic tool makers seeing reduced orders from YMTC was refuted by at least some SME makers here. I guess some have said the delivery time got pushed back a little bit.
This other part would seem to indicate that although net profit growth guidance has been lowered YoY, it doesn't seem to have gone the other direction as we might expect. This would indicate that although they are suffering and have lost some people, they are at least still able to see real growth in the future. Things are maybe not as dire as I had feared a month ago.
But the most optimistic news is that they are increasing registered capital by this much. It would indicate they are getting money ready to significantly increase production in 2 or 3 year time. With America knee capping SK and Samsung in China, it does open door for all Chinese memory chip makers.
If we look at their product, this latest one by 七彩虹 is industry leading in I/O speed. So even if they don't grow for 2 years, they will be fine long term.
but for YMTC (and other memory chipmakers), this is probably even more concerning.
The market is just weak right now. They have to constantly drop prices because there is too much inventory.
They should complain at the WTO and hold them accountable.
Are they exporting their chips? They can flood the market and take market share away from the adversarial competition.
Their own SSDs are sold on JD, but they produce SSDs for a variety of vendors out there. You can search this thread for examples. If any of those vendors on pc/phone get sold outside of China, then they will be exported.
Think about it this way when it comes to Chinese chip market. It's huge. And the reason is because they are selling consumer electronics and other manufactured products like cars to other countries. So even if Chinese chipmakers just sell to domestic companies, they are effectively exporting a lot of chips.
Tongfu Microelectronics: Full support for customers' 5nm product introduction has been completed and gradually mass-produced
Tongfu Microelectronics stated on the investor interaction platform on March 2 that the company started the strategy of "based on 7nm and advanced 5nm", carried out in-depth research and development of new 5nm products, and fully supported the introduction of customers' 5nm products. The high-end advancement of major customers, we are confident that we can meet the packaging and testing needs of major customers after the advanced chip manufacturing process in the future. With the relevant advanced packaging and testing technology, we will strive to achieve mass production as soon as possible.
It is understood that Tongfu Microelectronics is mainly engaged in integrated circuit packaging and testing business. Its customers include most of the world's top 20 semiconductor companies and most of the domestic well-known integrated circuit design companies. It fully supports the diversified development of customers and meets the diverse needs of customers.
At present, in the field of high-performance computing, Tongfu Microelectronics has built the domestic top 2.5D/3D packaging platform (VISionS) and super-large-size FCBGA R&D platform, and has completed the development of high-level rewiring technology. At the same time, it can provide customers with wafer-level and Substrate-level chipet packaging and testing solutions. In the field of memory, the multi-layer stacked NAND Flash and LPDDR packaging achieved stable mass production, and at the same time, it was the first in China to complete the development of 3DS DRAM packaging based on TSV technology.
Tongfu Microelectronics stated on the investor interaction platform on March 2 that the company started the strategy of "based on 7nm and advanced 5nm", carried out in-depth research and development of new 5nm products, and fully supported the introduction of customers' 5nm products. The high-end advancement of major customers, we are confident that we can meet the packaging and testing needs of major customers after the advanced chip manufacturing process in the future. With the relevant advanced packaging and testing technology, we will strive to achieve mass production as soon as possible.
It is understood that Tongfu Microelectronics is mainly engaged in integrated circuit packaging and testing business. Its customers include most of the world's top 20 semiconductor companies and most of the domestic well-known integrated circuit design companies. It fully supports the diversified development of customers and meets the diverse needs of customers.
At present, in the field of high-performance computing, Tongfu Microelectronics has built the domestic top 2.5D/3D packaging platform (VISionS) and super-large-size FCBGA R&D platform, and has completed the development of high-level rewiring technology. At the same time, it can provide customers with wafer-level and Substrate-level chipet packaging and testing solutions. In the field of memory, the multi-layer stacked NAND Flash and LPDDR packaging achieved stable mass production, and at the same time, it was the first in China to complete the development of 3DS DRAM packaging based on TSV technology.
lol, customer as in AMD?
The natsec people are going to go crazy when realize AMD chips are all getting packaged in China.
Tongfu own a factory in Penang,Malaysia
btw Inspur is the big one here. I'm surprised no one has commented on it. I actually thought they already got sanctioned from back a couple of years ago
but maybe the shipment resumed and they are under even tighter microscope now?
Either way, they have been pretty aggressive in working at bringing domestic CPU/GPU players to their platform in the past couple of years. Just not sure if there is enough volume production there to satisfy their needs.
I saw Loongson stock up over 6% today despite being put on the entity list.
Clearly, people see LS as a big winner here with orders from both Inspur and other Chinese tech giants that are likely to get sanctioned at some point.
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