Chinese semiconductor industry
- Thread starter Hendrik_2000
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Yes they will need time to qualify domestic tools, and what better time than a downturn? In particular, the more challenging tools should be qualified now.
Most memory company sales aren't for privately bought SSDs, it's all about enterprise sales. As long as YMTC can get a few big enterprise sales like Huawei, it's all good.
Sounds incredibly complex. Correct me if I'm wrong, I don't remember anymore, but wasn't Intel having foundry issues for so long in part due to the complexity invovled with multiple patterning?
havok：碳化硅材料在光刻机上用途很广，比如早期工件台样机方镜的材料是微晶玻璃（图片尖头所指淡黄色方形部件）现在可以用碳化硅陶瓷材料取代
havok：Silicon carbide materials are widely used in lithography machines. For example, the material of the square mirror of the early workpiece platform prototype is glass-ceramic (the light yellow square part pointed by the pointed head in the picture) can now be replaced by silicon carbide ceramic materials.
havok：Silicon carbide materials are widely used in lithography machines. For example, the material of the square mirror of the early workpiece platform prototype is glass-ceramic (the light yellow square part pointed by the pointed head in the picture) can now be replaced by silicon carbide ceramic materials.
Yes is more complicated than single or double patterning, but Low NA EUV still require multiple patterning with lower performance per tool at a higher cost per tool and materials, I guess today is not far away from SAQP immersion. In 2017 was more costly. That could change drastically with the arrival of high-NA EUV lithography.
Kunlun's R220 accelerator card has been validated on OpenCloudOS OS. This cloud open source OS was formed in Dec 2021 with 20 manufacturers/users including Tencent, Baode, Loongson, Phytium, Zhaoxin & Inspur. Now that are 500+ partners in ecosystem. R200 is widely used in internet, smart finance, smart parks, smart communication & other apps. It supports video encoding/decoding, various AI tasks like NLP, ML, speech & such. Like with IC production tools, customers need to test, certify & verify new GPUs with AI framework before replacing Nvidia. More to AI than just GPU spec.
So I think it's important to note that if you are wondering why Biren hasn't seen more news. It takes time to fully validate and work out bugs with new customers. Every kind of developed their system around CUDA and Nvidia. It takes time for different customers to use domestic GPUs and CPUs.
So I think it's important to note that if you are wondering why Biren hasn't seen more news. It takes time to fully validate and work out bugs with new customers. Every kind of developed their system around CUDA and Nvidia. It takes time for different customers to use domestic GPUs and CPUs.
Keep in mind that there is more to see in this particular GPU.
Many other domestic GPU makers like Moore Threads use architectural license from Imagination PowerVR. It's not easy to develop GPU all by yourself like Loongson and IDM GPU is doing.
EUV lithography or overlay nanoimprint lithography for MRAM manufacturing.
Research note on NAURA from 20230201
There are some other stuff in there worth checking out.
After October surprise, Nov orders were average and Dec orders were good. SMIC Jingcheng orders are picking up. 2022 new orders are 60% up from 2021. 2022 orders basically covers 2023 Q3 revenue. export restrictions & consumption weakness effects are yet to be seen. will need to wait until end of Q1 to determine if Q4 revenue will be affected.
upstream capex depends on lithography machine restrictions. CXMT is relatively active still. YMTC in the 128+ layer restriction is harder
Basically anything that can be provided domestically is getting validated by CXMT
Proportion of US component is dropping and domestic component is increasing, but more advanced equipments are using more imported parts. Actively verifying domestic components
I guess NAURA also provides a lot of photovoltaic equipment
There are some other stuff in there worth checking out.
Liancheng KEX's 1 billion yuan semiconductor high-end equipment R & D and manufacturing phase II project started and laid the foundation
According to news from Jiwei.com, on February 10, the groundbreaking ceremony for the high-end equipment R&D and manufacturing project of Liancheng Kekes Semiconductor was held.
Image source: Released by Xishan
According to the news released by Xishan, the second phase of the project, with a total investment of 1 billion yuan, will mainly build an integrated R&D and assembly production line including silicon carbide equipment, single crystal furnace equipment, photovoltaic module equipment, and ALD equipment. It is expected to achieve annual sales of 1.5 billion yuan.
LinkKex signed a contract to settle in Xishan at the end of 2019. In 2021, LinkKex high-end semiconductor equipment R&D and manufacturing base will be put into production. According to news at the time, the base invested 3 billion yuan and planned to use 200 acres of land. It will build a semiconductor high-end equipment R&D and manufacturing base with an annual production capacity of 2,000 units, and establish an academician workstation. After it is fully completed and reaches production capacity, the annual output value is expected to exceed 3.5 billion yuan. (Proofreading/Zhao Biying)
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