What is the advantage of the projection lithography instrument? It doesn't say what new features it has. The existing features of max wafer size, resolution, projection area, and overlay accuracy are not particularly impressive either, especially considering existing iline and KrF instruments.
The resolution limit of the stepper is 1um, same capability as the most advanced SMEE SSB500 series.
The instrument is not particularly impressive even for packaging. Exposure size is slightly larger than SSB500 series in exchange for not being able to handle 300 mm wafers.
I think maybe was a precursors research machine for SMEE packaging machines.
SMEE had a prototype for this long ago though. If they have problems with ArF, OK, at least they should be improving their iline and KrF instruments.
I think UV-LED is maybe used more in automated mask aligners, due the low energy of the LEDs, like contact and proximity ones, because the light path is shorter. SMEE machines are projection stepping machines and the light path is longer and lot of energy is lost in the optics, they need a powerful UV-light source. I think is an area that they should explored thought. CETC/SEMICORE is trying to get into this type of litho machines, probably using UV-LED.
Currently they are working with the ICRD and others in that.
From my understanding, the UV LED is indeed weaker and has a larger emission area but is much more energy efficient, longer lasting, and because you can tailor the emission area, you can optimize optics for lower loss.
Interesting project, there is definitely good advantages of using LED instead of Hg Lamps. I have been thinking about building a dynamic mask static exposure apparatus using a UV LCD masking screen and LED looks like good option due costs.
