Chinese semiconductor industry

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tokenanalyst

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Liande Equipment: The company's semiconductor die-bonding equipment has entered the mass production stage for customers​


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Liande Equipment stated on the investor interaction platform that the company's semiconductor die-bonding equipment has entered the stage of mass production for customers.

In the field of semiconductor equipment, Liande Equipment focuses on R&D, manufacturing, and sales of packaging and testing equipment for semiconductor back-end processes, and has completed the research and development of semiconductor flip-chip and sorting equipment. The COF flip-chip equipment independently developed and produced by the company has received orders and has been delivered. At the same time, the company is also actively expanding the market and expanding the customer base and scope of the company's semiconductor packaging and testing related products.

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tphuang

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BTW, I understand there is always great desire to post articles about sanctions that might come, but a lot of these are based on iffy statements and without any details on what might actually get implemented. Without knowing these things, I find pages and pages of emotional back and forth to not be helpful at all. Until we actually get something concrete, I don't really see the point of keep posting an article anytime another news source speculate on something.
 

luminary

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Aside from that, I agree this is probably not a big deal from revenue point of view and that Chinese gov't is likely going to put in unspoken laws that will hurt Dell's business in China.
Forget the unspoken laws, just a boycott would be enough to finish them off.

Bro we can proudly say that we Chinese had bigger chips than the American.:p
I guess you could say....
China's got a chip on its shoulder
:D
 

olalavn

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@olalavn Sir you will like this from SMIC Ningbo with love. :cool:

Oldschool

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6 minutes agoNew
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First time I have seen a Huawei logo chip. Its a power management chip.
My guess is by the newly acquired SMIC ningbo which specialized in analog, power management.
First step to become IDM.
Hisilicon develops all chips... from analog- Nand Flash.. Ningbo factory will start with RF chips and other small chips... and I don't know how much revenue the US will lose from Huawei... before when the chip ban... the supply of U.S chips for Huawei is 100 billion/year...
 
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