Huawei chip manufacturing.
Huawei's die, wafer, and die position identification method on the wafer are disclosed, reducing FA costs
In the manufacture of integrated circuits, a wafer (wafer) generally contains tens of thousands of dies (die, or called bare die). The wafer is thinned and cut to form dies, and finally the dies are packaged into integrated circuits. chip. Usually, chips need to be tested to distinguish good products from bad products. Good products must meet certain reliability standards before they can be marketed, and bad products are eventually scrapped. The integrated circuit industry not only needs to ensure the quality and reliability of the chip, but also needs to continuously improve the yield rate and reduce the cost; therefore, it is necessary to analyze and locate the defective product or failed chip, find the root cause of the failure, give feedback and promote the fab And packaging and testing factories continue to improve. Therefore, performing failure analysis (failure analysis, FA) on defective products (or failed chips) is a key step in the chip manufacturing industry.
In the process of failure analysis of defective products (or failed chips), data investigation is often the first step to be completed, such as analyzing the processing and testing data of each link of chip manufacturing (wafer testing, chip packaging, chip testing), analyzing Whether abnormalities are introduced in each manufacturing process. For a failed chip, first check whether its final test data is abnormal, then check whether there is any abnormality in the upstream packaging process, and finally check whether the die packaged by the chip is a good product on the wafer. However, as mentioned above, there are often tens of thousands of dies on a wafer, so it is necessary to identify the positions of the dies on the wafer to distinguish them.
