If you look at papers published relative to China's population size, they are still under represented. They still need to boost research capacity.
Chinese semiconductor industry
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If you look at papers published relative to China's population size, they are still under represented. They still need to boost research capacity.
I expect them to eventually bend to US pressure as it gets ramped up, but this is certainly more evidence of US unilateralism on this matter.
Why would they bend and listen to the Americans is my question.
If the Dutch decouples ASML from China, it loses two ways.
One, they exchange the bigger market China, for the smaller one America.
Two, over time Chinese competitors will eat away at ASML in a more aggressive fashion.
Then, there is a real question, what does the Dutch or ASML has to gain from decoupling from China?
After this Russian Ukraine war, and the gas prices fiasco for Europe, it is very unlikely those people will rush into these types of bans again any time soon.
Overclock those CPUs, they can warms their butts with that.
Depends on what the CIA has on them.
But in all seriousness. Expect the hammer to be crashing down on anyone who is noncompliant once Huawei announces their chips are returning, which if the rumors are accurate then it may be soon (short term).
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The HPC IP "three-piece set" is the latest achievement of Innosilicon's 16 years of intensive cultivation of high-performance and high-reliability IP. It has three significant advantages: First, high-end performance. Regardless of DDR, Serdes or Chiplet, Innosilicon's performance is the world's leading , with the most complete interface coverage; the second is high-end process verification, high-end 10nm/8nm/7nm/6nm/5nm/3nm have been developed and verified and mass-produced by authorized customers; the third is cross-platform to ensure production safety, Innosilicon IP in TSMC /Samsung/GlobalFoundries/UMC/Intel/SMIC/Huali and other major foundries have all taped out and verified, and have authorized the mass production of billions of high-end SoC chips around the world, which can speed up SoC development and reduce risks.
The whole series of high-bandwidth DDR storage interface solutions break the memory wall
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▲The measured waveform of Innosilicon LPDDR5X (single-bit DQ up to 10Gbps) on a long-distance PCB board
Compatible with the UCIe Chiplet solution , breaking through the performance limit of a single chip
In response to the popular Chiplet technology, Innolink™ Chiplet, the first domestic cross-process and cross-package Chiplet connection solution-Innolink™ Chiplet, is the first to realize compatibility with two UCIe specifications (Innolink-B/C), helping chip design companies and system manufacturers to break through the single The limit of grain manufacturing and the performance bottleneck of a single chip have been successfully mass-produced on advanced technology. This solution not only supports standard packaging and advanced packaging, but also supports short-distance PCB scenarios. In various application scenarios, it has the advantages of low latency, low power consumption, high bandwidth density, and ultra-high cost performance. Covering D2D, C2C, B2B and other connection scenarios, it provides full-stack services such as packaging design, reliability verification, signal integrity analysis, DFT, thermal simulation, and test solutions.
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High-speed SerDes complete solution to open up the information highway
Innosilicon 32/56/64G SerDes complete solution has been at the international forefront in terms of speed, various interface standard types, silicon verification coverage and other important indicators, including PCIe6/5 (downward compatible with PCIe4/3/2), USB3.2/3.0, SATA, XAUI, SATA, RapidIO, CXL2.0, and the latest 112G SerDes are also under intensive development, with high compatibility, low cost, high performance, and high reliability, providing one-stop worry-free integration and flexible customization of Retimer Exchange chips with Switch for applications such as 5G communication, autonomous driving, artificial intelligence, big data storage, cloud computing, high-performance image media processing, and the Internet of Everything.
Papers per capita aren't a useful measure because not everyone participates in research. Paper citations per scientist is more representative and that's captured by the H index.
As much as I wish otherwise, I think planning with the expectations that the Dutch gov't with fold is the right strategy. However, I think a Dutch gov't that does fold will implement ban in a less crazy way than US sanctions. They will still allow servicing and allow some amount of grace period for back orders to get filled. And they still allow older DUVs to be sold with full support.
Well, that's why you see SMIC being this silent about their progress in advanced nodes. If "7nm" chip scared Washington politicians this much, just imagine when 4nm chip comes out. And it's probably a good thing for Huawei to keep denying it's return until last possible moment. It's probably a good time for the entire Chinese industries to be quiet about its progress. 10nm chips with anonymous chip maker is a lot less scary than SMIC produced 7nm chips. I think basically that's what all these new chips by Moore threads, Phytium and Loongson are. We likely won't hear the chip maker from these Chinese chip designer for a while and they might even say the process.
Bro here I share a contrarian view, IF Huawei DO officially announce its return, everybody in the industry will be embolden. THE reason as @horse my brother had posted, its ineffective. It need an event to pull the whole charade down, one is the incoming severe global economic crisis and the other The Symbolism of Huawei struggle, the American are not invisible and a private Chinese tech company is showing the way How to fight back.
although, Huawei wants to make it public... but they only do it in secret... they don't reveal too much about their chip process... U.S prides itself on being number 1... China is not real interest in it... except for companies that are being sanctioned, they are pretending to cry about sanction.... U.S thinks it's 28-14nm process...
Sir your opinion, Kirin 7 series 14nm 3d chiplet or Kirin 8 series 7nm Chip? IF its the latter then God Save America.
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