Chinese semiconductor industry

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henrik

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China tops U.S. to take research crown at global chip conference​


China has submitted the most research papers accepted at a prestigious international academic conference focused on semiconductors, underscoring the country's growing presence in the field and bumping the U.S. into second place.

This is the first time China has taken the top spot in papers accepted by the International Solid-State Circuits Conference (ISSCC), which is considered the Olympics of the semiconductor sector. The annual event opens in February in San Francisco.

Universities and companies in China -- including Hong Kong and Macao -- submitted 59 papers, or 29.8% of all 198 research documents accepted by the ISSCC for the 2023 event. At the previous conference held this February, 29 papers from China were accepted, or 14.5% of the total.

The ISSCC accepted 40 papers from the U.S., dropping the country from first place this year to second. The U.S. share of all papers shrank to 20.2% from 35%.

South Korea ranked third and Taiwan fourth, while Japan and the Netherlands tied for fifth.

Universities in greater China are driving research into semiconductors. The University of Macau had 15 papers accepted, while Beijing's Tsinghua University and Peking University produced 13 and six papers, respectively.

But among corporations, Samsung Electronics led the way with eight papers, followed by Intel with six. Taiwan Semiconductor Manufacturing Co., the world's largest contract chipmaker, submitted only two papers accepted by the ISSCC.

Japanese researchers wrote 10 papers selected by the ISSCC, lifting the country's share to 5.1% from 3.5%. The Tokyo Institute of Technology produced four of them.

If you look at papers published relative to China's population size, they are still under represented. They still need to boost research capacity.
 

horse

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I expect them to eventually bend to US pressure as it gets ramped up, but this is certainly more evidence of US unilateralism on this matter.

Why would they bend and listen to the Americans is my question.

If the Dutch decouples ASML from China, it loses two ways.

One, they exchange the bigger market China, for the smaller one America.

Two, over time Chinese competitors will eat away at ASML in a more aggressive fashion.

Then, there is a real question, what does the Dutch or ASML has to gain from decoupling from China?

After this Russian Ukraine war, and the gas prices fiasco for Europe, it is very unlikely those people will rush into these types of bans again any time soon.

Overclock those CPUs, they can warms their butts with that.

:D
 

tokenanalyst

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The domestic high-performance computing "three-piece" IP solution is released to meet the bandwidth requirements of the new generation of SoC

In the digital age, data storage, computing, transmission, and application requirements have become new driving forces. High-end chips such as cloud services and high-performance computing are inseparable from the support of underlying IP, especially DDR technology, Chiplet, and high-speed SerDes. Heavy. For high-computing SoC scenarios such as CPU/GPU/DPU/NPU commonly used in HPC, Innosilicon has launched a common IP platform centered on the " three-piece set " of high-performance computing.

The " three-piece set " of Innosilicon high-performance computing includes the world's top full-range high-end DDR series, the first Innolink™ Chiplet series compatible with UCIe standards, and the domestic leading SerDes (PCIe6/5) series, which can help customers optimize high- end Strict performance, power consumption, and cost targets on SoCs such as performance computing, AI, and graphics applications have greatly improved the efficiency of SoC R&D, reduced risks, and provided strong support for the upgrade of computing power requirements in the digital age.

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▲ Industry-leading high-performance computing "three-piece" IP solution

The HPC IP "three-piece set" is the latest achievement of Innosilicon's 16 years of intensive cultivation of high-performance and high-reliability IP. It has three significant advantages: First, high-end performance. Regardless of DDR, Serdes or Chiplet, Innosilicon's performance is the world's leading , with the most complete interface coverage; the second is high-end process verification, high-end 10nm/8nm/7nm/6nm/5nm/3nm have been developed and verified and mass-produced by authorized customers; the third is cross-platform to ensure production safety, Innosilicon IP in TSMC /Samsung/GlobalFoundries/UMC/Intel/SMIC/Huali and other major foundries have all taped out and verified, and have authorized the mass production of billions of high-end SoC chips around the world, which can speed up SoC development and reduce risks.

The whole series of high-bandwidth DDR storage interface solutions break the memory wall

In terms of breaking through the memory wall technology, Innosilicon has the world's top full range of high-end DDR storage interface solutions. Not only took the lead in breaking through 10Gbps, mass-produced the world's fastest LPDDR5/5X Combo IP with advanced technology ; The rate is up to 7.2Gbps. All high-end DDR series IP can provide PHY and Controller overall solutions, and have been mass-produced and tested in advanced processes, fully support various JEDEC standards, in terms of performance and stability, size and power consumption, compatibility with more protocols, and application scenario optimization It is outstanding in terms of ease of use and integration, and can help breakthroughs in high-performance applications such as CPU/GPU/NPU high-performance computing, automotive autonomous driving, and mobile terminals.

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▲The measured waveform of Innosilicon LPDDR5X (single-bit DQ up to 10Gbps) on a long-distance PCB board

Compatible with the UCIe Chiplet solution , breaking through the performance limit of a single chip

In response to the popular Chiplet technology, Innolink™ Chiplet, the first domestic cross-process and cross-package Chiplet connection solution-Innolink™ Chiplet, is the first to realize compatibility with two UCIe specifications (Innolink-B/C), helping chip design companies and system manufacturers to break through the single The limit of grain manufacturing and the performance bottleneck of a single chip have been successfully mass-produced on advanced technology. This solution not only supports standard packaging and advanced packaging, but also supports short-distance PCB scenarios. In various application scenarios, it has the advantages of low latency, low power consumption, high bandwidth density, and ultra-high cost performance. Covering D2D, C2C, B2B and other connection scenarios, it provides full-stack services such as packaging design, reliability verification, signal integrity analysis, DFT, thermal simulation, and test solutions.

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▲Innolink™ Chiplet A/B/C implementation method

High-speed SerDes complete solution to open up the information highway

Innosilicon 32/56/64G SerDes complete solution has been at the international forefront in terms of speed, various interface standard types, silicon verification coverage and other important indicators, including PCIe6/5 (downward compatible with PCIe4/3/2), USB3.2/3.0, SATA, XAUI, SATA, RapidIO, CXL2.0, and the latest 112G SerDes are also under intensive development, with high compatibility, low cost, high performance, and high reliability, providing one-stop worry-free integration and flexible customization of Retimer Exchange chips with Switch for applications such as 5G communication, autonomous driving, artificial intelligence, big data storage, cloud computing, high-performance image media processing, and the Internet of Everything.

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tphuang

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I expect them to eventually bend to US pressure as it gets ramped up, but this is certainly more evidence of US unilateralism on this matter.
As much as I wish otherwise, I think planning with the expectations that the Dutch gov't with fold is the right strategy. However, I think a Dutch gov't that does fold will implement ban in a less crazy way than US sanctions. They will still allow servicing and allow some amount of grace period for back orders to get filled. And they still allow older DUVs to be sold with full support.

Depends on what the CIA has on them.

But in all seriousness. Expect the hammer to be crashing down on anyone who is noncompliant once Huawei announces their chips are returning, which if the rumors are accurate then it may be soon (short term).

Well, that's why you see SMIC being this silent about their progress in advanced nodes. If "7nm" chip scared Washington politicians this much, just imagine when 4nm chip comes out. And it's probably a good thing for Huawei to keep denying it's return until last possible moment. It's probably a good time for the entire Chinese industries to be quiet about its progress. 10nm chips with anonymous chip maker is a lot less scary than SMIC produced 7nm chips. I think basically that's what all these new chips by Moore threads, Phytium and Loongson are. We likely won't hear the chip maker from these Chinese chip designer for a while and they might even say the process.
 

ansy1968

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Depends on what the CIA has on them.

But in all seriousness. Expect the hammer to be crashing down on anyone who is noncompliant once Huawei announces their chips are returning, which if the rumors are accurate then it may be soon (short term).
Bro here I share a contrarian view, IF Huawei DO officially announce its return, everybody in the industry will be embolden. THE reason as @horse my brother had posted, its ineffective. It need an event to pull the whole charade down, one is the incoming severe global economic crisis and the other The Symbolism of Huawei struggle, the American are not invisible and a private Chinese tech company is showing the way How to fight back.
 

olalavn

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Depends on what the CIA has on them.

But in all seriousness. Expect the hammer to be crashing down on anyone who is noncompliant once Huawei announces their chips are returning, which if the rumors are accurate then it may be soon (short term).
although, Huawei wants to make it public... but they only do it in secret... they don't reveal too much about their chip process... U.S prides itself on being number 1... China is not real interest in it... except for companies that are being sanctioned, they are pretending to cry about sanction.... U.S thinks it's 28-14nm process...
 

ansy1968

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although, Huawei wants to make it public... but they only do it in secret... they don't reveal too much about their chip process... U.S prides itself on being number 1... China is not real interest in it... except for companies that are being sanctioned, they are pretending to cry about sanction.... U.S thinks it's 28-14nm process...
Sir your opinion, Kirin 7 series 14nm 3d chiplet or Kirin 8 series 7nm Chip? IF its the latter then God Save America. ;)
 
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