Chinese semiconductor industry
- Thread starter Hendrik_2000
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This is probably a good news for Chinese chip industry. IC talents are in high demand. Which means, this will drive more talented people here rather than to become software engineers or lawyers.
I don't quite agree with everything here, but most of it. I think there are examples like YMTC and CXMT that are probably notably affected by the us person rules when it comes to Lam or KLA tools not being able to be maintained. On the other hand as we discussed, that will simply mean that people hired by these American firms will join Chinese IC companies.
3A5000 was said to use 12nm process, so this is probably using SMIC N+1 process if I had to guess.
I don't quite agree with everything here, but most of it. I think there are examples like YMTC and CXMT that are probably notably affected by the us person rules when it comes to Lam or KLA tools not being able to be maintained. On the other hand as we discussed, that will simply mean that people hired by these American firms will join Chinese IC companies.
I really hope the mysterious CPU from last week is just from Loongson. Previous releases sound okay , but loongson in general haven't done well in the local market. I was hoping the new CPU would be Phytium or Hygon.
3A5000 was said to use 12nm process, so this is probably using SMIC N+1 process if I had to guess.
Start to look similar to all the top AI conferences, where Chinese attendees and submitted papers constitute the largest shares among all countries. A few years ago, one of these conferences had rescheduled because it happened to be held during the Chinese New Year. As a result, they changed the time to accommodate the Chinese attendees.
US, China, South Korea, Taiwan, Japan, and Netherlands - all the major players in the semiconductor industry. No surprise here.
Two years ago, Ministry of Education of China reclassified microelectronics and ICs to be Tier 1 subject in universities, from Tier 2 subject, after the US imposed its harshest sanctions on Huawei. This would affect the allocation of resources to the fields. Also, in the last few years, the wages and compensation for college graduates and professionals in these fields have been doubling or tripling, matching those in internet and software industry. In fact, the two are going in opposite directions now.
broadsword
Brigadier
That would be faster than my Lenovo AIO's Ryzen 4700U.
China's consumer CPU market is fragmented too many companies...
I also put my hope in Feiteng and their GPU...
The 8.6th generation new display panel production line of Xiamen Tianma, the R&D and production of OLED metal masks and other projects have started intensively
Among them, 15 projects in Xiamen Torch High-tech Zone (including Tongxiang Headquarters) participated in the centralized construction ceremony, including Xiamen Tianma Optoelectronics Co., Ltd.'s 8.6th generation new display panel production line, OLED metal mask R&D and production and related industrial service supporting projects, Novartis Hengsheng Industrial Park, Sanyou Optoelectronics Industrial Park, Xiamen Pucheng Technology Industrial Park, etc. The following is a partial project introduction:
Xiamen Tianma Optoelectronics Co., Ltd. 8.6th generation new display panel production line
The total investment of the project is about 33 billion yuan, mainly for the construction of production and auxiliary production facilities, power facilities, environmental protection facilities, safety facilities, fire protection facilities, management facilities and corresponding buildings. The main technology of the project is a-Si and IGZO technology dual-track parallel, with vehicle, IT display (including flat panel, laptop, monitor, etc.), industrial products and other display applications as the target product market.
OLED metal mask R & D and production and related industrial service supporting projects
The total investment of the project is about 1 billion yuan, mainly to build 3 factory buildings, supporting warehouses, sewage treatment stations and other auxiliary facilities. After it is put into use, it will mainly build the domestic OLED metal mask and new material research and development and production headquarters, plan two production lines, and undertake the business of mature products such as CMM metal masks transferred from high-gloss.
Novartis Hengsheng Industrial Park
The total investment of the project is about 300 million yuan, mainly to build an intelligent production base, which will be used to undertake the production capacity of high-end products transferred by Novartis and expand new businesses such as micro-LED and IC substrate.
Sanyou Optoelectronics Industrial Park
The total investment of the project is about 150 million yuan, mainly to build 5 production lines. The production process platform includes: high-power, high-speed laser production line, COB series production line, sensor chip packaging production line, microfluidic chip packaging production line, SiC Device and module production lines.
Xiamen Pucheng Technology Industrial Park
The total investment of the project is about 150 million yuan, mainly to build an automation equipment R & D and manufacturing base, including flat panel display / touch screen / semiconductor / new energy automation professional equipment production base, AOI automatic detection line, R & D center and new display technology intelligent equipment headquarters base and other functions . (Proofreading/Jiang Yutong)
I believe most of the researchers, phds, postdocs are from mainland China.
Article says "global Track market will reach US$3.7 billion in 2022." Tokyo Electron alone had revenues of $3.3 billion in 2021, according to my report "Global Semiconductor Equipment: Markets, Market Share, Market Forecasts." TOC is atGreat news.
Shengmei Shanghai enters the coating/developing track market to meet the photolithography process needs of semiconductor integrated circuit manufacturers
The new T rack equipment makes full use of Shengmei Shanghai 's deep technical foundation in the field of adhesive development , and the ArF model will be delivered in the fourth quarter.
Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. ( hereinafter referred to as "Shengmei Shanghai" ) (Science and Technology Innovation Board stock code: 688082 ), as a leading provider of wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications The supplier, successfully launched gumming and developing Track equipment today, marks that the company has officially entered the gumming and developing Track market, which is also the inevitable result of the company's promotion of its professional technology in the fields of cleaning, gumming and developing. Shengmei Shanghai developed the first encapsulation coating machine and developing machine in 2013, and delivered it to the customer in 2014. Shengmei Shanghai will deliver the first ArF process adhesive development Track equipment to Chinese domestic customers in a few weeks, and will launch the i-line model equipment in 2023. In addition, the company has started research and development of KrF type equipment.
"I am honored to announce that Shengmei Shanghai has officially entered the Track market, which will become another major new product category for us. Gartner data shows that the global Track market will reach US$3.7 billion in 2022. This is the development of Shengmei Shanghai. New opportunity. Thanks to Shengmei Shanghai's core competitiveness in software and robot technology, coupled with the excellent performance of adhesive development equipment and a new structure with global patent application protection, we can successfully enter the Track market with competitive products and services , which also marks a critical first step in meeting current and future front-end lithography process needs. Given that global logic and memory manufacturers are looking for second suppliers, we believe this new product will have a huge impact. demand potential,” said Dr. Wang Hui, chairman of Shengmei Shanghai.
Shengmei Shanghai Coating and Developing Track equipment is an equipment used in 300mm wafer process, which can provide uniform downdraft, high-speed and stable manipulator processing and powerful software system, so as to meet the specific needs of customers. The multi-function equipment can reduce product defect rate, increase production capacity and save total cost of ownership (COO). The gumming and developing Track equipment will support various photolithography processes including i-line, KrF and ArF systems.
The gluing and developing track equipment supports the photolithography process, which can ensure that the process requirements are met, and at the same time optimize the gluing and developing steps before and after the wafer is exposed in the lithography equipment. The equipment is specially designed for 300mm wafers, and has 4 loading ports suitable for 12-inch wafers, 8 coating chambers, and 8 developing chambers. The equipment chamber temperature can be precisely controlled at 23°C ±0.1°C, the baking range is from 50°C to 250°C, and the wafer breakage rate is less than 1/50,000. In addition, the new structural design protected by the global patent application can also be expanded to support 12 glue coating chambers and 12 development chambers, and the production capacity of wafers per hour can reach 300 wafers. In the future, it will be equipped with more glue coating and development chambers. Under the same conditions, the production capacity of more than 400 pieces per hour can be achieved.
Well TEL have like 90% of the market share of the coating/developing market. ACMR Shanghai is more competitive than Kingsemi which is also working hark developing their systems, so there is going to be a bit of competition in that space in the coming years.
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