It appears that Mr Jiang has good knowledge of Chiplet technology. He may have done research with the CAS on new technologies like Chiplets and 3D Stacking.Hi WTAM,
Can you kindly explain the difference between what Mr Jiangs Chiplet tech can bring (unknown) and Mr Liang current R&D effort (mainstream)? I'm no tech expert, but from a layman point of view Mr Jiang Chiplet solution is a way to solve the current problem of an EUVL machine.? It may undone the effort of Mr Liang research in both 5nm and 3nm (which need an EUVL)? sorry for being nuisance.
Basically the cost of designing and producing 3nm/5nm ICs are getting very expensive amd complex.
Using Chiplets will basically lower the cost of production. The Chiplets will be produced at higher nodes. So mainly a cost saving measure and also improving the performance of the Chip. Also reduce development times. Chiplets have a better yield rate.
SMIC will still need to pursue advanced nodes and get a EUV Lithograph. However using Chiplets will buy it time while Chinese Semiconductor production technology catches up. They can make more use of the DUVL as the Chiplets can be produced at higher nodes.
TSMC is incorporating Chiplet Technology in its 3nm ICs to lower cost and reduce complexity.
This is a explanation of Chiplets