Chinese semiconductor industry

Tuojing Technology (688072) Company News Comments: PECVD Outbreak Growth Equity Incentive Target Shows Confidence.​

In 22Q3, the net profit attributable to the parent was 129 million yuan, an increase of 8% month-on-month, which was close to the forecast upper limit. The company's revenue in the first three quarters of 2022 was 992 million yuan (announced 950 million yuan ~ 1.000 billion yuan), an increase of 165% year-on-year, and the net profit attributable to the parent was 237 million yuan Yuan (announced 230 million to 240 million yuan), a year-on-year increase of 310%, deducting non-return to parent net profit of 112 million yuan (announced 110 million to 115 million yuan), a year-on-year turnaround.

22Q3 single-quarter revenue was 468 million yuan, an increase of 13% month-on-month, net profit attributable to the parent was 129 million yuan, an increase of 8% month-on-month, net profit after deducting non-return to the parent was 63 million yuan, a month-on-month decrease of 12%; gross profit margin was 50.07%, a month-on-month increase of 3.49% pct, the net profit margin was 27.36%, a month-on-month decrease of 1.31pct. The month-on-month decrease in net profit margin was mainly due to a month-on-month increase of 5.07pct in the R&D expense ratio.

The main product PECVD revenue has grown explosively, and the company is actively deploying new products around CVD equipment. The company's first major business is PECVD equipment. In 22Q3, the revenue of PECVD equipment in a single quarter was 421 million yuan, accounting for 90% of the total revenue, a year-on-year increase of 93%. explosive growth. PF-300T (two-station type) is widely used in 28nm and above logic chip/3D NAND/DRAM manufacturing, and NF-300H (six-station type) realizes the first industrial application in the field of DRAM.

The second largest business is SACVD equipment and ALD equipment. The revenue of SACVD equipment and ALD equipment in the single quarter of 22Q3 was about 47 million yuan, accounting for 10% of the total revenue, a year-on-year increase of 9%. SACVD equipment continues to obtain orders for 12-inch 40/28nm and 8-inch 90nm and above logic chips; PE-ALD has achieved industrial application in logic chips, and Thermal-ALD [PF-300T (dual station)] has obtained customer orders.

In addition, the company expanded its product coverage around the CVD equipment segment, thermal-ALD based on high-capacity platforms, high-density plasma HDPCVD (PF-300T (single station), TS-300 (polygonal high-capacity platform)), and UV Cure for film UV curing treatment has already received customer orders.

mst said:

Nvidia offers new advanced chip for China that meets U.S. export controls.​

A distributor website in China detailed the specifications of the A800. A comparison of the chip capabilities with the A100 shows that the chip-to-chip data transfer rate is 400 gigabytes per second on the new chip, down from 600 gigabytes per second on the A100. The new rules restrict rates of 600 gigabytes per second and up.

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kind of what you expect. Nerfed Nvidia chips. It won't be long before these loop holes get closed. Nvidia better sell as many chips in China as possible before it can't anymore. Biren is nerfing their chips too, but at least they have the option to work with SMIC to produce their chips.

BYD was one of the many industry leaders to talk in the 2022 automotive electronics conference, most of it was not all that interesting for IC until this part

芯片是智能化技术的硬核支撑，比亚迪也提前布局芯片产业链：自主研发和生产了功率半导体，车规级的MCU等各种产品，有力地支撑了比亚迪在智能化方向的发展。目前，在车规级的半导体领域，比亚迪掌握了IGBT的关键技术，并且在高功率碳化硅的模块中取得了技术突破；今年比亚迪发布全球首款应用6nm的5G芯片等。

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Most of it looked standard plate stuff about what they have already developed in power chips until the last part.
They said they released the world's first 6nm 5G chip. I have not seen anywhere talking about this.

China Micro Corporation (688012): Newly signed orders exceed expectations, leading with advanced technology capabilities, independent and controllable​

company has obvious advantages in etching equipment, and at the same time actively promotes MOCVD equipment and thin film deposition equipment, orders have grown rapidly, and performance is expected to continue to increase.

maintain the "overweight" rating and maintain the target price of 164 yuan. The company's etching equipment has accelerated growth, thin-film deposition equipment has steadily advanced, and its performance has entered the fast growth lane, maintaining its EPS of 1.78/2.34/2.97 yuan in 2022-2024. Considering the obvious advantages of ICP dual-machine, and the accelerated penetration of domestic production lines, it will be given 70 times PE in 2023, and the target price will be maintained at 164 yuan.

In the first three quarters, the newly signed orders exceeded expectations by 5.64 billion yuan, and the increase in ICP was accelerated. The company announced its 3Q22 financial report, achieving revenue of 1.071 billion yuan in a single quarter, a year-on-year increase of 45.9%; net profit attributable to the parent after deductions was 203 million yuan, a year-on-year increase of 96.7%. Inventory at the end of the period was 3.24 billion yuan, and contract liabilities were 1.97 billion yuan, both hitting record highs. In the first three quarters, the newly signed orders amounted to 5.64 billion yuan, a year-on-year increase of 60.24%; in the third quarter, the newly signed orders amounted to 2.58 billion yuan.

The continuous development of new CCP models, the significant advantages of dual ICP units, and the rapid growth of the company's etching equipment performance. Develop a new type of CCP, covering logic chips below 5nm and 3D NAND memory chips above 200 layers. Develop new ICPs, covering 7nm and below logic, 17nm and below DRAM and 3D NAND storage, and optimize the development of dual ICP etching equipment.

The company is a rare domestic manufacturer with 5nm advanced process capabilities and experience, and it is expected to lead the independent control of semiconductors. The company's tungsten thin film deposition equipment has passed the process verification of key customers, and is actively promoting the mass production verification of the equipment in the customer's production line. In the fields of thin film, etching, and measurement, the three types of American equipment are extremely strong. The company has a comprehensive product coverage in the field of etching, and has successively developed tungsten CVD thin film equipment, which has a leading demonstration role in the process of localization of the entire line.

Startup Funding: October 2022​

EDA
DeTooLIC drew tens of millions of yuan (CNY 10.0M is ~$1.4M) in Series A financing from SDIC Ventures. DeTooLIC provides EDA tools and multi-physics simulation software for advanced packaging and PCB, as well as 3D electromagnetic field simulation software. It is currently developing equivalent circuit extraction tools and interconnected signal integrity/power integrity design platforms for advanced packaging. Based in Ningbo, China, it was founded in 2021.

Rigoron Software raised tens of millions of yuan (CNY 10.0M is ~$1.4M) in two early-stage funding rounds that included Huayi Ventures and Yuanhe Puhua. Rigoron offers digital IC signoff analysis and full-chip PPA optimization tools. Its signoff capabilities include timing constraint management and validation, static timing analysis, power analysis, IR-drop, and other checks. Funds will be used for R&D and product iteration. Based in Shanghai, China, it was founded in 2021.

Manufacturing & equipment
FA Software raised hundreds of millions of yuan (CNY 100.0M is ~$13.9M) in Series D financing led by Shanghai Semiconductor Equipment and Material Investment Fund, with participation from Qingdao Zhongke Yuchen Investment Management, Hypercycle Venture, and Suzhou Anxin Tongying Venture Capital. FA Software offers a manufacturing execution system (MES) and computer integrated manufacturing (CIM) software for semiconductor fabrication, including production requirements planning, equipment management, data collection, and reticle management. It supports up to 12-inch wafer production lines. The company also provides solutions for photovoltaic and LED manufacturing. Funds will be used for R&D, including development of 12-inch semiconductor production line subsystems and other software. Founded in 1999, it is based in Shanghai, China.
Grand Hitek raised hundreds of millions of yuan (CNY 100.0M is ~$13.9M) in Series A+ financing from Stony Creek Capital, China Fortune-Tech Capital, Zhongguancun Development Group, Etown Capital, Novartis Capital, and others. Grand Hitek provides dry vacuum pump equipment, components, and repair services for manufacturing semiconductors, display panels, solar photovoltaics, LED lighting, and lithium batteries. Funds will be used to expand vacuum pump mass production capacity. Founded in 2010, it is based in Beijing, China.
Techsense International, also known as Shiyu Precision, drew hundreds of millions of yuan (CNY 100.0M is ~$13.9M) in new financing from IDG Capital, Orient Securities, Hypercycle Venture, Acorn Partners, and others. Techsense makes packaging and testing equipment. It offers ball mounting and integrated inspection/repair systems, flip-chip bonding, die sorters, automated optical inspection (AOI), substrate transfer equipment, AGV robots, and customized automation systems. Founded in 2013, it is based in Shanghai, China.

Wiseetec raised CNY 100.0M (~$13.9M) in Series A funding that included Sharewin Investment, Jihua Capital, GP Capital, and CRRC. Wiseetec makes semiconductor bonding and debonding equipment, including both temporary bonding and permanent bonding. It supports from 2-inch to 12-inch wafers. Based in Suzhou, China, it was founded in 2021.

Huajing Information drew tens of millions of yuan (CNY 10.0M is ~$1.4M) in Series A financing from Dynamic Balance Capital. Huajing Information provides computer integrated manufacturing (CIM) and manufacturing execution system (MES) software for semiconductor, flat panel display, and photovoltaic manufacturing. It supports 6-, 8-, and 12-inch wafer lines. Funds will be used for R&D and hiring. Based in Shanghai, China, it was founded in 2016.

iBDTEC received tens of millions of yuan (CNY 10.0M is ~$1.4M) in pre-Series B financing from China Fortune-Tech Capital. iBDTEC makes ion sources and ion beam equipment for ultra-high-precision multi-layer coating, surface etching, and surface polishing in manufacturing semiconductors, MEMS, LEDs, and optics. Funds will be used to expand production capacity and for R&D. Based in Zhongshan, China, it was founded in 2016.

Pinwei Intelligent Technology raised tens of millions of yuan (CNY 10.0M is ~$1.4M) in pre-Series A funding from Jolmo Capital. Pinwei provides a range of software for manufacturing and packaging ICs, PCBs, SMT, and photovoltaics. Its products include manufacturing execution system (MES), equipment automation program (EAP), recipe management system (RMS), alarm management system (ALMS), wafer mapping and strip mapping, electronic data capture (EDS), quality management system (QMS), and statistical process control (SPC). Funds will be used for R&D. Founded in 2018, it is based in Nanjing, China.

Test, measurement & inspection
Govion Technology raised hundreds of millions of yuan (CNY 100.0M is ~$13.9M) in Series C financing from Shangqi Capital, China Fortune-Tech Capital, SND Financial Holdings, China Development Bank Capital, CITIC Securities, and others. Govion Technology makes automated optical inspection (AOI) systems for semiconductor wafers, chip packages, displays, and batteries. It also offers a machine vision deep learning development platform, a standardized database for defects, and a platform for industrial automation and motion control based on machine vision. Based in Suzhou, China, it was founded in 2015.

Terapark Technology raised tens of millions of yuan (CNY 10.0M is ~$1.4M) in pre-Series A+ funding from Hikvision and Panlin Capital. Terapark Technology has developed CMOS terahertz high-speed imaging chips with frequencies ranging from 100 to 400GHz. It is planning to incorporate these in terahertz industrial inspection modules and instruments for non-destructive inspection of semiconductor materials, high-power and high-frequency electronic materials, photovoltaics, and other materials. They can also be used for terahertz imaging and proximity sensing applications. Funds will be used for mass production and marketing. Based in Nanjing, China, it was founded in 2020.

Materials
Supermat Technology received nearly CNY 100.0M (~$13.9M) in financing from Cornerstone Capital, Hanwei Technology, Shenzhen High-tech Investment, and others. The company manufactures high-performance compound semiconductor epitaxial materials and infrared optoelectronic devices. Funds will be used for production line upgrades, technology iteration, and mass production. Founded in 2015, it is based in Beijing, China.
Didao Microelectronics (Didaomat) raised tens of millions of yuan (CNY 10.0M is ~$1.4M) in Series A funding from Matrix Partners China, following a pre-A round in July. The company produces photoresists for flat panel display and semiconductor manufacturing, as well as materials for back-end and advanced package cleaning. Funds will be used for R&D and marketing. Founded in 2020, it is based in Shenzhen, China.
Hanking Semiconductor Materials received tens of millions of yuan (CNY 10.0M is ~$1.4M) in angel financing from Zheshang Venture Capital. The startup makes silicon carbide (SiC) components for semiconductor equipment. Its products include SiC tubes, wafer boats, caps, fins, and rings. Funds will be used for R&D and equipment procurement. Based in Shenyang, China, it was founded in June 2022.
Hunan Dezhi New Material received new financing from Addor Capital. Dezhi makes silicon carbide (SiC) nano-mirror coatings, SiC etching rings, ceramic matrix composite materials, and consumables for use in semiconductor manufacturing. Founded in 2017, it is based in Zhuzhou, China.
LinkHygH, also known as Linghui Material, received Series A financing from Linxin Investment, Element Capital, Hongtai Investment, and Ishikawa Investment. LinkHygH makes functional adhesives, tapes, and interface materials for applications such as consumer electronics, lithium batteries, semiconductors, displays, and new energy vehicles. The company began operation of its first production line earlier this year. Founded in 2021, it is based in Suzhou, China.

From Lyman2003's weibo

刚才看共青团的航展直播，在采访CEC中国电子集团旗下各个公司，这些公司的展品并不都是军用品。

发现各个分公司介绍产品时都要强调一句“包括芯片和系统全国产化”，也说了原先的产品使用美国的芯片和操作系统

特朗普和拜登两任总统的对中国全方位制裁，终于让中国的军民两用产业痛下决心替代所有的美产芯片和操作系统。这是多少行政命令都达不到的效果

现在连外贸产品，或军民两用产品都强调全国产化，给所有国内外用户一条不同于西方产业链的选择

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Looks like from Zhuhai airshow, all the electronics product now emphasize that chips/systems are developed domestically, even for export products. Looks like after Biden/Trump sanctions, China's military industry has finally got rid of American technology. This is good for anyone looking to buy that don't want to worry about Western supply chain being sanctioned.

tonyget said:

Anything can be military，depends on how broad you define "military". The agricultural products China imports from the US can be military as well，since it can be used to produce ration for military

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Yes , i have seen this in twitter that people say to ban export agriculture product to china .. because it can use to feed PLA

Zhixun Innovation and Xi'an Jiaotong University signed a cooperation agreement to carry out research on flash memory reliability

Recently, Zhixun Innovation Technology Co., Ltd. (Wuxi) and Xi'an Jiaotong University School of Electronic Science and Engineering officially signed the school - a surprise cooperation agreement to jointly conduct reliability research flash memory Gender Studies. It is reported that the two sides will focus on researching the high reliability of 2D NAND flash memory and expanding the market application of 2D NAND flash memory.