Shengmei Shanghai's original electroplating technology has achieved a qualitative leap in front-end dual damascene and advanced packaging, 3D TSV and third-generation semiconductor applications, and launched Ultra ECP map (front-end copper interconnect electroplating equipment) , Ultra ECP ap, Ultra ECP 3d, Ultra ECP GIII and other devices. Whether it is multi-ring anode technology, second anode technology, or high-speed electroplating technology, they all show excellent performance in the customer's production line.
"Let's focus on high-speed electroplating technology. Shengmei Shanghai developed the technology in 2019, introduced it to the market in 2020, and applied it to SnAg in 2021. It also uses a paddle designed by itself to optimize the process according to needs." Jia Zhaowei According to the introduction, on the one hand, the use of high-speed plating technology can improve the coating performance of copper (Cu) and tin-silver (SnAg); throughput and reduced process time.
It is reported that high-speed copper electroplating technology has been applied to the Ultra ECP ap electroplating equipment of Shengmei Shanghai, which can perform many key wafer-level packaging electroplating processes, including copper bumping and high-density fan-out (HDFO) processes. Specially designed for fast and uniform plating. The device performs well in copper, nickel, tin, silver and gold electroplating processes.
At present, Shengmei Shanghai Ultra ECP ap has achieved a lot of industrialization and has been used by many customers in its advanced wafer-level packaging process. In February this year, Shengmei Shanghai received multiple purchase orders for 8 sets of Ultra ECP ap advanced packaging electroplating equipment; in May, Shengmei Shanghai signed a contract with a Chinese advanced wafer-level packaging customer for 10 sets of Ultra ECP ap high-speed electroplating equipment Bulk purchase contracts.
"Let's focus on high-speed electroplating technology. Shengmei Shanghai developed the technology in 2019, introduced it to the market in 2020, and applied it to SnAg in 2021. It also uses a paddle designed by itself to optimize the process according to needs." Jia Zhaowei According to the introduction, on the one hand, the use of high-speed plating technology can improve the coating performance of copper (Cu) and tin-silver (SnAg); throughput and reduced process time.
It is reported that high-speed copper electroplating technology has been applied to the Ultra ECP ap electroplating equipment of Shengmei Shanghai, which can perform many key wafer-level packaging electroplating processes, including copper bumping and high-density fan-out (HDFO) processes. Specially designed for fast and uniform plating. The device performs well in copper, nickel, tin, silver and gold electroplating processes.
At present, Shengmei Shanghai Ultra ECP ap has achieved a lot of industrialization and has been used by many customers in its advanced wafer-level packaging process. In February this year, Shengmei Shanghai received multiple purchase orders for 8 sets of Ultra ECP ap advanced packaging electroplating equipment; in May, Shengmei Shanghai signed a contract with a Chinese advanced wafer-level packaging customer for 10 sets of Ultra ECP ap high-speed electroplating equipment Bulk purchase contracts.
