Chinese semiconductor industry
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Hi WTAN,
Do you have anything more official suggesting the SMEE ArFi scanner is working?
This SMEE product is relatively new so SMEE has not yet released official specs etc.
There are many articles in Chinese websites reporting on the SMEE DUVL. I have also seen a Japanese article mentioning it and posted in this forum not long ago.
It is still early days and SMEE will deliver its first unit early next year to a customer. Next year serial production will begin with 5-6 units expected to be built. You will find out more about this SMEE machine next year when it is officially launched.
Resolution is similar to the latest ASML 2000i series.
It is starting to make sense now.Hi WTAN,
Yuck!!!Again thanks very much, I'm happy to be corrected.
Huawei has chosen Shanghai as its Chip Production Base as its technical partner ICRD is based in Shanghai.
ICRD has lots of experience and will help Huawei move quickly up the Chip production ladder.
Hendrik_2000
Lieutenant General
From xyz they are using water instead of photo resist material? then use laser to carve the ice into the semiconductor pattern ? Anyone can better translate it ?
*ttp://jyt.zj.gov.cn/art/2020/12/4/art_1532836_58916508.html
浙江日报：西湖大学突破“冰刻”三维微纳加工技术
发布日期:2020-12-04
在西湖大学纳米光子学与仪器技术实验室，一项关键材料科技创新正在逐渐成型。
记者近日从西湖大学获悉：经过8年探索，仇旻研究团队在《纳米快报》等期刊上连续发表了系列研究成果，“冰刻2.0”三维微纳加工系统雏形初现。
基于2年前完成研发的“冰刻”系统，“冰刻2.0”技术有望改变传统电子束光刻的繁琐加工程序，形成一套“材料进、成品出”的全流程一体化、自动化微纳加工系统。
“其实，我们只是把传统电子束光刻技术中的光刻胶换成了冰。”研究团队负责人、西湖大学副校长仇旻说。这一换，换出了一条崭新的、有望开辟出重大发展与应用前景的技术路线。
光刻胶是微电子技术中微细图形加工的关键材料之一。所以有人说，中国要制造芯片，就要打破国外对光刻胶的垄断。
谈到“冰刻2.0”技术的创意，科研人员形象地举了一个例子。
如何用巧克力粉在奶油蛋糕表面洒出“生日快乐”？只需要一片有镂空“生日快乐”字样的模具。把来自宏观世界的灵感应用到微纳结构加工中，就是当前最常用的微纳加工方案之一——电子束光刻技术。
在传统的电子束光刻技术中，要在硅晶片上进行纳米尺度的加工，首先要将光刻胶均匀地涂抹在晶片表面；而后，用电子束在真空环境中将图案写在光刻胶上，对应位置的光刻胶性质会发生变化；之后，用化学试剂洗去性质改变的光刻胶，一片镂空的光刻胶模具就做好了。接下来，将金属“填”进镂空位置，使之“长”在晶片表面。最后，再用化学试剂将所有光刻胶清洗干净，去除废料后只留下金属结构。
不过，传统电子束光刻技术有一定局限性。“在样品上涂抹光刻胶，这是传统光刻加工的第一步。这个动作有点像摊鸡蛋饼，如果铁板不平整，饼就摊不好。同时，被抹胶的地方，面积不能太小，否则胶不容易摊开摊匀；材质不能过脆，否则容易破裂。”仇旻实验室助理研究员赵鼎说。
光刻胶之所短，恰恰是水之所长。
研究人员把样品放入真空设备后，先给样品降温，再注入水蒸气。在零下140摄氏度左右的真空环境，水蒸气会在样品上凝华成薄薄的冰层。一方面水蒸气可以包裹任意形状、大小不拘的样品表面；另一方面，水蒸气的轻若无物，也使得在脆弱材料上加工变成可能。对应光刻胶，研究团队给这层冰起名“冰胶”，给冰胶参与的电子束光刻技术起名“冰刻”。
当电子束打在冰层上，冰会气化，这样就能直接雕刻出冰模板，不需要像传统光刻那样用化学试剂清洗一遍来形成模具，从而规避了洗胶带来的污染，以及难以洗净的光刻胶残留导致良品率低等问题。这样可以极大地简化加工流程。
“冰刻”原理简单明了，但仪器的研制则异常艰辛。自2018年研发出“冰刻”系统后，研究团队进一步从定位精度、雕刻力度以及冰在电子作用下与材料发生的独特反应等多维度入手，持续研究，以提升“冰刻”技术。
仇旻说，本质上“冰刻”仍属于电子束光刻。但它作为一种绿色且“温和”的加工手段，尤其适用于非平面衬底或者易损柔性材料，甚至为生物材料加工创造更多可能。
google translate
Zhejiang Daily: West Lake University breaks through the "ice carving" three-dimensional micro-nano processing technology Release date: 2020-12-04 In the West Lake University Nanophotonics and Instrument Technology Laboratory, a key material technology innovation is gradually taking shape.
The reporter recently learned from West Lake University: After 8 years of exploration, Qiu Min's research team has continuously published a series of research results in "Nano Express" and other journals, and the prototype of "Ice Carving 2.0" 3D micro-nano processing system has emerged. Based on the "Ice Engraving" system developed 2 years ago, the "Ice Engraving 2.0" technology is expected to change the cumbersome processing procedures of traditional electron beam lithography, forming a set of integrated, automated micro-nano processes for the entire process of "material input and finished product output" Processing system.
"In fact, we just replaced the photoresist in the traditional electron beam lithography technology with ice." said Qiu Min, the research team leader and vice president of West Lake University. This exchange has swapped out a brand-new technical route that is expected to open up major development and application prospects. Photoresist is one of the key materials for micro-pattern processing in microelectronics technology.
So some people say that if China wants to make chips, it must break the foreign monopoly on photoresist. When it comes to the creativity of "Ice Carving 2.0" technology, researchers vividly cited an example. How to sprinkle "Happy Birthday" on the surface of the cream cake with chocolate powder? All you need is a mold with the words "Happy Birthday" hollowed out. Applying inspiration from the macro world to the processing of micro-nano structures is currently one of the most commonly used micro-nano processing solutions-electron beam lithography.
In the traditional electron beam lithography technology, to perform nano-scale processing on the silicon wafer, firstly, the photoresist must be evenly coated on the surface of the wafer; then, the pattern is written on the photoresist in a vacuum environment with an electron beam Above, the properties of the photoresist at the corresponding position will change; afterwards, the photoresist with the changed properties is washed away with a chemical reagent, and a hollowed-out photoresist mold is completed. Next, "fill" the metal into the hollow position to make it "long" on the surface of the wafer. Finally, all the photoresist is cleaned with chemical reagents, leaving only the metal structure after removing the waste.
However, traditional electron beam lithography technology has certain limitations. “Applying photoresist to the sample is the first step in traditional photolithography. This action is a bit like spreading an egg pancake. If the iron plate is not flat, the pancake will not spread well. At the same time, the area where the glue is applied cannot be Too small, otherwise the glue will not be easy to spread out; the material should not be too brittle, otherwise it will easily break." said Zhao Ding, assistant researcher in Qiu Min's laboratory.
The shortcoming of photoresist is precisely the opposite advantage of water. After the researchers put the sample into the vacuum device, the temperature of the sample is first cooled, and then water vapor is injected. In a vacuum environment of minus 140 degrees Celsius, water vapor will condense into a thin layer of ice on the sample. On the one hand, water vapor can wrap the sample surface of any shape and size; on the other hand, the lightness of water vapor makes it possible to process on fragile materials.
Corresponding to photoresist, the research team named this layer of ice "ice glue", and named the electron beam lithography technology involved in ice glue "ice carving". When the electron beam hits the ice layer, the ice will vaporize, so that the ice template can be carved directly. It does not need to be cleaned with chemical reagents like traditional photolithography to form the mold, thus avoiding the pollution and difficulty of washing tape. The cleaned photoresist residue causes problems such as low yield.
This can greatly simplify the processing flow. The principle of "ice carving" is simple and clear, but the development of the instrument is extremely difficult. Since the development of the "ice engraving" system in 2018, the research team has further focused on positioning accuracy, engraving strength, and the unique reaction of ice with materials under the action of electrons, and continued research to improve the "ice engraving" technology. Qiu Min said that essentially "ice carving" still belongs to electron beam lithography. But as a green and "gentle" processing method, it is especially suitable for non-planar substrates or fragile flexible materials, and even creates more possibilities for biological material processing.
*ttp://jyt.zj.gov.cn/art/2020/12/4/art_1532836_58916508.html
浙江日报：西湖大学突破“冰刻”三维微纳加工技术
发布日期:2020-12-04
在西湖大学纳米光子学与仪器技术实验室，一项关键材料科技创新正在逐渐成型。
记者近日从西湖大学获悉：经过8年探索，仇旻研究团队在《纳米快报》等期刊上连续发表了系列研究成果，“冰刻2.0”三维微纳加工系统雏形初现。
基于2年前完成研发的“冰刻”系统，“冰刻2.0”技术有望改变传统电子束光刻的繁琐加工程序，形成一套“材料进、成品出”的全流程一体化、自动化微纳加工系统。
“其实，我们只是把传统电子束光刻技术中的光刻胶换成了冰。”研究团队负责人、西湖大学副校长仇旻说。这一换，换出了一条崭新的、有望开辟出重大发展与应用前景的技术路线。
光刻胶是微电子技术中微细图形加工的关键材料之一。所以有人说，中国要制造芯片，就要打破国外对光刻胶的垄断。
谈到“冰刻2.0”技术的创意，科研人员形象地举了一个例子。
如何用巧克力粉在奶油蛋糕表面洒出“生日快乐”？只需要一片有镂空“生日快乐”字样的模具。把来自宏观世界的灵感应用到微纳结构加工中，就是当前最常用的微纳加工方案之一——电子束光刻技术。
在传统的电子束光刻技术中，要在硅晶片上进行纳米尺度的加工，首先要将光刻胶均匀地涂抹在晶片表面；而后，用电子束在真空环境中将图案写在光刻胶上，对应位置的光刻胶性质会发生变化；之后，用化学试剂洗去性质改变的光刻胶，一片镂空的光刻胶模具就做好了。接下来，将金属“填”进镂空位置，使之“长”在晶片表面。最后，再用化学试剂将所有光刻胶清洗干净，去除废料后只留下金属结构。
不过，传统电子束光刻技术有一定局限性。“在样品上涂抹光刻胶，这是传统光刻加工的第一步。这个动作有点像摊鸡蛋饼，如果铁板不平整，饼就摊不好。同时，被抹胶的地方，面积不能太小，否则胶不容易摊开摊匀；材质不能过脆，否则容易破裂。”仇旻实验室助理研究员赵鼎说。
光刻胶之所短，恰恰是水之所长。
研究人员把样品放入真空设备后，先给样品降温，再注入水蒸气。在零下140摄氏度左右的真空环境，水蒸气会在样品上凝华成薄薄的冰层。一方面水蒸气可以包裹任意形状、大小不拘的样品表面；另一方面，水蒸气的轻若无物，也使得在脆弱材料上加工变成可能。对应光刻胶，研究团队给这层冰起名“冰胶”，给冰胶参与的电子束光刻技术起名“冰刻”。
当电子束打在冰层上，冰会气化，这样就能直接雕刻出冰模板，不需要像传统光刻那样用化学试剂清洗一遍来形成模具，从而规避了洗胶带来的污染，以及难以洗净的光刻胶残留导致良品率低等问题。这样可以极大地简化加工流程。
“冰刻”原理简单明了，但仪器的研制则异常艰辛。自2018年研发出“冰刻”系统后，研究团队进一步从定位精度、雕刻力度以及冰在电子作用下与材料发生的独特反应等多维度入手，持续研究，以提升“冰刻”技术。
仇旻说，本质上“冰刻”仍属于电子束光刻。但它作为一种绿色且“温和”的加工手段，尤其适用于非平面衬底或者易损柔性材料，甚至为生物材料加工创造更多可能。
google translate
Zhejiang Daily: West Lake University breaks through the "ice carving" three-dimensional micro-nano processing technology Release date: 2020-12-04 In the West Lake University Nanophotonics and Instrument Technology Laboratory, a key material technology innovation is gradually taking shape.
The reporter recently learned from West Lake University: After 8 years of exploration, Qiu Min's research team has continuously published a series of research results in "Nano Express" and other journals, and the prototype of "Ice Carving 2.0" 3D micro-nano processing system has emerged. Based on the "Ice Engraving" system developed 2 years ago, the "Ice Engraving 2.0" technology is expected to change the cumbersome processing procedures of traditional electron beam lithography, forming a set of integrated, automated micro-nano processes for the entire process of "material input and finished product output" Processing system.
"In fact, we just replaced the photoresist in the traditional electron beam lithography technology with ice." said Qiu Min, the research team leader and vice president of West Lake University. This exchange has swapped out a brand-new technical route that is expected to open up major development and application prospects. Photoresist is one of the key materials for micro-pattern processing in microelectronics technology.
So some people say that if China wants to make chips, it must break the foreign monopoly on photoresist. When it comes to the creativity of "Ice Carving 2.0" technology, researchers vividly cited an example. How to sprinkle "Happy Birthday" on the surface of the cream cake with chocolate powder? All you need is a mold with the words "Happy Birthday" hollowed out. Applying inspiration from the macro world to the processing of micro-nano structures is currently one of the most commonly used micro-nano processing solutions-electron beam lithography.
In the traditional electron beam lithography technology, to perform nano-scale processing on the silicon wafer, firstly, the photoresist must be evenly coated on the surface of the wafer; then, the pattern is written on the photoresist in a vacuum environment with an electron beam Above, the properties of the photoresist at the corresponding position will change; afterwards, the photoresist with the changed properties is washed away with a chemical reagent, and a hollowed-out photoresist mold is completed. Next, "fill" the metal into the hollow position to make it "long" on the surface of the wafer. Finally, all the photoresist is cleaned with chemical reagents, leaving only the metal structure after removing the waste.
However, traditional electron beam lithography technology has certain limitations. “Applying photoresist to the sample is the first step in traditional photolithography. This action is a bit like spreading an egg pancake. If the iron plate is not flat, the pancake will not spread well. At the same time, the area where the glue is applied cannot be Too small, otherwise the glue will not be easy to spread out; the material should not be too brittle, otherwise it will easily break." said Zhao Ding, assistant researcher in Qiu Min's laboratory.
The shortcoming of photoresist is precisely the opposite advantage of water. After the researchers put the sample into the vacuum device, the temperature of the sample is first cooled, and then water vapor is injected. In a vacuum environment of minus 140 degrees Celsius, water vapor will condense into a thin layer of ice on the sample. On the one hand, water vapor can wrap the sample surface of any shape and size; on the other hand, the lightness of water vapor makes it possible to process on fragile materials.
Corresponding to photoresist, the research team named this layer of ice "ice glue", and named the electron beam lithography technology involved in ice glue "ice carving". When the electron beam hits the ice layer, the ice will vaporize, so that the ice template can be carved directly. It does not need to be cleaned with chemical reagents like traditional photolithography to form the mold, thus avoiding the pollution and difficulty of washing tape. The cleaned photoresist residue causes problems such as low yield.
This can greatly simplify the processing flow. The principle of "ice carving" is simple and clear, but the development of the instrument is extremely difficult. Since the development of the "ice engraving" system in 2018, the research team has further focused on positioning accuracy, engraving strength, and the unique reaction of ice with materials under the action of electrons, and continued research to improve the "ice engraving" technology. Qiu Min said that essentially "ice carving" still belongs to electron beam lithography. But as a green and "gentle" processing method, it is especially suitable for non-planar substrates or fragile flexible materials, and even creates more possibilities for biological material processing.
TSMC and Google push chipmaking boundaries with 3D ‘stacking’
Taiwan Semiconductor Manufacturing Co is working with Google and other US tech groups to develop a new way of making semiconductors more powerful.
TSMC is now taking chip packaging vertically and horizontally, using a new 3D technology that it dubs SoIC. It makes it possible to stack and link several different types of chips — such as processors, memory and sensors — into one package, according to the company. This approach makes the whole chipset smaller, more powerful and more energy-efficient.
TSMC plans to employ its new 3D stacking technology at a chip packaging plant it is building in the Taiwanese city of Miaoli, people with knowledge of the matter told Nikkei. Google and Advanced Micro Devices, Intel’s smaller rival, will be among its first customers for SoIC chips, the sources added, and are helping TSMC to test and certify them. Construction on the plant is slated for completion next year, with mass production to begin in 2022.
Taiwan Semiconductor Manufacturing Co is working with Google and other US tech groups to develop a new way of making semiconductors more powerful.
TSMC is now taking chip packaging vertically and horizontally, using a new 3D technology that it dubs SoIC. It makes it possible to stack and link several different types of chips — such as processors, memory and sensors — into one package, according to the company. This approach makes the whole chipset smaller, more powerful and more energy-efficient.
TSMC plans to employ its new 3D stacking technology at a chip packaging plant it is building in the Taiwanese city of Miaoli, people with knowledge of the matter told Nikkei. Google and Advanced Micro Devices, Intel’s smaller rival, will be among its first customers for SoIC chips, the sources added, and are helping TSMC to test and certify them. Construction on the plant is slated for completion next year, with mass production to begin in 2022.
A rare opportunity arise due to covid uncertainty, a shortage of chips and again China huge appetite is the reason. It's an impetus for Local FABS to step up and file the void.
from cnTechPost
A spokesperson for NIO told cnTechPost in Chinese which translated as "there is no impact at this ti ...
from cnTechPost
A spokesperson for NIO told cnTechPost in Chinese which translated as "there is no impact at this ti ...
I do agree that it is important for local Chinese Fab to fill the void but they are not going to be able to capitalize on that rare opportunity due to COVID-19 simply because the Fab business has a very huge lead time. They can try to ramp up production of the existing Fab but that's about it. To build a new manufacturing line will take time quite sometime, let alone a new Fab. But regardless of that rare opportunity, it is always good for China to master the chip and it's tools (this is the harder part) manufacturing to avoid being subjected again to US sanction in the future.
from onebyone (pakistan defense forum)
According to a report in , Shanghai Micro Electronic Equipment (SMEE) is reportedly on track to deliver its second-gen deep ultraviolet (DUV) lithography scanner by the fourth quarter of 2021.
The tool can produce chips using 28 nm process technologies and relies on components produced in China and Japan, the report said.
And, more importantly, it does not rely on devices made in the US, a major factor in the ongoing Sino-US trade war.
The Trump administration is betting the farm that China won’t find a workaround to its semiconductor chip ban. I don’t know what the odds are, but owing to China’s rapidly expandi…
asiatimes.com
According to a report in , Shanghai Micro Electronic Equipment (SMEE) is reportedly on track to deliver its second-gen deep ultraviolet (DUV) lithography scanner by the fourth quarter of 2021.
The tool can produce chips using 28 nm process technologies and relies on components produced in China and Japan, the report said.
And, more importantly, it does not rely on devices made in the US, a major factor in the ongoing Sino-US trade war.
The Trump administration is betting the farm that China won’t find a workaround to its semiconductor chip ban. I don’t know what the odds are, but owing to China’s rapidly expandi…
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