I know it's biased, but that doesn't change that the stream of Chinese engineers educated by American companies may slow a little
Chinese semiconductor industry
- Thread starter Hendrik_2000
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replace might also mean they get fired from their high paying sales and tech support jobs and someone local gets hired instead.
Naura has multiple subsidiaries that make precision parts for the company equipment, the name magnetoelectric could refer to one that make RF plasma switches and power supplies.
Do the restrictions apply to U.S. citizens or U.S. residents? Just because you have a green card doesn't make you a citizen.
Most Chinese students are residents no citizens.
I'm not a lawyer, but even prohibiting to work for a private foreign firm to a US passport holder sounds highly unconstitutional to me, it could possibly be invalidated in court. So I'm very dubious it will hold water.
Moreover, not from a legal, but from a common sense point of view, this rule is simply savage and absurd. USA, the "land of the free", can control the life and the job choices of their people in this way? C'mon, it's a joke. It just another salvo stunt. I really cannot believe such a personal-freedom limiting rule can survive upon high court examination. I mean, in US even wearing a simple mask seems unenforceable onto the people! And they want to coerce them on their job choice?
Yeah looks like something for a civil lawsuit.
Another word that bugs me is "Indirectly", like what? they are going to arrest any U.S. citizen who's design, paper or source code ended up being used by a Chinese entity without that person knowledge? Or if someone publish the HDL code for a processor in github and a Chinese company use it, they are going to arrest that person? Because that sounds pretty retarded and a recipe for a bigger disaster than the China initiative.
Jiangfeng Electronics: Relevant aluminum targets have been mass-produced at the 5nm technology node
According to Weibo news, recently, an investor asked Jiangfeng Electronics on the interactive platform, Shanghai 14nm mass production, whether your company's equipment has entered its industrial chain? I wish the company to become a world-class semiconductor material company.Jiangfeng Electronics stated on the investor interaction platform on October 8 that the company has established cooperative relations with domestic semiconductor equipment manufacturers and chip manufacturers. The parts and components produced by the company are mainly used for PVD, CVD, etching machines and other semiconductor equipment machines. Taiwan, and has achieved mass production and delivery in many chip manufacturing companies and semiconductor equipment manufacturing companies.
In addition, some investors pointed out that the 2021 annual report P45, ultra-high-purity tantalum (Ta) targets and rings, copper targets (Cu), titanium targets (Ti), aluminum targets ( Al)...and achieve full mass production at the client, of which tantalum targets and rings have been mass-produced in TSMC's 7nm chips. At the same time, some products applied to the 5nm technology node passed the evaluation and were mass-produced, and some products entered the verification stage. Aren't aluminum and titanium targets used for process nodes above 110nm, so what does 28-7nm here have to do with it? Is it for sealing and testing? May I ask how many processes are the most advanced aluminum targets used in the company?
Jiangfeng Electronics stated on the investor interaction platform that the front-end chip manufacturing of the advanced process also requires the use of aluminum targets and titanium targets. At present, the company's related aluminum targets have been mass-produced at the 5nm technology node.
China's high thermal conductivity silicon nitride ceramic substrate breaks through the problem of "stuck neck" - the innovation of Weihai ring silicon nitride ceramic series high-tech products from research and development to mass production
Weihai Ring Advanced Ceramics Co., Ltd., located in Weihai Lingang Economic Development Zone, has been developing high thermal conductivity silicon nitride ceramic substrates for seven years, grasping the details, grasping the core, and constantly discovering and solving various production problems. It has successively developed high-insulation silicon nitride ceramic substrates, conductive silicon nitride ceramic substrates and high-toughness silicon nitride ceramic substrates, and produced a series of products for different purposes.
▲The industry standard specification 0.32mmX139.7mmX190.5mm high thermal conductivity silicon nitride ceramic substrate produced by Weihai Ring
As we all know, the world has entered a critical period for the development of third-generation semiconductors. High thermal conductivity silicon nitride ceramic substrates have mature products in advanced western countries such as the United States and Japan. However, as an important supporting material for high-power third-generation semiconductor devices in the intelligent information age - high thermal conductivity silicon nitride ceramic substrates, the United States and Japan and other Western countries have not only implemented product blockade and technology blockade against my country, but also blocked China with the "Wagner Agreement". , the US government used the "Semiconductor Act" to block my country. Under such difficult conditions, in September 2015, Weihai Ring Advanced Ceramics Co., Ltd. started the road of independent innovation in the research and development of high thermal conductivity silicon nitride ceramic substrate technology, and began to draw the circle of China's silicon nitride ceramic substrate.
Iterative products are excellent and the potential is infinite
At present, the widely used insulating ceramic substrates are mainly alumina ceramic substrates, aluminum nitride ceramic substrates, boron nitride ceramic substrates, beryllium oxide ceramic substrates and silicon nitride ceramic substrates.
Although the alumina ceramic substrate has poor thermal conductivity, the number of quenching and heating cycles is only more than 200, which cannot keep up with the development of high-power semiconductors, but its manufacturing process is mature and low-cost, and there is still a large market demand in the low-end field.
Aluminum nitride ceramic substrates have the best thermal conductivity and have a good match with semiconductor materials, and can be used in high-end industries. However, aluminum nitride ceramic substrates have poor mechanical properties and thermal shock resistance, which affects the reliability of semiconductor devices and the cost of use. higher.
The boron nitride ceramic substrate can maintain high chemical and mechanical stability at very high temperatures, while the thermal conductivity of BN ceramics is comparable to that of normal temperature stainless steel, and the dielectric properties are good. BN is more brittle than most ceramics, has a small thermal expansion coefficient, strong thermal shock resistance, and can withstand rapid changes in temperature differences above 1500 °C. But cubic BN is too expensive to be used to produce high thermal conductivity ceramic materials. The mismatch of thermal expansion coefficient with silicon also limits its application.
Beryllium oxide ceramic substrate has good thermal conductivity, good dielectric properties, good heat resistance, good chemical stability and good thermal shock resistance at high temperature and high frequency. However, the fatal disadvantage of beryllium oxide is the extreme toxicity of its powder. Long-term inhalation of beryllium oxide dust can cause poisoning or even endanger life, and also cause environmental pollution, which greatly affects the production and application of beryllium oxide ceramic substrates. In addition, the high production cost of beryllium oxide limits its production and application.
The silicon nitride ceramic substrate produced by the ring has excellent thermal conductivity, high mechanical strength, low expansion coefficient, good oxidation resistance of silicon nitride, good hot corrosion performance, small friction coefficient and many other excellent properties. Its theoretical thermal conductivity is as high as 400W/(mk), and its thermal expansion coefficient is about 3.0x10-6℃, which has good matching with Si, SiC, GaAs and other materials, making silicon nitride ceramic substrates a very attractive high High strength and thermal conductivity electronic device substrate material.
Among the five commonly used ceramic substrates: alumina ceramic substrates, aluminum nitride substrates, boron nitride substrates, beryllium oxide substrates and silicon nitride substrates, silicon nitride ceramic substrates have relatively balanced performance in all aspects, especially silicon nitride ceramic substrates. Excellent mechanical properties and good high thermal conductivity potential can make up for the deficiencies of other existing ceramic substrate materials, and are structural ceramic materials with the best comprehensive performance. It is an ideal iterative product for circuit ceramic substrates. Therefore, silicon nitride ceramic substrates have unlimited potential as a supporting material for high-power third-generation semiconductor devices in the age of intelligent information.
▲The physical and chemical indicators of Weihai Ring’s production of high thermal conductivity silicon nitride ceramic substrates have reached the international industry-leading quality level
From the perspective of enterprises that have mass-produced high thermal conductivity silicon nitride ceramic substrates, in addition to insulating properties, high thermal conductivity and good bending strength are important indicators for evaluating the quality of substrates.
Difficult innovation road, hope the brave go first
Due to the excellent properties of silicon nitride ceramic substrates, it is difficult to develop high thermal conductivity silicon nitride ceramic substrates, the production cost is high, and the market is small. There are very few scientific and technological personnel in domestic scientific research institutes to study silicon nitride ceramic substrates, and the imported professionals are all an intractable problem. This is also the reason why many new ceramic material companies are waiting to see the road of independent innovation in the research and development of high thermal conductivity silicon nitride ceramic substrate technology, and dare not make up their minds to increase investment.
Since the R&D team of the ring has been determined to overcome this world problem, they have worked hard and spent 7 years to overcome the problem of shortage of R&D funds. From R&D to mass production, they have overcome silicon nitride powder grinding, formulation, pulping and casting all the way. , various process and technical difficulties encountered in degreasing and sintering. Now that seven springs and autumns have passed, the R&D team of Weihai Ring Advanced Ceramics Co., Ltd. has drawn a complete ring. The industry-standard 0.32mmX139.7mmX190.5mm silicon nitride ceramic substrate produced by Weihai Ring has been Reaching the level of mass production, it has broken through the problem of "stuck neck" in my country in the technical protection and application products of high thermal conductivity silicon nitride ceramic substrates in advanced western countries. We also formulated the Weihai Ring Enterprise Standard with reference to the relevant international process standards, which ensures the stability of various physical and chemical indicators of the high thermal conductivity silicon nitride ceramic substrate, realizes the stable, batch, and large-scale production of products, and reaches the international industry-leading quality. Level.
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