Your expectations is more realistic, but I think still unlikely SMIC will have 70K wpm of 14nm/7nm by 2024. With constrained WFE supply, the expected SMIC CAPEx the next few years, and timing of SN2 fab readiness, it's more likely 2026 is when SMIC could output 70K wpm. 2024/2025 for tool-move in, take some time to qualify tools, so E of 2025 or some time in 2026 to be able to turn actual capacity into actual wafer output.If they can get SN1/SN2 up to 70k wpm by 2024, I think most people here should be happy. Heard earlier that getting equipment for advanced nodes is hard. Maybe that will be easier now that domestic suppliers are further along. I don't know how much more they can expand SMSC location. Maybe Lingang will also do advanced node.
As for other stuff, my understanding is the Shenzhen fab is coming online this year. The Beijing one might start production next year but probably won't hit close to 100k until 2025. And then there is a second phase of 100k wpm. Lingang started construction in January, so probably a year behind Beijing and start production in 2024. Tianjin just started construction this week, so probably another 2024 production start. All of this will take a while. They will need to continue to buy Western equipments, especially ASML machines. It's important to not underestimate the difficulties of scaling up production of domestic equipment.
Now, let's take a look at the math that I was talking about. Here's information based on SMIC's announcement:
SMIC SN1 | 35K | 14nm/7nm | $12B |
SMIC SN2 | 35K | 14nm/7nm | $12B |
SMIC Beijing | 100K | 28nm | $7.7B |
SMIC Linggang | 100K | 28nm | $8.9B |
SMIC Tianjing | 100K | 28nm | $7.5B |
SMIC Shenzen | 40K | 28nm | $2.35B |
Total | 410K | $50.45B |
All of these 300mm expansions summed up to $50B in CAPEx. As you had mentioned, Shenzen started to move-in tools this year, in 2022. How fast and how much capacity come online by 2024 will depend on how much they spend in 2023/2024.
As you mentioned, Shenzen started to move-in tools in 2022. SN1 actually moved-in tools as well (I think they had 15K wpm last year), so let's assume $6B worth still need to be spent from beginning of 2022.
- SN1/SN2 to be full, still need to spend $18B ($6B+$12B).
- let's assume Shenzen reach max capacity by 2024 as well: $2.35B
With just these three fabs, SMIC needs to spend $20.35B. Subtract the $5B spent in 2022, SMIC needs to spend another $15B in 2023/2024. ==>$7.5/year in the next two years. that's 50% more worth of equipment than 2022. Even if SMIC actually spend this type of money, it's not like ASML and other WFE could allocate 50% more tools to SMIC over 2022.
So, I think it's more likely SN1/SN2 get filled with tools by 2025 & wafer production 2026. If we assume the $20B is spent in 2023/2024/2025, then it's about $5B/year (which is probably what the WFE suppliers could support).
The above assumes zero investment in Beijing, Tianjing, and Linggang. It's likely SMIC would have to divvy up the wafer fab equipment allocated to them with these 28nm fabs, in that case timing for SN1/SN2 to reach 70K get pushed back even further.
Well, of course the above is assuming ASML/AMAT/KLA/LAM continue to allocated same amount of tools to SMIC in 2023/2024/2025. Any increase or decrease in tool allocation will influence the actual outcome. With ASML telling investors that they will not be able to increase their capacity until 2025/2026, SMIC's expansion plan, like everyone around the world, has to be tapered.
This is my quick and dirty ad hoc analysis for your reference.