Xinrui Micro received tens of millions of yuan in A+ round of financing to develop EDA physics simulation software tools around the Chiplet industry
Recently, Xinrui Micro completed tens of millions of RMB A+ round of financing, invested by Zhongke Chuangxing, and Fengliu Capital served as the exclusive financial advisor. This round of financing will be mainly used for R&D team expansion, as well as industrial integration and company mergers and acquisitions.
Founded at the end of 2019, Xinrui Micro has a team size of nearly 60 people, with R&D personnel accounting for 80%. The core teams are from world-renowned EDA and industrial software companies. The core members have an average of nearly 30 years of R&D experience in the simulation field. The company focuses on the field of EDA physical simulation, and develops a multi-physics system simulation platform that integrates multiple functional modules such as electromagnetic, electrothermal, DC, magnetic loss, stress, fluid, etc., to further fill the gap in the domestic system simulation field. At the same time, the company can also provide customers with one-stop solutions such as wafer-level packaging design and foundry services, IC beta design services, advanced packaging design services, and board-level hardware design services.
As Moore's Law is gradually approaching the physical limit, it is difficult for the industry to achieve a jump in chip performance by doubling the number of transistors. Therefore, many players have begun to try to find new paths from the perspective of packaging, board level, and system level to achieve Moore's Law. Continuation . Under this trend, Chiplet technology, which has the advantages of high performance, low power consumption, high area utilization and low cost, has been paid more and more attention.
Not only that, the shortage of advanced chip production capacity and the tense global environment have accelerated the rapid outbreak of the chiplet field. According to Omdia data, the global chiplet market is expected to reach $5.8 billion by 2024, and this figure will grow to $57 billion by 2035.
The rapid development of chiplet technology has brought new opportunities to the EDA field. In the field of Chiplet design, multi-physics simulation tools that can perform multi-physics simulation analysis for heterogeneous integration and 3D stacking systems, and can provide guidance for design and material selection have become a necessity and the main development of a new generation of EDA. direction.
But challenges are also evident. Guo Ru, founder and CEO of Xinrui Micro, said that in industrial software and EDA tools, simulation tools can be called tools within tools, which need to simulate accurate reality without knowing the real data. In this simulation process, it puts forward higher requirements on the algorithm, architecture, and overall simulation accuracy and performance. "The difficulty of a simulation tool is that it must not only simulate accurately, but also guide the design. It is the most difficult link in the entire industrial software and EDA chain. We hope to continue on this difficult and correct path." She Say.
Since its establishment at the end of 2019, Xinrui Microelectronics has successfully developed four products, including electromagnetic simulation, electrothermal simulation, DC analysis, and thermal circuit extraction, which have been commercialized. Among them, the company's electromagnetic simulation products have laid a solid foundation for other customers to do product migration through in-depth research and development cooperation with leading domestic customers.
For example, in high-density, high-integration electronic equipment, signal integrity and power integrity problems are prominent, and temperature and heat dissipation have become the core problems of the industry. In order to achieve higher performance requirements, the interconnection method must be optimized with the help of electromagnetic, electrothermal and other physical field simulation tools, and the verification and assistance of the optimized design can guide the design and ensure system performance. Based on this, the company's electromagnetic, electrothermal and multiphysics simulation software can provide customers with high-quality, high-reliability design simulation services.
At the same time, in June this year, Xinrui Micro completed the wholly-owned acquisition of Shenzhen Zhongke System Integration Technology Co., Ltd. (referred to as "Shenzhen Zhongke"). Shenzhen Zhongke is a one-stop comprehensive service provider for advanced system-in-package design. Shenzhen Zhongke was established in 2011 and will transplant its industrial accumulation to the Chiplet field in 2021.
Through this acquisition, on the one hand, Xinrui Microelectronics has become an overall solution provider that integrates Chiplet one-stop service with domestic system simulation EDA tools and simulation processes as the core; on the other hand, the company has also completed the complementation of customer types, realizing The number of customers has increased exponentially, further improving the company's sales layout and providing customers with overall solutions.
Guo Ru said that the entire EDA chain can be roughly divided into two parts: chip design EDA and system design EDA. Among them, many domestic players are currently in the field of chip design EDA, such as front-end design, back-end layout and wiring, logic simulation, etc. "Every sector is very difficult, especially in the field of simulation." She explained that Xinrui's simulation software is not only limited to the chip, but more on the packaging and system side, without relying on the maturity of Foundry's advanced process, And it has become an essential EDA tool for design in the chiplet field.
This means that before the domestic advanced process is put into mass production, the company can use simulation methods to help domestic industries use mature 28nm chips and 3D stacking methods to produce equipment and products with more advanced performance. "That is to say, within 5-10 years, we can provide the opportunity to overtake on the curve and break Moore's Law. This is the fundamental reason why we can quickly achieve commercialization, and it is also our differentiated competitive advantage." Guo Ru said.
Therefore, Xinrui will be based on the coupling of single-point tools such as electromagnetic and electrothermal and multi-physics in product planning. Based on this layout, the company's products will first be suitable for commercial customers in terms of landing, and then cooperate with professional vertical customers to accelerate the landing process.
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