sr, that's full...I take it on website
Is anyone else able to see the image? I tried saving it but the resolution came up as 60x1080.
sr, that's full...I take it on website
LMAO. Did you even read the post? So something that is eqivalent of 1st gen TSMC 7nm is hopelessly behind? They admitted that it's similar to Intel 10nm+, and this is just N+1. There is no doubt at this point N+2 will at least be "true" 7nm even by their standard, if not better. Just for everyday reference, Qualcomm Snapdragon 855 is made using 1st generation TSMC 7nm process, and its upgraded variant Snapdragon 860 is still considered a quasi-flagship chip used on flagship killer phones.As I said in the beginning, this story was Western propaganda on the part of sanctions hawks who wanted political capital to push the CHIPS Act, so they released it right before the bill was going to a final vote. There were some people saying CHIPS was a violation of free trade and China was so far behind there was no need for industrial policy. The WSJ was giving voice to these folks because it's still a throwback to the last dying vestiges of Reagan capitalism.
Never trust a report by that D. Patel guy's firm.
Wow, that is impressive. It sounds like by 2017 CIOMP had something that was superior to ASML Alpha Demo Tool of 2006, although Alpha Demo Tool did manage to achieve 32nm exposure after upgrades. Seems that a NXE:3100 equivalent by 2023 will not only be likely, but actually be overdue since it only took ASML 4 years to reach that stage. Prof. Hiroo Kinoshita first proposed EUV lithography in 1985, and by 2017 China managed to close the technological gap from over 2 decades to around a single decade. At this point, it's honestly understandable that technological sanctions are absolutely necessary from the standpoint of US. Nevertheless, NXE:3100 is nowhere near volume production of 7/5nm chips. It remains to be seen when China will possess NXE:3400B equivalent.EUV technology testing platform from 2017, kinda like the concept. Looks suitable to test SSMB as a light source.
View attachment 97418View attachment 97419
General Research Laboratory of Microelectronics Equipment of the Institute of Optoelectronics has made breakthroughs in key unit technologies such as vacuum, film transport, workpiece table, vibration reduction and focus detection: the vacuum system achieves a stable high vacuum environment of 5.8 × 10 -7 Torr , ensuring that The stability of EUV light source propagation is improved; the frame and vibration reduction system of the whole machine meet the VC-F vibration reduction standard, and the vibration isolation effect is good in the frequency range of 2.2Hz - 500Hz in the horizontal direction and 2Hz- 500Hz in the vertical direction . The frame, workpiece table and mask table The stability meets the requirements of 32nm lithography and sub-nanometer wave aberration detection; the leveling and focusing detection system achieves nanometer-level detection accuracy, which provides a guarantee for the continuous multiple repetition of 32nm lithography resolution. At the same time, in the development of the workpiece table, the collaborative control technology of multiple workpiece tables is studied on the basis of the existing ones, which solves the problems of simultaneous control and position switching of the wafer table and the image table, the mask table and the object table; the automatic film feeding system Realize automatic loading and unloading in a vacuum environment ; the software system completes multi-module complex control, and coordinates each sub-system to complete the exposure process.
On the basis of completing the development of the key unit system, it has played a great role in cooperating with the overall project unit Changchun Institute of Optics and Mechanics to achieve 32nm repeatable exposure and with Shanghai Institute of Optics and Mechanics to achieve sub-nanometer wave aberration detection, which has been greatly affected by the overall project unit and each subject unit. And the acceptance group experts praised. During the research and development of the subject, the research group has achieved a series of original achievements in the fields of workpiece table control and precision measurement technology, and has applied for 31 invention patents , including 28 domestic patents and 3 international patents .
Out of curiosity I looked up what pumps ASML uses. They separate the EUV chamber into 2 regions:You are correct, but they have hold almost the same exact vacuum environment for an extended period that require a lot of sensing technology to detect leaks and others issues related to vacuum environments.
You do realize that China won't be adding just mega fabs right?
They have over 30 fabs under construction and only 3 are 100k wpm 12-inch foundries. I'd have to look around for some data sources to see how many under construction are 8-inch and how many are 12-inch and the capacities for them. It seems to me that only SMIC has the resources right now to build 100k wpm megafabs. They are building 3 and only have 1 in operation. Everyone else is just building like 30k here and then expand 30k later and so forth. Also, we are about to hit a major global recession.
But if they have 20 8-inch fabs of average 50k wpm + another 12 12-inch fabs of average 40k wpm under construction -> that would be about 2.2 million 8-inch wpm. That's quite a bit of capacity coming online every 2 years. With an impending global recession, demand is also not going to grow at same rate as the last couple of years.
wsj is the one that said China has 31 "major semiconductor factories"Of course
Are you sure this capacity is coming online in 2 years? It doesn't match up with the data below.
For 2022, Taiwan+Korea are expected to account for $59 Bn (54% of global fab investment)
In comparison, China is only at $17 Billion (16% of global fab investment)
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30 Chinese Fabs in 2 years also also doesn't match up with the reported sales of DUV systems from ASML to China in 2021, nor the anticipated fab starts below
What second hand? All world fab capacity is being used just about. The chip market is supposed to go into oversupply this year though.I'm not sure why China needs ASML DUVs for most of these 8 inch fabs that are of more mature nodes. I don't know the exact number they are importing this year from ASML, but it sounded like a lot from their Q1 numbers and other rumors on this forum. Also, second hand ASML DUVs are probably sufficient for everything outside of SMIC's advance node foundry.