Chinese semiconductor industry
- Thread starter Hendrik_2000
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ST invented BCD technology in the '80 but currently they have only until 90nm (40nm in development)
GlobalFoundries has 55nm since 2018
TSMC is the only one with a lower node, 40nm developed very recently just in 2019/2020
So it seems SMIC has closed the gap with western counterparts, now it's time to sell it
Dynamic overview of 83 projects including SMIC (Tianjin), Yuexin Semiconductor, and Jita Semiconductor
According to WeChat news, since August 2022, the number of integrated circuit contracts and construction projects across my country has shown an upward trend compared with July, with an increase of more than 40%. Shanghai, Tianjin, Jiangsu, Guangdong, and Zhejiang have ushered in major projects, and it is expected to usher in a "small climax" of project start-up in September at the end of the third quarter. The following is an overview of the progress of integrated circuit projects for the month:Over 31 projects have been signed, involving 13 provinces (municipalities/autonomous regions), including the Xinwang micro-vehicle MCU R&D and testing center project, the photomask material industry chain project, SMIC (Tianjin) 12-inch factory, Jinglong Technology IC Advanced test items for high-end chips, etc.;
Over 36 projects have started, involving 15 provinces (municipalities/autonomous regions), including Ningxia Dunyuan Juxin "semiconductor-grade silicon material expansion" project, high-end power semiconductor device and module R&D and production projects, Yuexin Semiconductor's three Phase project, JTA Semiconductor’s advanced automotive-grade chip expansion project, Ideal automotive power semiconductor R&D and production base, etc.;
Over 6 projects have been capped and completed, including the complete capping of the main structure of the National Star Optoelectronics Geely Industrial Park project, and the completion of the second phase of the clean room of the 8-inch MEMS foundry line in Saiwei Electronics Beijing;
More than 8 projects have been put into production and mass production, including Jiangsu Bomin high-end HDI (SLP, IC carrier board) project, Hefei Xinyihua mass production of small and medium-sized Mini LED mass production equipment delivery and delivery, Hefei Qingyi Optoelectronics 8.5th generation and The following high-precision mask projects are mass-produced;
Over 2 project equipment moved in, including Huizhou Huaxing Optoelectronics Project, TCL Huaxing Project, etc.;
More than 5 funds have been established, including Yangzhou Science and Technology Fund of Funds, Hubei Changjiang (Xantao) Industrial Fund, etc.
Led by Zhang Rujing, the 3 billion yuan mask material industry chain project was signed and settled in Jiaxing, Zhejiang
On August 19, the signing ceremony of the photomask material industry chain project with a total investment of 3 billion yuan was held in Jiaxing, Zhejiang. The project leader, Dr. Zhang Rujing, attended the signing ceremony. The total investment of the project is 3 billion yuan, and the first phase investment is 1.1 billion yuan. It will be settled in the Integrated Circuit Industrial Park of Nanhu High-tech Zone, mainly engaged in the research and development and manufacture of products related to the photomask material industry chain. The project is scheduled to start in September this year.
Xinyuanwei Shanghai Lingang R&D and Industrialization Project started
On August 5, the Lingang R&D and industrialization project of Shenyang Xinyuan Microelectronics Equipment Co., Ltd. started construction in Shanghai Lingang New Area.
The project covers an area of 45 acres, with a planned total construction area of about 54,000 square meters. It targets the research, development and industrialization of integrated circuit lithography process glue developing equipment and chemical cleaning equipment for high-end process technology nodes.
Funding:
equipment:
Yinguan Semiconductor raised over led by CCB Investment and Juntong Capital, joined by Jizi Investment, Addor Investment, Costone Capital, Fujian Zhanxin, and Grit Ventures. Yinguan Semiconductor makes for semiconductor equipment, including precision motion platforms, specialized motors, piezoelectric products, and drive control products. Funds will be used for R&D, increasing production line capacity, and hiring. Founded in 2019 as a spin out from Fudan University, it is based in Shanghai, China.
Ningbo Qixin Semiconductor Technology received angel financing from Hangzhou Changjiang Venture Capital. The company offers electromechanical integration systems and computer integrated manufacturing (CIM) for cleanrooms and semiconductor fabs. Based in Ningbo China, it was founded in 2019.
Sharetek received new venture funding from Huaqing Capital and Fengqiao Capital. Sharetek manufactures industrial for semiconductor, automotive and consumer electronics, and other industries. Its products include including vacuum reflow soldering, wafer mounting, test automation, automatic assembly, and welding machines. It also offers a variety of software for industrial automation, including manufacturing execution system (MES) and an industrial IoT platform. The company says it has built out a complete auto-grade IGBT automatic packaging and testing factory. Funds will be used for R&D, construction of new production and R&D facilities, and hiring. Founded in 2007, it is based in Shanghai, China.
Testing:
CIMS raised over CNY 250.0M (~$36.6M) in funding from CDH Investments. CIMS provides solutions, automated final/visual inspection solutions, metrology and add-on inspection options, and system upgrade solutions for PCB, high density interconnect PCB (HDI PCB), flex and rigid-flex PCB, and IC substrates. Funds will be used for R&D and expanding to new applications. Founded in 2005 as a subsidiary of Camtek, it spun out into an independent company in 2017. It is based in Suzhou, China.
Zenfocus Semiconductor Technology raised (CNY 100.0M is ~$14.7M) in a Series B round led by the Beyond Moore Fund, joined by China Fortune-Tech Capital, Fortune Venture Capital, GP Capital, Hefei Industry Investment Group, Royal Sea Capital, Shenzhen High-tech Investment and Equity Investment Fund Management, Stonybrook Capital, and Yunhao Capital. Zenfocus provides test interfaces for wafers and finished products, including ATE test boards, high-speed 2D/3D MEMS probe cards, multi-layer organic substrates, multi-layer ceramic substrates, and memory probe cards. Based in Shanghai, China, it was founded in 2015.
Sandtek Corporation raised CNY 100.0M (~$14.7M) in funding from Hillhouse Capital, Yongxi Capital, and others. Sandtek is a provider. It specializes in ATE product development, test cell integration, and consulting services for digital, analog, mixed signal, and RF. Founded in 2016, it is based in Shanghai, China.
Avant Semiconductor raised (CNY 10.0M is ~$1.5M) in pre-Series A funding from Hundreds Capital and others. Avant Semi makes equipment. Its first product, an automated epitaxial film thickness and element measurement system for 6- and 8-inch wafers, uses FTIR (Fourier Transform Infrared Spectroscopy) for non-destructive, high-sensitivity analysis. Along with epitaxial layers, it can also measure photoresist thickness, CMP polished thickness, and element concentrations. The company recently announced its first shipment to customers. Funds will be used for mass production and development of new equipment. Based in Shanghai, China, it was founded in September 2021.
Dihuge Automation raised tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series B1 financing led by Lufeng Investment and joined by Yonghua Investment. Dihuge develops machine vision and deep learning-powered industrial software for and inspection. It targets consumer electronics, semiconductor wafers, and 5G filters. It has recently expanded into lithium battery inspection and positioning, including diaphragms, lamination, and soft-packed cells. Based in Hefei, China, it was founded in 2017 as a spin out from the Chinese Academy of Sciences.
equipment:
Yinguan Semiconductor raised over led by CCB Investment and Juntong Capital, joined by Jizi Investment, Addor Investment, Costone Capital, Fujian Zhanxin, and Grit Ventures. Yinguan Semiconductor makes for semiconductor equipment, including precision motion platforms, specialized motors, piezoelectric products, and drive control products. Funds will be used for R&D, increasing production line capacity, and hiring. Founded in 2019 as a spin out from Fudan University, it is based in Shanghai, China.
Ningbo Qixin Semiconductor Technology received angel financing from Hangzhou Changjiang Venture Capital. The company offers electromechanical integration systems and computer integrated manufacturing (CIM) for cleanrooms and semiconductor fabs. Based in Ningbo China, it was founded in 2019.
Sharetek received new venture funding from Huaqing Capital and Fengqiao Capital. Sharetek manufactures industrial for semiconductor, automotive and consumer electronics, and other industries. Its products include including vacuum reflow soldering, wafer mounting, test automation, automatic assembly, and welding machines. It also offers a variety of software for industrial automation, including manufacturing execution system (MES) and an industrial IoT platform. The company says it has built out a complete auto-grade IGBT automatic packaging and testing factory. Funds will be used for R&D, construction of new production and R&D facilities, and hiring. Founded in 2007, it is based in Shanghai, China.
Testing:
CIMS raised over CNY 250.0M (~$36.6M) in funding from CDH Investments. CIMS provides solutions, automated final/visual inspection solutions, metrology and add-on inspection options, and system upgrade solutions for PCB, high density interconnect PCB (HDI PCB), flex and rigid-flex PCB, and IC substrates. Funds will be used for R&D and expanding to new applications. Founded in 2005 as a subsidiary of Camtek, it spun out into an independent company in 2017. It is based in Suzhou, China.
Zenfocus Semiconductor Technology raised (CNY 100.0M is ~$14.7M) in a Series B round led by the Beyond Moore Fund, joined by China Fortune-Tech Capital, Fortune Venture Capital, GP Capital, Hefei Industry Investment Group, Royal Sea Capital, Shenzhen High-tech Investment and Equity Investment Fund Management, Stonybrook Capital, and Yunhao Capital. Zenfocus provides test interfaces for wafers and finished products, including ATE test boards, high-speed 2D/3D MEMS probe cards, multi-layer organic substrates, multi-layer ceramic substrates, and memory probe cards. Based in Shanghai, China, it was founded in 2015.
Sandtek Corporation raised CNY 100.0M (~$14.7M) in funding from Hillhouse Capital, Yongxi Capital, and others. Sandtek is a provider. It specializes in ATE product development, test cell integration, and consulting services for digital, analog, mixed signal, and RF. Founded in 2016, it is based in Shanghai, China.
Avant Semiconductor raised (CNY 10.0M is ~$1.5M) in pre-Series A funding from Hundreds Capital and others. Avant Semi makes equipment. Its first product, an automated epitaxial film thickness and element measurement system for 6- and 8-inch wafers, uses FTIR (Fourier Transform Infrared Spectroscopy) for non-destructive, high-sensitivity analysis. Along with epitaxial layers, it can also measure photoresist thickness, CMP polished thickness, and element concentrations. The company recently announced its first shipment to customers. Funds will be used for mass production and development of new equipment. Based in Shanghai, China, it was founded in September 2021.
Dihuge Automation raised tens of millions of yuan (CNY 10.0M is ~$1.5M) in Series B1 financing led by Lufeng Investment and joined by Yonghua Investment. Dihuge develops machine vision and deep learning-powered industrial software for and inspection. It targets consumer electronics, semiconductor wafers, and 5G filters. It has recently expanded into lithium battery inspection and positioning, including diaphragms, lamination, and soft-packed cells. Based in Hefei, China, it was founded in 2017 as a spin out from the Chinese Academy of Sciences.
materials:
Fuyang Sineva raised led by China Capital Investment Group and CDB Manufacturing Transformation and Upgrade Fund, joined by CNBM New Material Fund, Optics Valley Industrial Investment, Huoyan Fund, and others. The company makes KrF and ArF , OLED materials, semiconductor wet electronic chemicals, and other specialty materials. Funds will be used for R&D and to expand production. A subsidiary of Sineva Group, it was founded in 2013 and is based in Fuyang, China.
Hygood New Technology drew over CNY 300.0M (~$43.8M) in funding from investors including Haiwang Capital. Hygood manufactures and components, which have high thermal conductivity and electrical insulation. Its substrates are used in power ICs, LED packages, RF/microwave communications, automotive electronics, and image sensing. Founded in 2008, it is based in Wuxi, China.
Crystro Crystal Materials raised nearly CNY 100.0M (~$14.7M) in Series A funding led by Bridge Capital China. Crystro Crystal Materials specializes in the processing and manufacturing of , including optical communications crystals, RF filter crystals for SAW and BAW filters, laser crystals, and piezoelectric crystals, as well as the design and production of optical devices. Funds will be used to expand production capacity, R&D, procurement of process equipment, and the construction of purification plants. Founded in 2017, it is based in Hefei, China.
Rivergate Electronics, also known as Haoyuan Technology, raised from Bridge Capital. The company produces LED packaging substrates, IC packaging substrates, and ceramic copper clad laminates. Based in Jiangmen, China, it was founded in 2018.
Chip Design:
Nuclei Technology raised (CNY 100.0M is ~$14.7M) in new financing led by Legend Capital and joined by Accurate Capital, Bluerun Ventures, C&D Emerging Investment, Xiaomi, Shanghai International Group, Shougang Fund, Sunic Capital, Xianghui Capital, Zhejiang Paradise, and Zhongguancun Development Frontier Enterprise Investment Fund. Nuclei Technology develops RISC-V CPU IP. It offers a range of processors from low-power 32-bit, 2 stage pipeline cores for MCUs and IoT devices through to high-performance 64-bit, 9 state pipeline architectures capable of running Linux for data center, networking, and baseband applications. Funds will be used to develop IP targeted for security, automotive, and AIoT applications. It also plans to develop hard IP for chiplets and explore heterogenous systems using its cores. Based in Shanghai, China, it was founded in 2018.
Eaglechip, also known as Yige Technology, raised that included Matrix Partners China, Redpoint China Ventures, Sequoia Capital China, CTC Capital, and VLight Capital. Eaglechip designs and associated EDA toolchains. Its first product, a 500K LUT FPGA, is expected to launch within two years. Funds will be used for new product development. Based in Suzhou, China, it was founded in January 2022.
IC Bench received from Intel Capital, Lenovo Capital, and EDA company Primarius Technologies. IC Bench provides from concept through to manufacturing, and says it has produced several SoC designs based on RISC-V. The startup is also developing EDA tools. Based in Shanghai, China, it was founded in 2020.
KiwiMoore raised CNY 100.0M (~$14.7M) in angel and seed funding led by CasStar and joined by Fosun Capital, Junsan Capital, Step Fund, and others. KiwiMoore designs 2.5D and 3D IC chiplets and enabling technology, including a high-performance and chiplet software design platform for high-speed communication interfaces, distributed near memory compute, and high-efficiency power networks. The startup also offers an advanced packaging shuttle line, a library of chiplets, and design services. It targets chips designed for markets such as next-generation data centers, autonomous driving, and the metaverse. Funds will be used for R&D, hiring, and marketing. Based in Shanghai, China, it was founded in 2021.
Fuyang Sineva raised led by China Capital Investment Group and CDB Manufacturing Transformation and Upgrade Fund, joined by CNBM New Material Fund, Optics Valley Industrial Investment, Huoyan Fund, and others. The company makes KrF and ArF , OLED materials, semiconductor wet electronic chemicals, and other specialty materials. Funds will be used for R&D and to expand production. A subsidiary of Sineva Group, it was founded in 2013 and is based in Fuyang, China.
Hygood New Technology drew over CNY 300.0M (~$43.8M) in funding from investors including Haiwang Capital. Hygood manufactures and components, which have high thermal conductivity and electrical insulation. Its substrates are used in power ICs, LED packages, RF/microwave communications, automotive electronics, and image sensing. Founded in 2008, it is based in Wuxi, China.
Crystro Crystal Materials raised nearly CNY 100.0M (~$14.7M) in Series A funding led by Bridge Capital China. Crystro Crystal Materials specializes in the processing and manufacturing of , including optical communications crystals, RF filter crystals for SAW and BAW filters, laser crystals, and piezoelectric crystals, as well as the design and production of optical devices. Funds will be used to expand production capacity, R&D, procurement of process equipment, and the construction of purification plants. Founded in 2017, it is based in Hefei, China.
Rivergate Electronics, also known as Haoyuan Technology, raised from Bridge Capital. The company produces LED packaging substrates, IC packaging substrates, and ceramic copper clad laminates. Based in Jiangmen, China, it was founded in 2018.
Chip Design:
Nuclei Technology raised (CNY 100.0M is ~$14.7M) in new financing led by Legend Capital and joined by Accurate Capital, Bluerun Ventures, C&D Emerging Investment, Xiaomi, Shanghai International Group, Shougang Fund, Sunic Capital, Xianghui Capital, Zhejiang Paradise, and Zhongguancun Development Frontier Enterprise Investment Fund. Nuclei Technology develops RISC-V CPU IP. It offers a range of processors from low-power 32-bit, 2 stage pipeline cores for MCUs and IoT devices through to high-performance 64-bit, 9 state pipeline architectures capable of running Linux for data center, networking, and baseband applications. Funds will be used to develop IP targeted for security, automotive, and AIoT applications. It also plans to develop hard IP for chiplets and explore heterogenous systems using its cores. Based in Shanghai, China, it was founded in 2018.
Eaglechip, also known as Yige Technology, raised that included Matrix Partners China, Redpoint China Ventures, Sequoia Capital China, CTC Capital, and VLight Capital. Eaglechip designs and associated EDA toolchains. Its first product, a 500K LUT FPGA, is expected to launch within two years. Funds will be used for new product development. Based in Suzhou, China, it was founded in January 2022.
IC Bench received from Intel Capital, Lenovo Capital, and EDA company Primarius Technologies. IC Bench provides from concept through to manufacturing, and says it has produced several SoC designs based on RISC-V. The startup is also developing EDA tools. Based in Shanghai, China, it was founded in 2020.
KiwiMoore raised CNY 100.0M (~$14.7M) in angel and seed funding led by CasStar and joined by Fosun Capital, Junsan Capital, Step Fund, and others. KiwiMoore designs 2.5D and 3D IC chiplets and enabling technology, including a high-performance and chiplet software design platform for high-speed communication interfaces, distributed near memory compute, and high-efficiency power networks. The startup also offers an advanced packaging shuttle line, a library of chiplets, and design services. It targets chips designed for markets such as next-generation data centers, autonomous driving, and the metaverse. Funds will be used for R&D, hiring, and marketing. Based in Shanghai, China, it was founded in 2021.
Better not high. I sense a desire to be recognized by that corporation here though. If Apple Inc. takes up too much capacity of YMTC (or BOE for that matter), especially if it occupies high-end supply, other companies who have to rely on domestic/Chinese suppliers wouldn't be able to get the components they need. Apple Inc. can use other suppliers. There is no lack of companies who could use YMTC for sound relationships.
Apple will basically be funding YMTC capacity buildup though, so this isn't too bad.
YMTC should be ramping up production even more than planned, so that they can displace the competitors.
SMEE's DUVi 28nm already delivered.
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