Chinese semiconductor industry

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ansy1968

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What miracle ?
Sir my guess, it's the Mythical 22nm DUVL. ;) IF the rumored is to be believe that Huawei had taken the task to develop it together with SMEE (I don't buy the accusation that they pirated their engineer because they are part owner with small share in SMEE) and with @olalavn post of a possible Hisilicon 7nm chip in 2024, IF our speculation do come true by 2024, we may see a 5nm (ASML duvl) chip produce by SMIC together with Huawei 7nm domestic line chip.;)
 

european_guy

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Absolutely massive - YMTC to supply Apple with 3D NAND for upcoming iphone 14s. Further integrating China to global supply chains.

Decoupling happening everywhere except in the numbers and facts. Brutal.

That's really huge and brave from YMTC. Congratulations!

Just to give you an idea of what kind of crap YMTC is challenging, I report here a link to a Denmark think-tank, bounded to a neocon US think-tank.

8 Solutions for Mitigating the Threat of an Apple-YMTC Deal​

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China’s Army to Infiltrate iPhones with YMTC Chips​

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The site here above is owned and operated by Strand Consult, an "independent company which has provided strategic research to the global mobile industry" (
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One of the firm partners (
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) has an affiliation with American Enterprise Institute that defines itself "center-right Washington, D.C.–based think tank" (
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Browsing a bit across their nonsense I made up my mind they really have no idea what they are writing about. And these are the consultants that advice the politicians (that have even less idea of them). This could explain why US policies against China are too late in the best case or even backfire. These guys do not care to go deep and dive objectively in the available information, they just tell to their politicians "customers" what they want to hear.
 
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tokenanalyst

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Xinyuanwei (KingSemi): At present, the orders in hand are full, and the production of the previous products will be scheduled for next year​


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Jiwei.com news, recently, Xinyuanwei said in an institutional survey that the company is currently full of orders. As of June 30, 2022, the company's contract liabilities reached 627.76 million yuan, an increase of 78% from the end of 2021. From the perspective of sales, the company's front-end glue coating and developing machines offline, I-line, and KrF machines have all achieved batch sales, and the company's front-end physical cleaning machine market share is also steadily increasing; Judging from the situation of signing orders, the company Products in the front-end field have achieved rapid volume growth, and the proportion of front-end products in the structure of newly signed orders this year has increased significantly.

Xinyuan Micro said that advanced packaging and small size (compound semiconductors, etc.) are the traditional advantages of the company. After years of development, the technical strength and cost-effectiveness of the company's products have been widely recognized by customers. Changdian Technology, Huatian Technology, Tongfu Microelectronics, Sanan Optoelectronics and other well-known manufacturers. In recent years, the company has continued to carry out technical iterations in the back-end and small-size fields, continuously upgraded the machine technology level, and continuously consolidated its leading position in the segmented field. At present, the product signing status is good and in line with market expectations.

Regarding the decline in the R&D expense rate in the interim report, Xinyuanwei pointed out that the main reason is that some R&D projects are in the design stage, there is a lag effect in the procurement and use of R&D materials, and the R&D expense rate has decreased in stages.

Xinyuan Micro said that the Shenyang Feiyun Road factory is mainly engaged in advanced packaging and small size products; the Shenyang Caiyun Road factory is mainly responsible for the front-end glue developing machine KrF and below process machines and the front-end physical cleaning machine and other products; Shanghai The Lingang factory is mainly engaged in the production of the front-end glue developing machine ArF and above process machines and the front-end chemical cleaning machine. The three factories cooperate with each other, and each has its own focus to jointly ensure the company's technology research and development and product delivery in different segments.

It is reported that the company is currently full of orders in hand, and the production of the previous products will be scheduled for next year. The company will continue to increase the recruitment and training of design and production personnel, continue to promote the rolling pre-investment of scarce materials, and ensure the supply and delivery capacity of the previous products.

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AF-1

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55nm BCD process, how advance is it, how it compares with western counterparts? What is the level of western ones? I managed to google 11nm by ST.
 
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