The performance parameters of semiconductor equipment are equal to the international level. This subdivision leader revealed that the current order is full.
The core technology formed by the independent research and development of the three major products has reached the international advanced level, and the overall performance and key parameters of the company's products have reached the international level of similar equipment.
Today, Tuojing Technology (piotech) disclosed the survey minutes of institutions. The company welcomed 102 institutions for research from July 1 to July 31, including many well-known foreign institutions such as GIC, UBS Asset Management, and Morgan Stanley.Tuojing Technology is mainly engaged in high-end semiconductor special equipment. The main products include three series of plasma enhanced chemical vapor deposition (PECVD) equipment, atomic layer deposition (ALD) equipment and sub-atmospheric pressure chemical vapor deposition (SACVD) equipment. It is worth noting that the company is also the only domestic manufacturer of integrated circuit PECVD and SACVD equipment for industrial application. Its products have been widely used in domestic mainstream wafer fab production lines such as SMIC, Hua Hong Group, and Yangtze Memory.In this survey, Tuojing Technology said that in the first half of the year, the company closely followed the rhythm of the expansion of downstream fabs and actively promoted the signing of orders.
At present, the company has full orders in hand.In terms of product technology, Tuojing Technology mentioned that the core technology formed by its three major products has reached the international advanced level, and the overall performance and key parameters of the company's products have reached the international level of similar equipment.Among them, in terms of PECVD products, Tuojing Technology said that it can basically achieve the coverage of various types of thin film processes of 28nm and above, including general-purpose dielectric films, advanced dielectric films and hard masks.In addition, the company continues to be optimistic about the market development potential of PECVD, and believes that PECVD is the most widely used in thin film deposition equipment. It is expected that the PECVD equipment market will still show a growth trend in the next few years.Tuojing Technology also disclosed the progress of other products in the survey. The company's PEALD equipment can cover the logic chip 55-14nm SADP, STI process and storage fields, and
the product has achieved industrial application; ThermalALD is mainly used in logic chips below 28nm,
Currently optimized design and verification tests are carried out according to customer specifications.In terms of the progress of advanced production lines, Tuojing Technology revealed that its products currently used in advanced production lines of 14nm and below are mainly under verification, and the progress of equipment verification needs to be determined by the customer's rhythm.
