Zhongsi Technology Electronic Technology Co., Ltd. (hereinafter referred to as "Zhongsil Technology"), which focuses on the field of high-end chemical mechanical planarization (CMP) equipment, participated in this semiconductor enterprise exhibition, mainly showing its new generation of 8-inch CMP Equipment TENMS ® 200S CMP, 6 inch CMP equipment TENMS ® 150 CMP and 12 inch CMP equipment TTAIS™ 300 CMP.
As a new generation of 8-inch CMP equipment, TENMS ® 200S CMP has the highlights of high reliability, advanced automatic control software, and small footprint, which can be applied to Si/STI/ILD/Poly/Si/W/Cu and other processes . It is worth emphasizing the small footprint. The TENMS ® 200S CMP covers an area of only 5.94M 2 , which greatly improves the output rate per unit area of the equipment. Generally speaking, in order to improve the production efficiency of the purification plant, the 8-inch wafer fab needs to The smaller the footprint of the device, the better.
On the basis of 8-inch CMP equipment, through independent innovation, Zhongsil Technology has developed the first 12-inch CMP equipment TTAIS™300 CMP that can support both 3-disc and 2-disc processes at the same time. The equipment adopts a new compact structure of 6x independent grinding modules and 2x independent cleaning modules, which has higher process flexibility and better process compatibility. In the process of chip production, it provides high maintainability, high production efficiency, comprehensive The advantages of low cost of use can not only save costs but also speed up research and development.
In addition, Zhongshi Technology's 6-inch CMP equipment TENMS ® 150 CMP is suitable for third-generation semiconductors, and is the first to provide planarization solutions for domestic third-generation semiconductor customers.
With these innovative CMP equipment, Zhongsi Technology has been recognized by more and more customers. In the first half of this year, the epidemic shrouded the semiconductor industry, which hindered the semiconductor industry. However, Zhongsil Technology continued to innovate through its own advantages, actively responded to the changing market environment, broke through many difficulties, and achieved good results. Among them, Zhongshi Technology's 6-inch CMP equipment has performed exceptionally well. This equipment has entered several mainstream third-generation semiconductor customers in China, laying a solid foundation for the subsequent outbreak of third-generation semiconductors. At present, 12-inch CMP equipment has also been used. All tests have been completed, and it is ready to enter the production line for verification in the second half of the year, contributing to the localization of 12-inch CMP equipment and building a high-quality development route for the company.
It cannot be ignored that factors such as repeated epidemics and inflation in the second half of the year also affect the development of the semiconductor industry, but they will not change the development direction of the localization of semiconductor equipment, and localized equipment still has huge market prospects. Zhongsil Technology accurately determines the future market, and focuses its business on promoting the verification of 12-inch CMP equipment on the client side in the second half of the year, and strives to do a good job in client support and services, so as to promote the further maturity of equipment technology and be recognized by the industry. At the same time, Zhongsil Technology will also insist on promoting research and development, mass production and quality control, etc., to prepare for the iteration of CMP equipment.