@Rettam Stacf bro one more, they know how to leverage their advantage especially with ASML.
TSMC saying to them "Whose number 1"
ASML answer "We're not Worthy"
Chinese semiconductor industry
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TSMC saying to them "Whose number 1"
ASML answer "We're not Worthy"
Looks like this company is making equipment for RAM production, Resistive RAM and Magnetic RAM.
Ion Beam Etching, Reactive Ion Beam Etching, Ion Beam deposition and spectrometers for contamination control.
I think CETC another one making this kind of equipment.
Kurt Campbell China Pivot policy is done without any historical input , the way they devised The twin pillar of US security strategy in East Asia is an example. Especially regarding SK, cause China hold a lot of leverage aside from NK, hatred against the Japanese , you have to include Huawei as well....lol
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"Leuven Instruments was established in 2015 by the joint investment of Leuven Instruments in Belgium and the Institute of Microelectronics of the Chinese Academy of Sciences"
The high NA EUV scanner will be able to do 3nm and 2nm more quickly, with fewer steps, and thus more cheaply at scale than the current EUV scanner. This will be especially necessary for expanding potential demand for those nodes. It will also enable sub 1 nm nodes in theory. So even if the equipment cost is more expensive the overall production cost is cheaper.
@latenlazy Thanks Sir for the explanation, I'm just surprised that TSMC wasn't the first and I'm not belittling Intel, for me technical wise TSMC will be able to exploit this machine to its fullest and that will be a great advert for ASML.
And sir since we are on topic, can SSMB do the same, In theory can it perform the same function or even better, from @coolieno99 post I see its merit especially compare to the current EUVL and regular maintenance of its optics?
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High NA is an optical configuration to get finer beam line width and thus better scanning resolution. However, the increase in optical elements for high NA also translates to greater photon loss, so a more powerful light source is needed to compensate. How that compares for or affects the economics of a potential SSMB based lithography system is an open question, since from the sounds of it to make SSMB economically viable would require a totally different organization of FAB production infrastructure from how the industry currently works.
The higher image contrast of HiNA projection system compare to the current EUVL will provide more photon not less. This is one selling point of he HiNA system in addition to better resolution capability.
If ASML could really successfully deliver the HiNA EUVL then it would be even more difficult for SSMB to compete. The gap for us to catch up actually widens.
With an EUV optical system photon loss from scattering is a major factor in the optical design (due to how high energy the photons are). Higher NA optical elements will introduce proportionally more scattering, and thus more photon loss. In optical systems at much longer wavelengths scattering loss is far more negligible. With EUV you need to consider photonic factors, not just traditional optical factors. There’s a reason why EUV systems require much more powerful light sources but still end up with lower scanning speeds. That said I’m not arguing that ASML’s high NA machine will deliver fewer photons to the scanning table than lower NA machines. I’m just pointing out that they have had to increase the power of the light source considerably to make it worthwhile.
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From what I've read, high NA is optics based improvement, not source based improvement. So it is completely independent of the EUV source, SSMB with equivalent optics would have equivalent improvement.
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