Chinese semiconductor industry
- Thread starter Hendrik_2000
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Huawei's smartphone sales have shrunk but that doesn't mean Huawei lost any smartphone business division. What smartphone business division did Huawei lose? Then which division in Huawei is developing, designing, manufacturing and marketing all those new Huawei smartphones being launched?
The reason Huawei's smartphone sales have shrunk is because Huawei can't get access to semiconductor chips. The decline in smartphone sales is the RESULT of the problem of not having semiconductor manufacturing business. I don't understand how that conversely leads to the reason not to get into semiconductor manufacturing business. You don't make sense how "get into semiconductor manufacturing business" is not appropriate for a company whose biggest problem is lack of access to semiconductor chips. Samsung started semiconductor manufacturing business even before smartphone.
There is no such fact.
There's no way around it, 28 nm has a ton of advantages in cost such as being essentially the best planar transistor before FinFET. FinFET requires new materials and processes that represent a large leap in cost.
However 28 nm also has a form factor advantage that makes it hard to get rid of. For instance many 200 mm fabs move up to 300 mm for productivity and thus transition from say 130 nm to 90 nm on more modern tools which also have an automation advantage. But 28 nm is already using modern 300 mm tools with full automation.
Also, 28 nm is already good enough or even overboard for many products like analog, microcontrollers, power, RF, optoelectronics, etc. So there's no real worry of 28 nm disappearing, it represents a "frontier" node (best planar transistor). Watch for the in-between nodes like 45 nm to decline instead.
is there a chinese company that makes 300m wafers at production scale?
antiterror13
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SMIC, Huahong, Changxin, Cansemi, Nexchip, Tsinghua Unigroup, YMTC .. want more ?
What is actually your intention with that question ?
450 mm tools have significant challenges in etch and deposition tools due to uniformity issues. For example, to just maintain temperature uniformity over a 300 mm wafer at current process nodes you need 100 independently controlled temperature zones. Uniform heating impacts everything else such as plasma density, adsorption of inert species, etc.
That's not all. For capacitive plasmas the etch rate is anisotropic. It peaks in the center. This was even a problem at 200 mm. The increase to 450 mm severely exacerbate the problem.
The other problem is that lithography becomes the limiting step as exposure field doesn't increase, so each lithography step takes longer.
I think he's talking about the wafer production, not the chip manufacturing using wafers as an input. It's currently dominated by Japanese companies, but there's a Chinese competitor called zing semiconductor and the nominally Japanese ferrotec which is focused on production in China, has a Chinese company president and praises the made in China 2025 Initiative on its websiteSMIC, Huahong, Changxin, Cansemi, Nexchip, Tsinghua Unigroup, YMTC .. want more ?
What is actually your intention with that question ?
but Chinese lithography producers are not leading edge, so I am not sure if they have the capability to increase brightness. Every manufacturer in general tries to have the brightest light source possible so what we see right now is the leading edge.
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