Chinese semiconductor industry

bettydice said:

On the contrary it says in the article:

"One person with knowledge of the matter says that the company has stopped taking orders and is preparing to close its corporate office in Russia, which deals with telecommunications and networking equipment. The Chinese employees of the Russian office and part of the Russian specialists will leave the territory of Russia, and the rest will be on vacation."

"In fact, Huawei stopped the conclusion of new contracts with Russian telecom operators for the supply of network and server equipment."

"For now, there is no change regarding the consumer goods segment, which includes tablets, laptops, smartphones and other smart gadgets."

The source is Forbes, so I don't fully believe it though.

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I've already addressed that in one of my previous posts - my friend works in Huawei RRI (Russia Research Institute) Moscow and they are actively hiring with Chinese employees leaving\arriving as usual. All other R&D institutes (e.g. in Novosibirsk) are also fully operational and hiring. There are no plans to close or even freeze\shrink them, so this is bs.

The part about halting new contracts on telecom equipment is true. However, as far as I know, the main reason is that a lot of currently sold solutions use American components and hence are subject to sanctions, so Huawei is searching for alternatives and will resume trading when these issues are handled.

China Micro Corporation (AMEC) received a purchase order for 52-cavity MOCVD equipment from Zhaochi Co., Ltd.

Recently, Nanchang Zhongwei Semiconductor Equipment Co., Ltd. (hereinafter referred to as "Nanchang Zhongwei"), a wholly-owned subsidiary of Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd. The purchase order for 52-cavity Prismo Unimax® MOCVD equipment of Jiangxi Zhaochi Semiconductor Co., Ltd. has been successfully held in Nanchang High-tech Zone.

Recently, Nanchang Zhongwei Semiconductor Equipment Co., Ltd. (hereinafter referred to as "Nanchang Zhongwei"), a wholly-owned subsidiary of Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd. The purchase order for 52-cavity Prismo Unimax ® MOCVD equipment of Jiangxi Zhaochi Semiconductor Co., Ltd. has been successfully held in Nanchang High-tech Zone. Gu Wei, Chairman of Shenzhen Zhaochi Co., Ltd., Jin Conglong, President of Jiangxi Zhaochi Semiconductor Co., Ltd., Dr. Yin Zhiyao, Chairman and General Manager of Zhongwei Company, Ji Hua, Vice President of Zhongwei Company and General Manager of Nanchang Zhongwei attended the meeting. signing ceremony. Leaders and guests such as Member of the Standing Committee of Jiangxi Provincial Party Committee, Secretary of Nanchang Municipal Party Committee Li Hongjun, and Mayor of Nanchang Wan Guangming attended and witnessed the signing.
It is a MOCVD equipment for high-performance Mini-LED mass production released by China Microelectronics in June 2021. The equipment can be equipped with up to 4 reaction chambers in the same system, and is equipped with an innovative multi-zone temperature compensation heating system. , with excellent wavelength uniformity, repeatability and stability. Its optimally designed sprinkler head achieves better uniformity and output stability, and the extra-large diameter graphite tray can greatly increase customer productivity and reduce costs. Through the optimization of the wafer arrangement on the graphite disk, the processing capacity of Prismo UniMax ® can be extended to grow 164 4-inch or 72 6-inch wafers, which is industry-leading.



At present, the public has put forward higher requirements for display image quality. Compared with traditional display technology, Mini LED technology has more advantages in terms of resolution, contrast, brightness and thermal stability, and is the most promising in the industry. One of the next generation display devices. Prismo UniMax ® , as the latest product of the Prismo series MOCVD equipment of Zhongwei Company, can not only meet the strict technical requirements of Mini LED, but also help customers to create display products more in line with market expectations with higher cost performance and production capacity.

Too Good To Be True?

A.Man said:

Too Good To Be True?

Click to expand...

We are at least 10 years out if not 20 for graphene IC to replace Silcon based IC.

Graphene has some attractive properties as a material but there’s a lot of limitations limiting industrialization of graphene for semiconductor IC.

IBM had built a small graphene IC almost a decade ago. But this is still more something that’s being investigated in a research lab than something you’d expect in production.

Over 60, the first batch of "whitelists" for Shanghai IC key enterprises to resume work announced​

A.Man said:

Too Good To Be True?

Click to expand...

graphene cannot replace silicon as a material for ICs. it isn't even a semiconductor, it is a semimetal. and being a semiconductor is simply a prerequisite for ICs, but not sufficient. See GaAs.

FairAndUnbiased said:

graphene cannot replace silicon as a material for ICs. it isn't even a semiconductor, it is a semimetal. and being a semiconductor is simply a prerequisite for ICs, but not sufficient. See GaAs.

Click to expand...

Graphene has zero band gap, but people are researching on how to change its property so it could be used in IC to replace Si

the most likely first use case in IC is to replace copper with graphene for the metal layers. But even this application is not ready to be industrialized yet. I don’t see this on the industry’s roadmap for the next two to three generation yet. No known WFE company are currently building systems to support it either.

@gelgoog bro from @Oldschool, IF the report is true a single unit of SMEE SSA800 DUVL will be purchase in late 2024 to familiarized themselves because by that date the Chinese are able to mass produce the machine. JV with Chinese company or an Investment by either SMIC or Huawei may hasten the mass production date, 2030 seems like a conservation projection. 2028 FOR ME is more realistic number.

Russia's microelectronics industry package support plan submitted to the government for deliberation​

1930

Source: Aijiwei
#Russia#
#28nm#

7 hours ago


According to the Russian "Kommersant" report, a microelectronics industry support plan with a total amount of 3.19 trillion rubles has been submitted to the Russian government for consideration. The plan is that the Ministry of Industry and Trade began to organize 22 experts in February this year. It is planned to achieve mass production of domestic chips with the same performance as the A7 processor on the iPhone 5S in 2030.

The draft obtained by the newspaper shows that the government will launch alternative solutions for product manufacturing within the year, realize the complete transfer of orders to Russian and Chinese suppliers by 2024, and achieve complete domestic substitution by 2030.

In terms of manufacturing capacity, Russia aims to achieve mass production of 28nm process integrated circuits in 2030, and will promote the number of chip design companies in Russia to increase from 70 to 300 by 2030.

In addition, the support plan also plans supporting measures and goals in terms of downstream product subsidies and professional personnel training. (Proofreading/Lechuan)

Oldschool​

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集微网，成立于2008年，经过近十年的发展，目前已经成为国内最知名的集成电路及手机行业门户网站。权威报道行业资讯，重点介绍行业领军人物、前沿技术、行业现状及未来趋势。

Russia plans to transition all semiconductor components to China and domestic in 2024 and fully domestic at 28nm by 2030.

ansy1968 said:

@gelgoog bro from @Oldschool, IF the report is true a single unit of SMEE SSA800 DUVL will be purchase in late 2024 to familiarized themselves because by that date the Chinese are able to mass produce the machine. JV with Chinese company or an Investment by either SMIC or Huawei may hasten the mass production date, 2030 seems like a conservation projection. 2028 FOR ME is more realistic number.

Russia's microelectronics industry package support plan submitted to the government for deliberation​

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

1930

Source: Aijiwei
#Russia#
#28nm#

7 hours ago

According to the Russian "Kommersant" report, a microelectronics industry support plan with a total amount of 3.19 trillion rubles has been submitted to the Russian government for consideration. The plan is that the Ministry of Industry and Trade began to organize 22 experts in February this year. It is planned to achieve mass production of domestic chips with the same performance as the A7 processor on the iPhone 5S in 2030.

The draft obtained by the newspaper shows that the government will launch alternative solutions for product manufacturing within the year, realize the complete transfer of orders to Russian and Chinese suppliers by 2024, and achieve complete domestic substitution by 2030.

In terms of manufacturing capacity, Russia aims to achieve mass production of 28nm process integrated circuits in 2030, and will promote the number of chip design companies in Russia to increase from 70 to 300 by 2030.

In addition, the support plan also plans supporting measures and goals in terms of downstream product subsidies and professional personnel training. (Proofreading/Lechuan)

Oldschool​

Junior Member​

Registered Member
45 minutes agoNew

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集微网，成立于2008年，经过近十年的发展，目前已经成为国内最知名的集成电路及手机行业门户网站。权威报道行业资讯，重点介绍行业领军人物、前沿技术、行业现状及未来趋势。

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Russia plans to transition all semiconductor components to China and domestic in 2024 and fully domestic at 28nm by 2030.

Click to expand...

where is the Kommersant source link?