Indeed. A lot of chips go into a basestation than a mobile phone: FPGA or ASIC, memory, converters (inverter, rectifier), power amplifiers, power management IC, RF, analog, RF filters, wireless communication, etc. chips. I'm sure I'm missing some additional chips in the list I provided.
Huawei has easy access to mostly all except their own designed ASIC chip which was on 14nm and/or 7nm.
@antiterror13 is correct that 28nm could be used, but I think Huawei/Hisilicon will have to spend more money to design their own 28nm ASIC or use general 28nm FPGA out on the market. It does look like Huawei is trying to come up with something specific and optimal to their needs through heterogeneous integration of multiple 28nm chips for when they run out of their stock of 14/7nm ASIC chips. Of course this method would not have the best power vs performance, which is an important KPI, but this should still be good enough in my opinion.
Another key enabler of 5G basestation is GaN power amplifier which has wider bandwidth and thermal performance. This is why China has been very big in promoting third generation compound semiconductor development in China. From what I've seen, China is leading or on-par with rest of the world on GaN & SiC chips manufacturing capability. So we are okay on this front.
So, ASIC chip and maybe transceiver switches are the only areas that
may hinder Huawei's long term dominance in 5G network.