Chinese semiconductor industry
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Where can you buy these Chinese gpu cards?
The wife says I am the dumbest person in the room. There is only two in the room. Guess that makes sense. But from time to time she likes to listen to some economic stuff.
That is what I always believed they meant, when CCP wanted 75% of chip production done inside China for what they need to use. If they were able to buy a bunch of ASML machines, then import the chemicals from Japan, and other raw materials from Russia, then hire a few engineers from Taiwan, that does not seem like what they want to accomplish, because if they did it that way, the CCP would make China IC be the like the UAE where everything comes from abroad.
If the J-20 is all domestic including the engines, the space program all domestic idea most of it now or soon, that is what Chinese IC will naturally gravitate to.
If people outside of China do not believe it, that is not China's problem.
The problem for China was this war between Russia and Ukraine. This geopolitical event, accelerates all timelines.
I think they were running full speed ahead anyway in terms of semiconductor development?
Sometimes being a late comer may have its advantages and here with LIU He being task to look for new materials, having an alternative for this harmful materials is a priority.
20 hours ago — The 3M plant in Zwijndrecht was closed on March 8 due to tightened Flemish environmental regulations, according to a report in Korean magazine ...
20 hours ago — The 3M plant in Zwijndrecht was closed on March 8 due to tightened Flemish environmental regulations, according to a report in Korean magazine ...
From @Oldschool , Sir thank you very much for your contribution, especially with news like this about the actual event happening inside China IC sector.
17 minutes agoNew
xw.qq.com
Under the background of "lack of cores" in the global automobile industry, in order to open up the blocking points of the upstream and downstream supporting cooperation of the integrated circuit industry chain, and promote the accelerated linkage of "cores" and "cars", on March 31, the Anhui Provincial Department of Economy and Information Technology was integrated in Hefei Jinghe. Circuit Co., Ltd. (hereinafter referred to as "Jinghe Integration") organized a special matchmaking meeting for "core" and "car" collaboration.
(Group photo at the matchmaking meeting)
(signing ceremony)
As the first 12-inch wafer foundry company in Anhui Province, Jinghe Integrated Circuit has officially started the foundry business of automotive-grade chips. Cai Huijia, general manager of Jinghe Integration, said that he hopes to cooperate with the industry chain for a win-win situation and realize the localization of automotive chips as soon as possible.
Start the foundry of automotive-grade chips, and integrate the multi-dimensional layout of wafers
In recent years, in order to alleviate the problem of "lack of cores" in the automotive industry and promote the localization of automotive chips, Jinghe Integrated Circuits has actively deployed the foundry business of automotive-grade chips.
Compared with consumer chips, automotive-grade chips need to consider issues such as safe driving of cars, so they have more stringent requirements and also test the production level and capabilities of foundry companies. Jinghe integrated foundry products are mainly used in consumer electronics fields such as mobile phones, laptops, TVs, etc., and entered the automotive market. How does Jinghe integrated plan to manufacture car-grade chip products?
Cai Huijia, general manager of Jinghe Integration, introduced,
"
In order to OEM automotive-grade chips, the company has set up a special vehicle-mounted team, covering quality, R&D, marketing and manufacturing. It has a complete and strict system promotion process and can provide complete services for the automotive industry chain.
"
At present, Jinghe Integrated Circuit has completed the AEC-Q100 certification of 110nm and 90nm display driver chips. At the same time, Jinghe Integrated Technology Co., Ltd. has cooperated with some high-quality customers to carry out the research and development of in-vehicle chips. As of the first quarter of 2022, it has achieved 110nm in-vehicle The console shows the mass production of the driver chip, the mass production of the 90nm vehicle monitoring image sensor chip, and the AMOLED LCD knob in the 90nm vehicle control area to display the tape out of the driver chip .
Looking forward to the future, Jinghe Integration will promote the development of the foundry business of automotive-grade chips from two dimensions: itself and the industry chain:
● Starting from itself, Jinghe will continue to promote the AEC-Q100 certification of 110nm microprocessor chips, 110nm power management chips, 90nm image sensor chips, and 55nm display driver chips in the future. At the same time, Jinghe will meet with more customers, Open more extensive cooperation in more vehicle chip fields, including touch display integrated vehicle chips, vehicle fingerprint recognition, vehicle microprocessors and vehicle power chips.
● In terms of industry chain, Jinghe Integration will make full use of its ability to promote the integration of resources from chip design, back-end packaging and testing, module solutions, vehicle manufacturing and automotive chip verification, with a view to building a local industrial ecosystem.
To meet the demand for automotive chips, Jinghe Integrated actively expands production
The automotive chip market is in short supply, and it is urgent for foundry companies to continuously release production capacity. Jinghe said to Global Semiconductor Watch that the demand for automotive chips continues to increase, and the foundry market has a bright future. The company is actively expanding production capacity to meet the needs of automotive chips and other markets .
It is expected that the company's automotive chips will reach 5,000 pieces per month by the end of 2022, and will grow exponentially every year after that. At the same time, Jinghe Integration will also sign framework agreements with OEMs, Tier1, panel factories, ODMs, and IC design companies to connect the entire supply chain and bind products and production capacity to each other.
By the end of 2021, the total production capacity of Jingheji will be 100,000 pieces/month, and the total designed production capacity will reach 320,000 pieces/month in the future . Jingheji can also provide more production capacity for vehicles .
Epilogue
In recent years, with the rapid development of the new energy vehicle and smart car market, the demand for automotive chips has increased significantly. However, the supply of the semiconductor industry continues to be tight. Under the "chip shortage", the localization of automotive chips has become a general trend of development.
Anhui is actively promoting the high-quality development of integrated circuits and the automotive industry. Under the "core" and "vehicle" synergy policy, as a leading wafer foundry company in Anhui, Jinghe Integrated Circuits has attracted much attention in the foundry business of automotive-grade chips. In the future, with abundant production capacity, a mature process platform and the concerted cooperation of all parties in the industry chain, Jinghe integrated automotive-grade chip foundry business is expected to help the local automotive industry's "chip shortage" situation and press "fast" for the localization of automotive chips. Enter key".
About
Development status of die-integration process
In addition to continuing to expand production capacity, Jinghe Integration is also planning more advanced manufacturing processes to meet the needs of future terminal applications such as mobile phones, automobiles, and smart homes.
At present, Jinghe Integration has achieved mass production of 150nm to 55nm process nodes. The company plans to develop more advanced processes such as 55/40/28nm and multiple product lines. Advanced process research and development projects include:
The rear-illuminated CMOS image sensor chip process platform research and development project (including 90nm and 55nm) will be based on the 90nm front-illuminated (FSI) CMOS image sensor process platform that has been mass-produced by Jinghe. The key development directions include devices, processes, performance, etc. In terms of; after the project is completed, it will have the technical ability to produce back-illuminated CMOS image sensor chips, and terminal applications include mobile phones, drones, monocular cameras, medium-format cameras, security monitoring, etc.;
Microcontroller chip process platform R&D projects (including 55nm and 40nm) are based on the microcontroller technology and R&D experience in the field of 110nm process nodes already owned by Jinghe Integration, and further develop 55nm and 40nm microcontroller technologies. After the completion of the R&D project , will have the technical ability to produce advanced microcontroller chips, terminal applications include automotive electronics, smart home, etc.;
40nm logic and HV process platform R&D project . At present, Jinghe Integration has completed the development of 55nm logic chip technology platform. In the future, based on this technology, 40nm logic and HV process platform will be developed. Terminal applications include Internet of Things, wireless logic transmission and OLED. driver chip;
The 28nm logic and HV process platform R&D project will further develop the 28nm logic platform and 28nm HV process platform on the basis of the completion of 40nm and other technologies in the future. After the completion of the R&D project, it will be able to produce 28nm logic chips, wireless logic chips and OLEDs. The technical capabilities of the panel driver chip, terminal applications include the Internet of Things, wireless logic transmission, high-end mobile phone screens, etc.
Oldschool
Junior Member
Registered Member17 minutes agoNew
汽车芯片国产化按下“快进键”，晶合集成开启车规级芯片代工,全球汽车产业“缺芯”背景下，为打通集成电路产业链上下游配套协作的堵点卡点，推动“芯”“车”加速联动，3月31日安徽省经信厅在合肥晶合集成电路股份有限公司（以下简称“晶合集成”）组织……
Press the "fast-forward button" for the localization of automotive chips, and Jinghe integrated to start the foundry of automotive-grade chips
Under the background of "lack of cores" in the global automobile industry, in order to open up the blocking points of the upstream and downstream supporting cooperation of the integrated circuit industry chain, and promote the accelerated linkage of "cores" and "cars", on March 31, the Anhui Provincial Department of Economy and Information Technology was integrated in Hefei Jinghe. Circuit Co., Ltd. (hereinafter referred to as "Jinghe Integration") organized a special matchmaking meeting for "core" and "car" collaboration.
(Group photo at the matchmaking meeting)
(signing ceremony)
As the first 12-inch wafer foundry company in Anhui Province, Jinghe Integrated Circuit has officially started the foundry business of automotive-grade chips. Cai Huijia, general manager of Jinghe Integration, said that he hopes to cooperate with the industry chain for a win-win situation and realize the localization of automotive chips as soon as possible.
Start the foundry of automotive-grade chips, and integrate the multi-dimensional layout of wafers
In recent years, in order to alleviate the problem of "lack of cores" in the automotive industry and promote the localization of automotive chips, Jinghe Integrated Circuits has actively deployed the foundry business of automotive-grade chips.
Compared with consumer chips, automotive-grade chips need to consider issues such as safe driving of cars, so they have more stringent requirements and also test the production level and capabilities of foundry companies. Jinghe integrated foundry products are mainly used in consumer electronics fields such as mobile phones, laptops, TVs, etc., and entered the automotive market. How does Jinghe integrated plan to manufacture car-grade chip products?
Cai Huijia, general manager of Jinghe Integration, introduced,
"
In order to OEM automotive-grade chips, the company has set up a special vehicle-mounted team, covering quality, R&D, marketing and manufacturing. It has a complete and strict system promotion process and can provide complete services for the automotive industry chain.
"
At present, Jinghe Integrated Circuit has completed the AEC-Q100 certification of 110nm and 90nm display driver chips. At the same time, Jinghe Integrated Technology Co., Ltd. has cooperated with some high-quality customers to carry out the research and development of in-vehicle chips. As of the first quarter of 2022, it has achieved 110nm in-vehicle The console shows the mass production of the driver chip, the mass production of the 90nm vehicle monitoring image sensor chip, and the AMOLED LCD knob in the 90nm vehicle control area to display the tape out of the driver chip .
Looking forward to the future, Jinghe Integration will promote the development of the foundry business of automotive-grade chips from two dimensions: itself and the industry chain:
● Starting from itself, Jinghe will continue to promote the AEC-Q100 certification of 110nm microprocessor chips, 110nm power management chips, 90nm image sensor chips, and 55nm display driver chips in the future. At the same time, Jinghe will meet with more customers, Open more extensive cooperation in more vehicle chip fields, including touch display integrated vehicle chips, vehicle fingerprint recognition, vehicle microprocessors and vehicle power chips.
● In terms of industry chain, Jinghe Integration will make full use of its ability to promote the integration of resources from chip design, back-end packaging and testing, module solutions, vehicle manufacturing and automotive chip verification, with a view to building a local industrial ecosystem.
To meet the demand for automotive chips, Jinghe Integrated actively expands production
The automotive chip market is in short supply, and it is urgent for foundry companies to continuously release production capacity. Jinghe said to Global Semiconductor Watch that the demand for automotive chips continues to increase, and the foundry market has a bright future. The company is actively expanding production capacity to meet the needs of automotive chips and other markets .
It is expected that the company's automotive chips will reach 5,000 pieces per month by the end of 2022, and will grow exponentially every year after that. At the same time, Jinghe Integration will also sign framework agreements with OEMs, Tier1, panel factories, ODMs, and IC design companies to connect the entire supply chain and bind products and production capacity to each other.
By the end of 2021, the total production capacity of Jingheji will be 100,000 pieces/month, and the total designed production capacity will reach 320,000 pieces/month in the future . Jingheji can also provide more production capacity for vehicles .
Epilogue
In recent years, with the rapid development of the new energy vehicle and smart car market, the demand for automotive chips has increased significantly. However, the supply of the semiconductor industry continues to be tight. Under the "chip shortage", the localization of automotive chips has become a general trend of development.
Anhui is actively promoting the high-quality development of integrated circuits and the automotive industry. Under the "core" and "vehicle" synergy policy, as a leading wafer foundry company in Anhui, Jinghe Integrated Circuits has attracted much attention in the foundry business of automotive-grade chips. In the future, with abundant production capacity, a mature process platform and the concerted cooperation of all parties in the industry chain, Jinghe integrated automotive-grade chip foundry business is expected to help the local automotive industry's "chip shortage" situation and press "fast" for the localization of automotive chips. Enter key".
About
Development status of die-integration process
In addition to continuing to expand production capacity, Jinghe Integration is also planning more advanced manufacturing processes to meet the needs of future terminal applications such as mobile phones, automobiles, and smart homes.
At present, Jinghe Integration has achieved mass production of 150nm to 55nm process nodes. The company plans to develop more advanced processes such as 55/40/28nm and multiple product lines. Advanced process research and development projects include:
The rear-illuminated CMOS image sensor chip process platform research and development project (including 90nm and 55nm) will be based on the 90nm front-illuminated (FSI) CMOS image sensor process platform that has been mass-produced by Jinghe. The key development directions include devices, processes, performance, etc. In terms of; after the project is completed, it will have the technical ability to produce back-illuminated CMOS image sensor chips, and terminal applications include mobile phones, drones, monocular cameras, medium-format cameras, security monitoring, etc.;
Microcontroller chip process platform R&D projects (including 55nm and 40nm) are based on the microcontroller technology and R&D experience in the field of 110nm process nodes already owned by Jinghe Integration, and further develop 55nm and 40nm microcontroller technologies. After the completion of the R&D project , will have the technical ability to produce advanced microcontroller chips, terminal applications include automotive electronics, smart home, etc.;
40nm logic and HV process platform R&D project . At present, Jinghe Integration has completed the development of 55nm logic chip technology platform. In the future, based on this technology, 40nm logic and HV process platform will be developed. Terminal applications include Internet of Things, wireless logic transmission and OLED. driver chip;
The 28nm logic and HV process platform R&D project will further develop the 28nm logic platform and 28nm HV process platform on the basis of the completion of 40nm and other technologies in the future. After the completion of the R&D project, it will be able to produce 28nm logic chips, wireless logic chips and OLEDs. The technical capabilities of the panel driver chip, terminal applications include the Internet of Things, wireless logic transmission, high-end mobile phone screens, etc.
And I may add regarding the info below, My speculation is that they have already ordered a SMEE SSA800 28nm DUVL and that machine maybe delivered next year after U-Precision had finished its new factory to expand its production of critical DUAL BENCH component for the DUVL.
The 28nm logic and HV process platform R&D project will further develop the 28nm logic platform and 28nm HV process platform on the basis of the completion of 40nm and other technologies in the future. After the completion of the R&D project, it will be able to produce 28nm logic chips, wireless logic chips and OLEDs. The technical capabilities of the panel driver chip, terminal applications include the Internet of Things, wireless logic transmission, high-end mobile phone screens, etc.
The 28nm logic and HV process platform R&D project will further develop the 28nm logic platform and 28nm HV process platform on the basis of the completion of 40nm and other technologies in the future. After the completion of the R&D project, it will be able to produce 28nm logic chips, wireless logic chips and OLEDs. The technical capabilities of the panel driver chip, terminal applications include the Internet of Things, wireless logic transmission, high-end mobile phone screens, etc.
This is pretty huge. The article claims this factory will now have production of 250,000 12 inch wafers per month. 40% of Samsung's V-NAND production. I confirmed this is the largest semi fab operated by Samsung outside South Korea and the second largest fab complex they operate overall.
This is an important contribution to Made in China 2025 initiative.
This is an important contribution to Made in China 2025 initiative.
This factory is also stated as a reason why S.Korea is reluctant to join the US-led semiconductor alliance. They are afraid that if they did so, China would retaliate on this fab
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