In the field of megasonic cleaning technology, Shengmei Shanghai has the competitive advantage of exclusive patented IP
According to the micronet news, on January 6, Shengmei Shanghai stated in an announcement that the company has unique competitive advantages compared with DNS, LAM, TEL, etc., and the company adopts a competitive strategy of differentiated technologies, especially in megasonic cleaning technology. In the field, the company has exclusive patented IP and has obvious competitive advantages. The company will also continue to increase investment in research and development, hoping to lead international manufacturers in the field of planar semiconductor cleaning, and in the field of three-dimensional structure cleaning in the future, Shengmei's IP technology hopes to do better than international manufacturers in advanced process nodes.
In the domestic semiconductor equipment market, the proportion of domestic shares is still very low. The cleaning field may be one of the segments with the highest proportion of localization, and the main contributor is also Shengmei. Shengmei said that it welcomes normal and healthy competition, and the company believes that healthy competition is conducive to the rapid development of the company and the industry. Some products of the company overlap with Northern Huachuang, but we are friends, such as cleaning and vertical furnace tube equipment. The company and Northern Huachuang have different priorities in the development of specific products. Our two companies mainly compete with two overseas equipment vendors. The current focus of our vertical furnace tube equipment is LPCVD, and the future focus is on vertical furnace tube ALD.
According to Shengmei Shanghai, in the field of cleaning equipment, compared with domestic and foreign competitors, Shengmei can almost fully cover it. Among them, SAPS, TEBO and Tahoe are the exclusive technologies of Shengmei globally. In addition to the supercritical CO2 drying technology and advanced IPA drying technology being developed by the company, Shengmei's products cover 90% of the cleaning equipment, and Shengmei has independent IP for all equipment. Shengmei invented the SAPS technology in 2008, which solved the uniformity problem of megasonic waves on the wafer surface; in 2015, invented the TEBO technology, which solved the problem of 3D graphics damage, and applied for 9 patents. In the future, logic devices will inevitably adopt 3D architecture after 3/2nm, and DRAM storage will also adopt 3D architecture. 3DNAND is already a 3D architecture. In this way, 3D cleaning in the future is a worldwide problem. The company’s megasonic technology plus the company’s ongoing development Supercritical drying and advanced IPA drying technology can provide the most ideal solution for future 3D cleaning and drying.
