Here is the translation from DeepSeek: "It's clear that SMIC is now encountering difficulties with its Front-End-of-Line (FEOL) and Middle-End-of-Line (MEOL) processes."
Chinese semiconductor thread II
- Thread starter vincent
- Start date
What does that mean?
The same crap money guys say without any evidence, just conjectures.
STOCHASTIC COOLING ENHANCED STEADY-STATE MICROBUNCHING.
Abstract:
In this paper, we propose to combine two promising research topics in accelerator physics, i.e., optical stochastic cooling (OSC) and steady-state microbunching (SSMB). Our study shows that such an OSC-SSMB storage ring with a circumference of 50 m and beam energy of several hundred MeVs using present technology can deliver kilowatt radiation at 100 nm wavelength. A more ambitious application of OSC in an SSMB ring can push the radiation wavelength to an even shorter wavelength, such as EUV and soft Xray. Such a powerful compact light source could benefit fundamental science research and industry applications
Breaking through the "purity barrier" of graphite by developing high-temperature purification equipment for SiC
Shanxi CETC Electronic Equipment Co., Ltd., a subsidiary of CETC Electronic Equipment Group Co., Ltd. under China Electronics Technology Group Corporation broke through the industry's traditional design and, in collaboration with leading equipment manufacturers, independently developed a continuous graphite purification process and equipment . Through a combination of tiered purification technologies, including physicochemical purification, low-temperature and high-temperature continuous purification, and ultra-high vacuum purification, the purity of graphite was increased from 95% to over 99.99995%.
After multiple tests and verifications, the equipment can now efficiently remove metallic and non-metallic impurities from graphite powder. The purity of the ultra-high purity graphite powder used for the synthesis of third-generation semiconductor SiC can be stably controlled below 0.5×10⁻⁶ , fully meeting the industry's stringent requirements for ultra-high purity graphite powder.
Shanxi CETC Electronic Equipment Co., Ltd., a subsidiary of CETC Electronic Equipment Group Co., Ltd. under China Electronics Technology Group Corporation broke through the industry's traditional design and, in collaboration with leading equipment manufacturers, independently developed a continuous graphite purification process and equipment . Through a combination of tiered purification technologies, including physicochemical purification, low-temperature and high-temperature continuous purification, and ultra-high vacuum purification, the purity of graphite was increased from 95% to over 99.99995%.
After multiple tests and verifications, the equipment can now efficiently remove metallic and non-metallic impurities from graphite powder. The purity of the ultra-high purity graphite powder used for the synthesis of third-generation semiconductor SiC can be stably controlled below 0.5×10⁻⁶ , fully meeting the industry's stringent requirements for ultra-high purity graphite powder.
Do you happen to know what is the current status of SSMB facility development in China? To my knowledge, Germany is currently the only country where laboratory SSMB experiments are being conducted. It is just somewhat disheartening to see that progress remains constrained by facilities.
Qinghe Epistar's proprietary thermo-press bonding solution helps achieve breakthroughs in the localization of CIS packaging.
Qinghe Epistar has successfully delivered its independently developed SAB6310 fully automated 12-inch thermo-press bonding machine to a leading domestic customer, marking a major milestone in the localization of CIS (Cadmium Indium Sulfide) chip packaging. This integration into a high-end production line represents the first practical application of domestically developed high-end bonding equipment in cutting-edge semiconductor packaging.
The SAB6310 addresses three critical challenges in CIS packaging:
- Ultra-high alignment accuracy (<1μm) ensures precise bonding, eliminating interface defects and boosting product yield.
- Precise temperature and pressure control protects sensitive components (like microlenses) during the bonding process, especially on large 12-inch wafers.
- Full automation (from loading to unloading via robotic arms) enhances production efficiency, consistency, and reduces human error.
With its integrated, closed-loop design, the machine overcomes limitations of traditional fragmented systems. It offers excellent material compatibility—supporting metals, glass, and various adhesives and is scalable beyond CIS, with potential applications in MEMS and Micro-LEDs. Its modular architecture supports future capacity expansion and mass production.
This achievement validates Qinghe Epistar’s technological leadership and competitiveness. Looking ahead, the company aims to become a global trusted partner in heterogeneous chip integration, offering end-to-end solutions for next-generation semiconductor manufacturing.
This achievement validates Qinghe Epistar’s technological leadership and competitiveness. Looking ahead, the company aims to become a global trusted partner in heterogeneous chip integration, offering end-to-end solutions for next-generation semiconductor manufacturing.