Chinese semiconductor thread II

[tokenanalyst]

Dinglong Technology, China leading supplier of CMP polishing pads, announced plans to expand its production capacity to 50,000 polishing pads per month by Q1 2026, increasing from its current annual capacity of ~500,000 pads (40,000/month). This expansion reflects strong demand driven by the booming semiconductor and OLED display industries.

With over a decade of experience, Dinglong offers a comprehensive product range covering hard and soft polishing pads for IC manufacturing and is expanding into large silicon wafers and compound semiconductors like silicon carbide. The company has achieved full self-reliance in core raw materials (e.g., abrasive particles) and is now the primary supplier for major domestic wafer foundries, with growing presence among foreign customers.​

The sales of key products like CMP polishing pads, slurries, cleaning solutions, and flexible display materials grew by over 50% year-on-year in H1–Q3 2025. This growth is attributed to high downstream capacity utilization and Dinglong’s ability to efficiently support new production lines.

In CMP slurries, the company has developed a full product lineup and now controls supply of key abrasives (e.g., cerium oxide), enabling customized solutions for customers. New slurry products using self-produced abrasives are being validated and will soon become major growth drivers.​

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[tokenanalyst]

 

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View attachment 163807

Incredible to think there still people who one may consider them "smart" who think China can't fabricate multi-layered mirrors.

 

[tokenanalyst]

Wafer alignment measurement in lithography systems based on vortex beam interference​

Abstract​

Overlay accuracy is a core performance metric for lithography systems. To achieve high overlay accuracy during integrated circuit manufacturing, high-performance wafer alignment is a critical enabling technology. Developing rapid and high-precision wafer alignment techniques is therefore of paramount importance. While alignment schemes based on phase grating can achieve high-precision alignment measurement, as demonstrated by ASML’s series of alignment technologies that meet the requirements for immersion, EUV, and even high-NA EUV lithography, this paper proposes an alternative optical measurement scheme based on vortex beam interferometry for high-precision wafer alignment. The approach converts the ±1st diffraction orders from a grating into vortex beams with opposite topological charges. The lateral displacement of the grating is linearly transduced into the rotation of a resulting petal-like interference pattern. We established a theoretical model for this displacement-to-angle conversion and experimentally validated its performance. Under simple laboratory conditions, the measured displacement showed a coefficient of determination (R2) exceeding 0.999 for a linear fit over a 1 μm range, and a measurement repeatability (standard deviation) better than 1.8 nm. This work offers a precise solution for real-time position sensing with significant potential for DUV and EUV lithography wafer alignment.

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[tokenanalyst]

Prediction of scattering caused by fabrication errors in micro-field EUVL projection optics​

Abstract​

Fabrication errors refer to the deviation of the actual manufactured surface shape of optical components from the designed specification, leading to unwanted scattering. For precision optical systems with stringent image quality requirements, such as the micro-field extreme ultraviolet lithography (EUVL) projection optics based on synchrotron radiation sources, strict control of fabrication errors throughout the entire spatial frequency range is necessary. The fabrication errors, particularly mid-spatial-frequency errors that cause flare, can degrade the system's imaging resolution. Consequently, it is necessary to assess the influence of fabrication errors on the performance of optics during the design phase to anticipate the imaging resolution. The influence of fabrication errors on imaging and the calculation of scattering will be presented.​

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[tphuang]

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核芯互联/Hexin (

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) who is developing high speed ADC/DAC chips has unveiled CLG9501, a ultra-low jitter programmable crystal oscillator. It is an advanced programmable clock chip based on PLL architecture.

It ensures minimal signal distortion and bit error rate in ultra high speed data transmission application such as 400G/800G. To be used in OTN (optical transmission network), optical modules and data centers.

looks like your usual suspect of Renesas, , TI and ADT are the competitors in the Phase lock loop (PLL) crystal oscillator space

not sure where rest of China's chip designers are on this. Seems like analog chips is something they've always been weak in.

 

[tokenanalyst]

BOE: 8.6-generation OLED project expected to have its first power-on in December.​

On November 3, BOE Technology Group Co., Ltd. (000725) released its investor relations activity report. In the report, BOE discussed the development and future trends of the display industry, summarized the company's operating performance, and responded to investor questions regarding the LCD/OLED field, capital expenditure plans, technology layout, and future outlook. BOE believes that global shipments of LCD and OLED are still expected to grow this year, but overall supply will exceed demand, and market growth will slow down. The replacement cycle in 2026, AI applications, and the World Cup will drive demand, and supply and demand are expected to reach equilibrium in 2027.​

BOE Technology Group Co., Ltd. (BOE A) also mentioned the progress of the B16 project. The Chengdu 8.6-generation line is progressing smoothly overall, with the first batch of core equipment moved in on May 20th this year, four months ahead of schedule. The first power-on is expected in December this year, with mass production targeted for the second half of next year. BOE A anticipates a decrease in future capital expenditures after B16 achieves mass production.

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[tokenanalyst]

Western Automakers worried about the Nexperia fallout while China automakers have pretty much secured their supply chain.​

Guoxin Technology's automotive electronic chip shipments exceed 20 million units.​

Guoxin Technology has achieved a significant milestone by surpassing 20 million cumulative shipments of automotive electronics chips—marking a major leap in China’s domestic semiconductor industry. The company's success reflects its sustained technological innovation and deep market penetration, especially in mid-to-high-end automotive electronics applications, where it provides reliable, domestically produced "Guoxin solutions" to support China’s national auto supply chain.

Core Technology Breakthroughs
​

1. 48V Mixed-Signal Chip Innovation​
   • Launched the industry’s first 48V airbag ignition chip (CCL1800B), filling a critical technological gap in new energy vehicle electrical architectures.​
   • Developed a scalable 48V mixed-signal design platform offering higher power handling, superior energy efficiency, and enhanced safety—enabling expansion into multiple high-value applications.​
2. CCFC3009PT RISC-V AI MCU Enters Tape-Out​
   • A cutting-edge high-end automotive AI MCU based on a 22nm RRAM process and RISC-V CRV6 multi-core architecture (6 main + 6 lockstep cores).​
   • Operates at 500MHz with over 10,000 DMIPS of pre-computing power.​
   • Features an integrated NPU for hardware-accelerated AI processing and supports in-memory computing—significantly lowering the barrier to AI integration in automotive systems.​
   • Performance rivals Infineon’s TC49X and Renesas’ U2B series, with superior cost-effectiveness.​
   • Applied in radar signal processing, battery management, motor control, and domain controllers for intelligent vehicles.​

Market Expansion & Client Coverage
Driven by China's "electrification, intelligence, and connectivity" transformation and national substitution policies, Guoxin has secured broad partnerships across the automotive value chain:​

• Vehicle Manufacturers: Supplying mainstream models to major OEMs including BYD, Chery, Geely, SAIC (SAIC-GM, SAIC-GM-Wuling), FAW, Dongfeng, Changan, Great Wall, BAIC, XPeng, Li Auto, Seres, GAC, JAC, King Long, and Hozon Auto.​
• Tier 1 Component Manufacturers: Maintaining strong collaborations with international and domestic suppliers such as Atech, Jingwei Hengrun, Kosda (Shanghai), BYD Technology, BYD Power, Yangtze Automotive Electronics, O-Film Intelligent, Yidingfeng, Ingenic, Aptiv, Songyuan Safety, Valeo, Weichai Power, AEOX, Wuhan Lingdian, Changzhou Yikong, and Kaisheng Power.​

From January to September 2025, automotive chip revenue reached RMB 79.98 million, a year-on-year increase of 73.52%, with strong progress in mass production and vehicle installation.

Application Scenario Breakthroughs
​

• Basic Control Scenarios: Achieved mass production in gateways, airbags, and instrument clusters. Over 4 million airbag MCUs and over 4 million automotive security chips have been installed. Instrument cluster and small node control chips are now supplied stably across major models.​
• High-End Intelligent Scenarios: Made key breakthroughs in domain control, drive-by-wire, powertrain, and airbag ignition:​
  • CCFC3007PT is being mass-produced for ZCU/body and VCU domains.​
  • CCL1600B powers airbag ignition systems.​
  • CCFC3008PT supports advanced chassis control; communication chip CIP4100B tested in drive-by-wire systems.​
  • Acoustic DSP chips deployed in smart cockpits.
    These solutions are gradually breaking the foreign monopoly in high-end automotive electronics.​

"MCU+" Solution Ecosystem: Value Creation & Cost Reduction
Guoxin moves beyond single-chip supply by offering integrated, system-level "MCU+X" solutions that reduce BOM costs and development complexity:

1. Domain Controller: CCFC3007BC (PowerPC architecture) with ASIL-D certification, supports OTA upgrades, multi-interface integration (CAN/LIN/Ethernet), and national cryptographic security.
2. Airbag Solution: Fully domestic "MCU + Ignition Driver + Accelerometer" chipset covering all vehicle types—providing full control over ignition circuits and collision data recording; breaks foreign monopoly.
3. Drive-by-Wire Chassis:
   • Brake-by-wire: CCFC3010PT (ASIL-D) + CCL2200B (14-channel driver) for high-precision braking control.
   • Steer-by-wire: CCFC3008PC with fail-safe and redundancy features, suitable for EHB/SBW systems.
4. In-Vehicle Audio: CCD5001-based solution supporting active noise cancellation, sound field optimization, and speed-sensitive volume adjustment—mass production launched in March 2025.
5. Powertrain Solutions:
   • Gasoline: Precise fuel/ignition control via CCFC2017BC/CCFC3007PT.
   • New Energy: Multi-motor integration with VCU/MCU fusion, energy recovery management—reducing hardware modules and boosting efficiency.
6. BMS for EVs: CCFC3008PC-based solution offering real-time cell monitoring, dynamic balancing, thermal protection, and OTA upgrades—passed PV testing and in mass production.
7. Information Security: CCM4202S chip (EAL5+, national crypto level 2) supports international (RSA/AES) and national (SM2/SM3/SM4) algorithms—resists attacks and integrates into smart cockpits, T-BOX, and C-V2X.

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[tokenanalyst]

Jingce Electronics : Significant increase in orders.​

Mass testing equipment is ramping up production, and the company is expanding into back-end testing equipment. The company's main products in the semiconductor field are divided into front-end and back-end testing equipment, including film thickness measurement systems, optical critical dimension measurement systems, electron beam defect detection systems, semiconductor silicon wafer stress measurement equipment, bright-field optical defect detection equipment, and automated inspection equipment (ATE). Currently, some of the company's main products in the semiconductor front-end measurement field, such as film thickness series products, OCD equipment, and electron beam equipment, have completed delivery and acceptance for 7nm advanced processes. Products for more advanced processes are currently being validated. Bright-field defect detection equipment for advanced process nodes has been delivered, and the mass testing business is entering a ramp-up phase.

Revenue in Q3 of 2025 reached 270 million yuan, a year-on-year increase of 48.7%. In terms of orders, as of October 28, 2025, the company had orders on hand of RMB 1.79 billion, compared to RMB 1.69 billion in the same period last year, representing a 6% increase.

The company's subsidiary, Wuhan Jinghong, primarily focuses on the field of automated test equipment (ATE) (its main products are memory chip testing equipment). Its burn-in product line has secured repeat orders from leading domestic customers, and its CP/FT product line has received and delivered corresponding orders. In the field of wafer appearance inspection equipment, the company initiated wafer-level product projects in 2019 and has successfully launched the W1200 series and WST1200 series products, delivering them to leading packaging and testing customers. Furthermore, the company's independently developed probe card product series has also achieved mass production.

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