On October 13, Tianyue Advanced, the first A+H listed company in the field of silicon carbide substrates, held a 2025 semi-annual performance briefing.
At the performance meeting, investors asked a lot of questions about core issues such as 12-inch production capacity planning, progress of cooperation with Nvidia in advanced packaging, and path to profit improvement. Tianyue Advanced Chairman Zong Yanmin, Secretary to the Board Zhong Wenqing, Chief Financial Officer You Ying and other executives responded one by one.
12-inch production capacity planning remains a mystery
As an important future direction for the industry, the company's 12-inch silicon carbide substrate production capacity layout and customer introduction are the most concerned focuses of this shareholders' meeting.
Previous market news showed that Nvidia plans to replace the intermediate substrate material of CoWoS advanced packaging from silicon to silicon carbide by 2027. The H100 replacement alone will correspond to a demand for nearly 77,000 substrates. As a leading domestic 12-inch technology company, Tianyue Advanced has attracted much attention for its related potential opportunities.
At the earnings conference, in response to investors' questions about Tianyue Advanced's 12-inch production capacity planning timeline, the company's secretary, Zhong Wenqing, simply stated, "The company is a leading domestic player in both technology R&D and customer acquisition for 12-inch silicon carbide substrates. We will actively promote the construction of related production capacity in the future based on market demand."
Later, when introducing the company's introduction of 12-inch product market,
Zhong Wenqing introduced that the company has now released a full range of 12-inch silicon carbide product matrix, including 12-inch conductive silicon carbide substrates, 12-inch semi-insulating silicon carbide substrates and 12-inch P-type silicon carbide substrates. It is currently actively connecting with downstream customers and has obtained multiple 12-inch SiC product orders from relevant global leading customers.
Chairman Zong Yanmin further added that the second phase of the Shanghai Lingang base expansion will focus on 12-inch products, but did not specify the scale of production capacity or the status of the partnership. Regarding the key question of whether it can meet 10% of NVIDIA's high-end GPU market demand by 2027, he responded, "We have already made forward-looking technological arrangements and will seize market opportunities."
It is worth noting that Tianyue Advanced mentioned in its Hong Kong stock prospectus that "production capacity will be increased by approximately 500,000 pieces by the end of 2027", and the Phase II expansion of the Lingang base is an important part of this goal.
At the earnings conference, some investors inquired about the specific production capacity targets and current progress of the second phase of expansion. The company stated, "Progress is proceeding as planned, and specific figures will be disclosed in a subsequent announcement." Furthermore, the company did not explain the proportion of 12-inch products within the total 500,000-piece production capacity, nor did it specify when the second phase of expansion would reach full capacity.