Chinese semiconductor thread II

[tokenanalyst]

Jingsheng Electromechanical signed a strategic cooperation agreement with Zhejiang University and Zhejiang Chuangxin to develop integrated circuit industry​

Jingsheng Electromechanical, Zhejiang University School of Integrated Circuits, and Zhejiang Chuangxin Integrated Circuit Co., Ltd. (referred to as "Zhejiang Chuangxin") officially signed a strategic cooperation framework agreement to jointly build the "Advanced Integrated Circuit Equipment and Technology Joint R&D Center" and the "Integrated Circuit Talent Training and Technology Innovation School-Enterprise Collaborative Center". The three parties are committed to accelerating the R&D breakthroughs of new technologies and new products in the field of integrated circuit equipment and manufacturing through the deep integration of industry, academia and research, and providing scientific and technological and talent support for the healthy and rapid development of my country's integrated circuit industry.

According to the agreement, the three parties will carry out joint research and development around 12-inch silicon epitaxial equipment and process development, establish a high-level talent introduction and cultivation mechanism, promote the deep integration of teaching practice and scientific research internship, and boost the high-quality development of the integrated circuit equipment industry. At the same time, they will actively organize experts to carry out joint research in the fields of semiconductor equipment, materials, etc., provide forward-looking and key suggestions for industrial development, and jointly promote the healthy and sustainable development of the upstream and downstream ecological fields of integrated circuits.

It is understood that this strategic cooperation will give full play to the industrialization advantages of Jingsheng Electromechanical, the scientific research and innovation advantages of Zhejiang University and the platform transformation advantages of Zhejiang Chuangxin, build an innovation closed loop of "basic research-technical breakthroughs-results transformation-industrial application", accelerate the breakthrough of key technical bottlenecks in the field of integrated circuit equipment, cultivate compound industrial talents, and realize the coordinated development of innovation chain, industrial chain and talent chain, which is of great significance to enhancing the core competitiveness of my country's integrated circuit industry.

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[tokenanalyst]

Si-Tech: Plans to invest RMB 12 million to increase investment in Huarui Core Materials to enter the semiconductor photoresist field.​

According to a report by Cailianshe on June 26, Sitech announced that the company plans to increase the capital of Huarui Core Materials with its own funds of 12 million yuan. After the capital increase, the company directly holds 3.75% of its equity. Huarui Core Materials is a research and development enterprise focusing on key microelectronic materials such as semiconductor photoresists and related supporting chemicals . The company is currently in the pilot and industrial operation stage. It has built a photoresist R&D test and pilot platform, equipped with corresponding testing and inspection equipment, and has built a series of core intellectual property pools.

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[tokenanalyst]

Shenzhen's integrated circuit industry scale exceeds 280 billion yuan.​

Recently, the Shenzhen Semiconductor Industry Association officially released the "Shenzhen Integrated Circuit Industry Development Report".
The report shows that as of the end of 2024, the total number of integrated circuit companies in Shenzhen reached 727, and the annual industry revenue exceeded 283.96 billion yuan, a year-on-year increase of 32.9%, which is significantly better than the national average.
Among them, there are 456 design companies, 8 manufacturing companies, 82 packaging and testing companies, 133 equipment and parts companies, and 48 material companies.
Shenzhen previously released the "Shenzhen Action Plan for Cultivating and Developing Semiconductor and Integrated Circuit Industry Clusters (2023-2025)", proposing to build a spatial layout of "silicon-based in the east, compounds in the west, and design in the middle" for the entire city, with industry revenue exceeding 270 billion yuan by 2025; now Shenzhen has exceeded the target ahead of schedule.
Director Zhou Shengming introduced that Shenzhen's integrated circuit industry has formed a complete industrial chain covering design, manufacturing, packaging and testing, and equipment materials, with design being particularly prominent. In 2024, the design industry will account for 68% of the revenue share of all links in the industrial chain.
He also pointed out that the distribution characteristics of Shenzhen's leading integrated circuit backbone enterprises are distinct in various districts.
Among them, Nanshan District is the core industrial area, with the most prominent IC design industry . Longgang District has a good industrial foundation and a relatively complete industrial chain ; Futian District is the electronic components and integrated circuit product application distribution center and EDA key layout area; Pingshan District leads the city in wafer manufacturing and is committed to building the core engine of integrated circuit manufacturing in the Guangdong-Hong Kong-Macao Greater Bay Area; Baoan District has a relatively developed pan-semiconductor industry and has a certain foundation in semiconductor equipment and materials. In addition, Shenzhen is China's largest chip distribution center and application market.
In 2024, China imported about 70% of the global IC market and consumed 35% internally, of which more than 70% was distributed (domestic and foreign buyers) and applied in Shenzhen.
Director Zhou Shengming emphasized that the Guangdong-Hong Kong-Macao Greater Bay Area is building a semiconductor industry innovation community with a three-dimensional driving model of "basic research + technological iteration + industrial ecology" ; the Greater Bay Area should give full play to the leading role of chain-leading enterprises and achieve cross-domain technology integration through regional cluster development.
With the in-depth implementation of the "Bay Area Plan", Shenzhen is accelerating its progress towards becoming a global source of "AI+chips+scenario-based".

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[tokenanalyst]

Recognized again! Tianxin Micro's decompression epitaxial equipment won repeated orders from industry benchmark customers​

On June 24, 2025, Jiangsu Tianxin Micro Semiconductor Equipment Co., Ltd.'s core product Epi RP 300 Compass HP® decompression epitaxy equipment, with its excellent product performance, stable and reliable delivery performance and high-standard service quality, won repeat orders from industry benchmark customers! This is not only a high recognition of Tianxin Micro's product and technical strength by the market, but also a demonstration of Tianxin Micro's long-term focus on innovative achievements in the field of semiconductor equipment.



Tianxin Micro's decompression epitaxial equipment is a key equipment for advanced semiconductor processes, and its design has always focused on solving major challenges facing the industry. Through "efficient epitaxial process" and "precise thin film control" , the equipment not only significantly improves the yield rate of customer products and the electrical performance of devices , but also brings more value-added to customers. The equipment also adopts a number of innovative designs that are completely independently developed, and has made major breakthroughs in reliability and energy consumption. The failure rate has been greatly reduced, and the PM cycle has been extended, thereby significantly reducing the cost of single-wafer production. These advantages combined have enabled Tianxin Micro's decompression epitaxial equipment to occupy a leading position in the market and provide strong technical support for customers in the fierce industry competition.
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[tokenanalyst]

Intelligent diagnosis + AI dual-core empowers Guangli Micro YAD to run through the entire link yield diagnosis and analysis​

For a long time, yield has been regarded as the lifeline of chip manufacturers and wafer foundries. It is not only a key factor in cost control, but also the core driving force for improving production efficiency, increasing production capacity and enhancing market competitiveness.
With the increase in design and process complexity, chip yield issues under advanced processes are no longer limited to single-point defects, but present more systematic, multi-source, and cross-level complex characteristics. As a key entry point for structural testing, DFT still plays a fundamental role in discovering specific fault types. However, relying on the local diagnosis of the DFT tool itself, it is often difficult to effectively identify complex failure modes caused by manufacturing deviations, layout hotspots, test boundary effects, etc.
To achieve more efficient yield improvement, the industry is increasingly turning to cross-domain data analysis, that is, to correlate DFT test data with chip manufacturing process data (such as layout, process monitoring, and packaging and testing results). However, in the traditional analysis process, design and manufacturing data are scattered and the systems are not interoperable, resulting in low efficiency and extended cycles for engineers in root cause tracing and result verification.

Guangliwei YAD yield perception big data diagnostic analysis platform was born to solve this pain point. Guangliwei YAD not only supports the intelligent analysis of mainstream DFT tool diagnostic reports , but also can be deeply integrated with Guangliwei DATAEXP big data analysis platform, linking DATAEXP-YMS (yield management system), and linking cross-domain data streams such as chip design rules, manufacturing process parameters, online test (WAT/CP) data, and failure physical analysis (PFA) results in real time, building a diagnostic map covering the entire link of "design-manufacturing-testing-analysis" , freeing engineers from tedious data comparison and focusing on high-value yield optimization decisions.
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Customer Value
YAD fully meets the needs of product and test engineering teams. With the help of big data-driven intelligent diagnosis engine, it runs through the entire process of design, test diagnosis and process monitoring, improving traceability efficiency and root cause location accuracy . YAD has been verified in the actual cases of multiple customers and has been highly recognized, bringing significant value to semiconductor design and manufacturing companies:
1. Improve analysis efficiency
Powerful graphical interface and reporting functions, combined with graphical operation and full-process analysis solutions, quickly improve yield analysis efficiency from weeks to hours.
2. Improve the accuracy of root cause analysis
Through AI algorithms combined with full-process data, RCA analysis is performed to identify the root causes of failures with high precision and multiple dimensions, automatically recommend PFA candidates, and improve the accuracy of root cause analysis.
3. Identify hidden systemic design problems
Incorporate design information for diagnostic yield analysis and identify potential systemic design issues in advance through data mining.
4. Multi-dimensional data analysis and verification
Deeply interconnected with YMS, the analysis data is dynamically adjusted in multiple dimensions to screen the diagnostic analysis scope, and the root causes of yield failure are mutually verified through multi-dimensional data.
5. Highly intelligent automation
By building a fully automated analysis process system, human intervention can be minimized and systematic data management can be carried out.

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[tokenanalyst]

Huahai Qingke's first phase investment is no more than 500 million yuan to expand the wafer recycling and production expansion project​

Huahai Qingke issued an announcement stating that the company plans to build a wafer regeneration expansion project in Kunshan City, Jiangsu Province. The planned expansion capacity is 400,000 pieces/month, of which the first phase of construction capacity is 200,000 pieces/month, and the initial investment is expected to be no more than 500 million yuan.

Wafer regeneration refers to the recycling of control and baffle plates used by integrated circuit manufacturers in the process of manufacturing chips, removing impurities such as process films and metal particle residues, and making them meet the standards for reuse. Huahai Qingke relies on its own chemical mechanical polishing (CMP) equipment and cleaning equipment, and actively expands its wafer regeneration business in response to the wafer regeneration needs of control and baffle plates in downstream customers' production lines. It has now become a professional wafer regeneration foundry with Fab equipment and process technology services. The current wafer regeneration capacity has reached about 200,000 pieces/month. In recent years, it has obtained batch orders from many large production lines and has been supplying them stably for a long time. With the accelerated expansion of domestic 12-inch wafer factories, the process requirements for new production lines are getting higher and higher, and the corresponding demand for control and baffle plates and test plates has increased sharply. The company needs to further improve its wafer regeneration processing capabilities in order to better respond to customer needs.



At the same time, Huahai Qingke's advanced technological advantages CMP and cleaning are the core of the wafer regeneration process. By adopting advanced CMP grinding methods, the number of recycling times of recycled wafers has been greatly improved, which has been highly recognized by customers. It has stronger competitiveness in advanced process wafer regeneration services and has obtained orders from many large key customers.

Huahai Qingke said that the wafer regeneration process mainly involves film removal, rough polishing, fine polishing, cleaning, and testing of the control block to make its surface flat and free of residual particles. In the wafer regeneration process, the main rough polishing, fine polishing, and cleaning are completed by the company's CMP equipment and cleaning equipment. CMP and cleaning technology are the core of the wafer regeneration process; at the same time, CMP equipment and cleaning equipment are also the equipment with the largest capital investment in the wafer regeneration process production line. The company can reduce capital investment through customized equipment.​

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[tokenanalyst]

Xiwei Technology completed a round B financing of hundreds of millions of yuan to accelerate the layout of the domestic mid-to-high-end Wi-Fi chip market​

Recently, Chongqing Xiwei Technology Co., Ltd. (hereinafter referred to as "Xiwei Technology"), a leading domestic high-performance data transmission Wi-Fi chip design company, successfully completed its B round of financing. This round of financing was led by Shanghai Fuhan Microelectronics Co., Ltd., and well-known investment institutions such as Shaoxing Keqiao Puhe Venture Capital Partnership (Limited Partnership) and Fuzhou Innovation and Technology Investment Partnership (Limited Partnership) participated in the investment, and received continuous support from old shareholder Hanlian Semiconductor Industry Fund, with a financing amount of several hundred million yuan.

The funds from this round of financing will be mainly used to promote the in-depth market expansion of domestic Wi-Fi 6 chips and the pre-research and technology reserves of the next-generation Wi-Fi 7 chips, accelerate the market layout of product portfolios covering Wi-Fi 6 and Wi-Fi 7, and work together to promote technological breakthroughs in domestic mid-to-high-end Wi-Fi chips, build new quality productivity, and reshape the domestic and international Wi-Fi industry chain ecology.

Currently, the Wi-Fi chip market is at a critical juncture of technological change and iteration. With the accelerated arrival of the Internet of Things and the Internet of Everything era, the demand for Wi-Fi 6/7 chips is strong. According to statistics, by 2025, Wi-Fi 6 chips are expected to account for more than 50% of the global Wi-Fi chip market, becoming a strategic high ground for competition in the chip field.
As a leader in the field of high-performance data transmission Wi-Fi chip design in China, Xiwei Technology has gathered a group of experienced core executives and senior R&D personnel from leading chip companies at home and abroad since its establishment in 2020. The company has been deeply engaged in the field of Wi-Fi 6/7 for a long time, accumulated many core technologies, and built a complete self-developed core IP system technology accumulation and system architecture. The 1x1 SWT6621 series and 2x2 SWT6652 series have been successfully mass-produced. Xiwei Technology's products have quickly gained high market recognition with their excellent performance and have been widely used in many application fields such as TVs, tablets, webcams, CPE, projectors, set-top boxes, etc. At the same time, the company adheres to the core IP self-development strategy, continues to innovate in technologies such as RF, baseband, protocol stack and SoC chip integration, and steadily launches high-performance and high-quality products to increase market penetration. It is committed to providing complete solutions for all-scenario communications such as smart home, smart medical care, smart security, smart education, smart transportation, and industrial Internet.

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[tokenanalyst]

Leidian Micropower: Developed low-cost, low-profile GaN components, some of which have been mass-produced​

On June 25, Leidian Micropower responded to investors' questions on the Shenzhen Stock Exchange Interactive Platform and stated that the company has developed low-cost, low-profile gallium nitride components, and some products have been mass-produced. As a wide-bandgap semiconductor material, the third-generation semiconductor gallium nitride has higher electron mobility and a wider energy band gap, and has obvious advantages in power, speed and efficiency. The research and development and application of gallium nitride components have laid an important foundation for the miniaturization, low cost and high efficiency development of the company's products.

In addition, in response to the question of whether the company's products can be used in fields such as low-altitude economy in addition to special fields, Leidian Micropower responded that two of the products listed in the company's prospectus have completed finalized batch production, and the remaining projects are still in different stages of development. The company continues to maintain its leading edge in the millimeter microwave system segment. With the development of related fields such as space-based Internet, low-altitude economy , and satellite communications, the millimeter wave microsystem industry is booming.

At present, while maintaining its advantages in the subdivided fields, the company has the technical reserves and system foundation for diversified development, and has accumulated key core technologies and capabilities in chip design, component module manufacturing, packaging technology, testing, etc. Thanks to the large bandwidth, high power, high reliability and other characteristics of related technologies, the company's products can be applied to related fields such as low-altitude economy .​

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[tokenanalyst]

Runxin Sensing domestic BAW filters.​

In recent years, Runxin Sensing, which has settled in Nanchang High-tech Zone in Jiangxi Province, is a MEMS wafer production line invested in by Nanchang High-tech Zone. It acts in a low-key and pragmatic manner, but has quietly grown into the main foundry with the largest annual shipments of domestic BAW filters.

According to the information, Runxin Perception was established in March 2022. The Runxin Perception MEMS Sensor Industrial Park project in Nanchang High-tech Zone with a total investment of 5 billion yuan was built in two phases. At present, it has quietly cultivated mass production skills for two years in the first phase. The core operation team of this production line originated from China Resources Microelectronics, a leading Chinese semiconductor company with nearly 20 years of experience in smart sensor manufacturing. This has allowed Runxin Perception to stand at a high starting point in the industry since its birth. China Resources Microelectronics' excellent manufacturing technology and strict quality control system have provided a solid foundation and inexhaustible power for the rapid development of Runxin Perception.

If the development of domestic BAW filters has long been trapped by the problem of "samples can be made, but mass production is uncontrollable", then the production line of Runxin Sensing is undoubtedly the breakthrough point for the first large-scale shipment of BAW products. More importantly, the products here are not only leading in production, but also truly "not inferior to overseas" in performance.

Strong alliance, BAW team warms up
It is understood that the BAW system produced by Runxin Perception is designed by Xinsheng Semiconductor , a cutting-edge company in the filter field. Relying on Runxin Perception's reliable MEMS manufacturing platform, the two parties have created the industry-leading D-BAW filter based on strategic cooperation, leading the "new model" of close collaboration between independent design and local manufacturing.

Supply chain sources indicate that the Runxin sensing production line has shipped more than 300 million Xinsheng D-BAW filters in the past year . The products have been in stable service in mainstream mobile phones and tablet terminal devices, and some models have also been used in many domestic and foreign high-end flagship mobile phones. In the current domestic BAW filter shipment ranking, Xinsheng's D-BAW ranks first with a significant share advantage, and its shipment scale far exceeds that of other market followers.
In terms of specific product performance, the D-BAW filter jointly developed by Runxin Sensing and Xinsheng has achieved comprehensive benchmarking against international advanced products. It uses Xinsheng's first SiRoof packaging solution for complete silicon cap + dry film organic bonding, which greatly enhances the durability and stability of the product. Taking the following figure as an example, it can be seen that in terms of passband insertion loss, Xinsheng D-BAW's product performance is highly close to international mainstream products. Especially at the center frequency of 2.690GHz, the insertion loss is as low as -0.923 dB, which is almost the same as the benchmark product; and in terms of out-of-band suppression, some frequency bands are even better than overseas solutions, especially in the far-away passband areas of 2GHz-3GHz and above 5GHz, reflecting better suppression capabilities.

It is worth emphasizing that these performance data are not from laboratory samples, but from mass-produced products that have undergone reliability testing at the Runxin Sensing Nanchang production line. This means that domestic BAW filters are no longer at the "technology demonstration" stage, but have actually entered the commercial landing stage of "controllable performance, stable quality, and customer verification."

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[tokenanalyst]

An Ultra-Precision Smoothing Polishing Model for Optical Surface Fabrication with Morphology Gradient Awareness.​

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Abstract​

To improve the surface morphology quality of ultra-precision optical components, particularly in the suppression of mid-spatial frequency (MSF) errors, this paper proposes a morphology gradient-aware spatiotemporal coupled smoothing model based on convolutional material removal. By introducing the Laplacian curvature into the surface evolution framework, a curvature-sensitive “peak-priority” mechanism is established to dynamically guide the local dwell time. A nonlinear spatiotemporal coupling equation is constructed, in which the dwell time is adaptively modulated by surface gradient magnitude, local curvature, and periodic fluctuation terms. The material removal process is modeled as the convolution of a spatially invariant removal function with a locally varying dwell time distribution. Moreover, analytical evolution expressions of PV, RMS, and PSD metrics are derived, enabling a quantitative assessment of smoothing performance. Simulation results and experimental validations demonstrate that the proposed model can significantly improve smoothing performance and enhance MSF error suppression.​

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