News on China's scientific and technological development.
- Thread starter Quickie
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Multipatterning isn’t just more expensive, it’s more complicated, slower, can hurt yields, and is also more prone to introducing delays in your process. That’s why EUV for smaller nodes is a really big deal.
Sometimes we need to reflect and understand the hard work and hardship SMIC had gone thru to develop their 14nm and 7nm tech.
The reason Intel failed in their 7nm & 10nm endeavor from Song Hong (PAKISTAN DEFENSE FORUM)
Intel fire Renduchintala, Chief Engineering Officer, while 7nm or even 10nm keep failing. When this guy came on board, he immediately hired 2 more Indians reporting to him. They were Raja Koduri and Randhir Thakur.
Other than engineering, Intel was infested by Indians everywhere.
The only place Intel can go is Chapter 11.
TSMC 5nm is already stable for production.
![[IMG]](https://newsroom.intel.com/wp-content/uploads/sites/11/2016/03/Murthy_Renduchintala_print_01-240x360.jpg "[IMG]")
Intel said Monday that Venkata “Murthy” Renduchintala, the chipmaker’s chief engineering officer and group president of its technology, systems architecture and client group, will resign on August 3.
Same case as when Singapore sign up CECA with India. The Indian executives come in with big talk and run companies into ground.
Hi hullopilllw,
Do you think Microsoft,Google and Nokia will also suffer the same fate, their CEO are all indian? And also I had seen a pattern of discrimination against EAST ASIAN in particular for high position job, the caucasian dont trust us or as our trait, we dont talk to much.
hi WTAN, Skywatcher and SuperDog
need your opinion on this article, and its usage
from cnTechPost
Chinese company develops new kind of lithography equipment
2020-07-28 19:22:02 GMT+8 | cnTechPost
0
SVG Group, a Chinese technology company, that it has launched industrial production of its iGrapher 3000, the world's first large-scale UV-3D direct lithography machine.
SVG Group is engaged in the design, development, and manufacture of micro- and nano-structured products and manufacturing equipment, as well as the provision of related technical research and development services.
The iGrapher3000 is mainly used for 3D lithography of micro-nano-structured topography on large substrates.
It is a new platform for the design, development, and manufacture of novel materials and advanced optoelectronic devices, and can be called the cornerstone equipment of the optoelectronic industry.
From planar lithography of integrated circuits to 3D lithography of "micro-structured topography" of optoelectronics, iGrapher3000 provides an advanced means for the design of novel materials and functional optoelectronic devices.
Below are photos of the iGrapher3000 UV 3D lithography rig (110" format, 2500mmx1500mm) and SEM photos of the micro-nano topography.
The iGrapher3000 has been installed in the iVTouch factory, where its first industrial application is a deep groove structured microcircuit mold of a large transparent conductive film.
It will also be used in the development and industrialization of large-area flat panel imaging, flexible conductive devices and holographic and 3D display applications.
According to SVG Group, Dr. Pu Donglin has led the research staff in the development of 3D lithography, nanolithography hardware and software, data processing algorithms, and precision control technology for more than a decade.
After several rounds of iterations, they have overcome major bottlenecks in 3D lithography and successfully developed a series of UV 3D direct lithography equipment, represented by the iGrapher3000, for industrial applications.
The iGrapher3000 is the first of its kind to enable continuous-plane microstructured large-area flat-panel devices on 110-inch glass substrates with depths ranging from 50nm to 20 microns.
It can be built to support 110" thick gluing process (2 microns to 25 microns) on photoresist board for subsequent industrial production of printing plates.
In the chip industry, there are two types of lithography machines: the first is projection lithography, which microscopes and lithographs photo masked graphics onto silicon wafers to prepare integrated circuit graphics.
It has a thinnest line width of 5nm, such as ASML extreme ultraviolet EUV projection lithography machine.
Japanese Nikon's i-series and Canon's FPA series of high-precision step projection lithography are also of this type.
The second type is Direct Writing Lithography, which is used for the preparation of the chip photomask at 0.25-micron node and above, and the partial photomask at 0.18-micron node and below.
The remaining node masks, prepared with electron beam lithography EBL, account for about 25%.
This includes American Applied Materials (AM) ALTA lithography.
In the display panel industry, Mycronic Sweden and Prexision 10 laser direct-write lithography system are used for 10th-generation line photomask preparation.
Nikon large projection scanning lithography (FX series) is used to scan and lithograph photomask graphics onto large size substrates to form TFT circuit graphics.
Therefore, in IC integrated circuits, display panels, etc., Direct Writing Lithography is used to prepare design data onto a photoresist substrate to become a photomask for back-channel projection lithography replication.
Both of the above two types of lithographs belong to the "flat pattern" lithographs, which are used in the thin-lithography process.
Both Direct Writing Lithography and Projection Lithography are key equipment in the integrated circuit and photonics industry. Direct Writing Lithography belongs to the source type key link, called Pattern Generator.
The iGrapher3000's "3D Topography" lithography belongs to the thick glue process.
It is mainly used for the preparation of optoelectronic materials and devices, the role is to prepare the design data onto a thick photoresist substrate, to become a three-dimensional shape of the nano printing plate, for a post-imprinting copy.
The iGrapher3000 is a powerful 3D lithography system that exposes the design data in a 3D navigational flight scan mode, creating a 3D microstructure in one scan.
It supports multi-format 2D and 3D model data files, lithography of hundreds of Tb data volume, and write speed greater than 3Gbps.
It has a fast lithography function with data processing/transfer/write synchronization.
It has an area of 110 inches, a lithography depth range of 50 nm to 20 microns, and a depth resolution of 10 nm.
Theoretically, the micro-nano structure topography has 5-dimensional controllable variables that support various optical fields and electromagnetic long modulation material and device design and fabrication.
As a comparison, for chip extreme ultraviolet projection lithography (EUV), pursuing extremely fine line widths (already up to 5 nm).
They are facing difficulties in extreme precision control and high yields (extreme ultraviolet light source, motion platform, and register accuracy), projection lithography for chips, microcopy of graphics with a photomask, and issues not involving massive data processing.
Direct write lithography (LDW) for photomask converts regular circuit graphics into photomask to form a display TFT photomask.
Unlike the thin-gel lithography process for integrated circuits, 3D lithography for the topography of micro-nano structures pursues topography and relative alignment accuracy (depending on the application).
The difficulty lies in massive data processing and transmission (hundreds of Tb), functional design of large area structures and advanced algorithms, and fidelity processes such as 3D lithography and 3D proximity compensation.
Its depth range: 50nm~20 microns, precision range: 1nm~100nm.
It can be seen that 3D lithography is significantly different from the previous 2D lithography in terms of function and use.
The iGrapher3000 opens up new channels for the research and industrial innovation of novel optoelectronic materials and functional devices.
It is mainly used for the fabrication of micro-nano topography and deep structures including large-size optoelectronic devices, super constructive surface materials, and functional optoelectronic devices.
This includes large-size transparent circuit graphics, high-precision flexible touch sensors, high-brightness projection screens, holographic 3D displays, MiniLED circuit backsplashes, high-brightness uniformity plates, virtual and real fusion photonic devices, and large-diameter transparent electromagnetic shielding materials.
The iGrapher 3000 is also used in the photomask fabrication for flat panel displays and flexible electronics and provides a strategic R&D resource for the design and fabrication of high-precision large-aperture thin-film lenses.
SVG's Lithography Equipment Division has a solid foundation in lithography technology and equipment and has developed a variety of lithography equipment such as the MiScan200 (8"~12") for MEMS chips, the MicroLab (4"~8") for MEMS chips, and the MicroLab (4"~8") for MEMS chips. ") and NanoCrystal (8"~32"), a nano-lithography device for super-surface, naked-eye 3D display, and optoelectronic device research.
need your opinion on this article, and its usage
from cnTechPost
Chinese company develops new kind of lithography equipment
2020-07-28 19:22:02 GMT+8 | cnTechPost
0
SVG Group, a Chinese technology company, that it has launched industrial production of its iGrapher 3000, the world's first large-scale UV-3D direct lithography machine.
SVG Group is engaged in the design, development, and manufacture of micro- and nano-structured products and manufacturing equipment, as well as the provision of related technical research and development services.
The iGrapher3000 is mainly used for 3D lithography of micro-nano-structured topography on large substrates.
It is a new platform for the design, development, and manufacture of novel materials and advanced optoelectronic devices, and can be called the cornerstone equipment of the optoelectronic industry.
From planar lithography of integrated circuits to 3D lithography of "micro-structured topography" of optoelectronics, iGrapher3000 provides an advanced means for the design of novel materials and functional optoelectronic devices.
Below are photos of the iGrapher3000 UV 3D lithography rig (110" format, 2500mmx1500mm) and SEM photos of the micro-nano topography.
The iGrapher3000 has been installed in the iVTouch factory, where its first industrial application is a deep groove structured microcircuit mold of a large transparent conductive film.
It will also be used in the development and industrialization of large-area flat panel imaging, flexible conductive devices and holographic and 3D display applications.
According to SVG Group, Dr. Pu Donglin has led the research staff in the development of 3D lithography, nanolithography hardware and software, data processing algorithms, and precision control technology for more than a decade.
After several rounds of iterations, they have overcome major bottlenecks in 3D lithography and successfully developed a series of UV 3D direct lithography equipment, represented by the iGrapher3000, for industrial applications.
The iGrapher3000 is the first of its kind to enable continuous-plane microstructured large-area flat-panel devices on 110-inch glass substrates with depths ranging from 50nm to 20 microns.
It can be built to support 110" thick gluing process (2 microns to 25 microns) on photoresist board for subsequent industrial production of printing plates.
In the chip industry, there are two types of lithography machines: the first is projection lithography, which microscopes and lithographs photo masked graphics onto silicon wafers to prepare integrated circuit graphics.
It has a thinnest line width of 5nm, such as ASML extreme ultraviolet EUV projection lithography machine.
Japanese Nikon's i-series and Canon's FPA series of high-precision step projection lithography are also of this type.
The second type is Direct Writing Lithography, which is used for the preparation of the chip photomask at 0.25-micron node and above, and the partial photomask at 0.18-micron node and below.
The remaining node masks, prepared with electron beam lithography EBL, account for about 25%.
This includes American Applied Materials (AM) ALTA lithography.
In the display panel industry, Mycronic Sweden and Prexision 10 laser direct-write lithography system are used for 10th-generation line photomask preparation.
Nikon large projection scanning lithography (FX series) is used to scan and lithograph photomask graphics onto large size substrates to form TFT circuit graphics.
Therefore, in IC integrated circuits, display panels, etc., Direct Writing Lithography is used to prepare design data onto a photoresist substrate to become a photomask for back-channel projection lithography replication.
Both of the above two types of lithographs belong to the "flat pattern" lithographs, which are used in the thin-lithography process.
Both Direct Writing Lithography and Projection Lithography are key equipment in the integrated circuit and photonics industry. Direct Writing Lithography belongs to the source type key link, called Pattern Generator.
The iGrapher3000's "3D Topography" lithography belongs to the thick glue process.
It is mainly used for the preparation of optoelectronic materials and devices, the role is to prepare the design data onto a thick photoresist substrate, to become a three-dimensional shape of the nano printing plate, for a post-imprinting copy.
The iGrapher3000 is a powerful 3D lithography system that exposes the design data in a 3D navigational flight scan mode, creating a 3D microstructure in one scan.
It supports multi-format 2D and 3D model data files, lithography of hundreds of Tb data volume, and write speed greater than 3Gbps.
It has a fast lithography function with data processing/transfer/write synchronization.
It has an area of 110 inches, a lithography depth range of 50 nm to 20 microns, and a depth resolution of 10 nm.
Theoretically, the micro-nano structure topography has 5-dimensional controllable variables that support various optical fields and electromagnetic long modulation material and device design and fabrication.
As a comparison, for chip extreme ultraviolet projection lithography (EUV), pursuing extremely fine line widths (already up to 5 nm).
They are facing difficulties in extreme precision control and high yields (extreme ultraviolet light source, motion platform, and register accuracy), projection lithography for chips, microcopy of graphics with a photomask, and issues not involving massive data processing.
Direct write lithography (LDW) for photomask converts regular circuit graphics into photomask to form a display TFT photomask.
Unlike the thin-gel lithography process for integrated circuits, 3D lithography for the topography of micro-nano structures pursues topography and relative alignment accuracy (depending on the application).
The difficulty lies in massive data processing and transmission (hundreds of Tb), functional design of large area structures and advanced algorithms, and fidelity processes such as 3D lithography and 3D proximity compensation.
Its depth range: 50nm~20 microns, precision range: 1nm~100nm.
It can be seen that 3D lithography is significantly different from the previous 2D lithography in terms of function and use.
The iGrapher3000 opens up new channels for the research and industrial innovation of novel optoelectronic materials and functional devices.
It is mainly used for the fabrication of micro-nano topography and deep structures including large-size optoelectronic devices, super constructive surface materials, and functional optoelectronic devices.
This includes large-size transparent circuit graphics, high-precision flexible touch sensors, high-brightness projection screens, holographic 3D displays, MiniLED circuit backsplashes, high-brightness uniformity plates, virtual and real fusion photonic devices, and large-diameter transparent electromagnetic shielding materials.
The iGrapher 3000 is also used in the photomask fabrication for flat panel displays and flexible electronics and provides a strategic R&D resource for the design and fabrication of high-precision large-aperture thin-film lenses.
SVG's Lithography Equipment Division has a solid foundation in lithography technology and equipment and has developed a variety of lithography equipment such as the MiScan200 (8"~12") for MEMS chips, the MicroLab (4"~8") for MEMS chips, and the MicroLab (4"~8") for MEMS chips. ") and NanoCrystal (8"~32"), a nano-lithography device for super-surface, naked-eye 3D display, and optoelectronic device research.
Skywatcher
Captain
It's for making flat panel displays, I believe.